JP2010109206A5 - - Google Patents

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Publication number
JP2010109206A5
JP2010109206A5 JP2008280713A JP2008280713A JP2010109206A5 JP 2010109206 A5 JP2010109206 A5 JP 2010109206A5 JP 2008280713 A JP2008280713 A JP 2008280713A JP 2008280713 A JP2008280713 A JP 2008280713A JP 2010109206 A5 JP2010109206 A5 JP 2010109206A5
Authority
JP
Japan
Prior art keywords
pad
wiring board
memory
electrode
long side
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2008280713A
Other languages
English (en)
Japanese (ja)
Other versions
JP4776675B2 (ja
JP2010109206A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2008280713A priority Critical patent/JP4776675B2/ja
Priority claimed from JP2008280713A external-priority patent/JP4776675B2/ja
Priority to US12/558,814 priority patent/US7855446B2/en
Publication of JP2010109206A publication Critical patent/JP2010109206A/ja
Priority to US12/939,210 priority patent/US8080868B2/en
Publication of JP2010109206A5 publication Critical patent/JP2010109206A5/ja
Application granted granted Critical
Publication of JP4776675B2 publication Critical patent/JP4776675B2/ja
Priority to US13/288,423 priority patent/US8288855B2/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2008280713A 2008-10-31 2008-10-31 半導体メモリカード Expired - Fee Related JP4776675B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2008280713A JP4776675B2 (ja) 2008-10-31 2008-10-31 半導体メモリカード
US12/558,814 US7855446B2 (en) 2008-10-31 2009-09-14 Semiconductor memory device and semiconductor memory card
US12/939,210 US8080868B2 (en) 2008-10-31 2010-11-04 Semiconductor memory device and semiconductor memory card
US13/288,423 US8288855B2 (en) 2008-10-31 2011-11-03 Semiconductor memory device and semiconductor memory card

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008280713A JP4776675B2 (ja) 2008-10-31 2008-10-31 半導体メモリカード

Publications (3)

Publication Number Publication Date
JP2010109206A JP2010109206A (ja) 2010-05-13
JP2010109206A5 true JP2010109206A5 (enExample) 2011-02-03
JP4776675B2 JP4776675B2 (ja) 2011-09-21

Family

ID=42130383

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008280713A Expired - Fee Related JP4776675B2 (ja) 2008-10-31 2008-10-31 半導体メモリカード

Country Status (2)

Country Link
US (3) US7855446B2 (enExample)
JP (1) JP4776675B2 (enExample)

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USD729251S1 (en) * 2014-06-27 2015-05-12 Samsung Electronics Co., Ltd. Memory card
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USD727911S1 (en) * 2014-06-27 2015-04-28 Samsung Electronics Co., Ltd. Memory card
USD736215S1 (en) * 2014-07-01 2015-08-11 Samsung Electronics Co., Ltd. Memory card
USD736212S1 (en) * 2014-07-01 2015-08-11 Samsung Electronics Co., Ltd. Memory card
USD736214S1 (en) * 2014-07-01 2015-08-11 Samsung Electronics Co., Ltd. Memory card
USD727910S1 (en) * 2014-07-02 2015-04-28 Samsung Electronics Co., Ltd. Memory card
USD864968S1 (en) 2015-04-30 2019-10-29 Echostar Technologies L.L.C. Smart card interface
USD773466S1 (en) * 2015-08-20 2016-12-06 Isaac S. Daniel Combined secure digital memory and subscriber identity module
USD798868S1 (en) * 2015-08-20 2017-10-03 Isaac S. Daniel Combined subscriber identification module and storage card
USD783621S1 (en) * 2015-08-25 2017-04-11 Samsung Electronics Co., Ltd. Memory card
USD783622S1 (en) * 2015-08-25 2017-04-11 Samsung Electronics Co., Ltd. Memory card
US11171114B2 (en) * 2015-12-02 2021-11-09 Intel Corporation Die stack with cascade and vertical connections
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KR102591697B1 (ko) * 2019-03-06 2023-10-20 에스케이하이닉스 주식회사 하이브리드 와이어 본딩 구조를 포함한 스택 패키지
JP2021089932A (ja) 2019-12-03 2021-06-10 キオクシア株式会社 半導体記憶装置
JP2021148653A (ja) * 2020-03-19 2021-09-27 キオクシア株式会社 半導体装置、検査用部品、および検査装置
US11309288B2 (en) * 2020-04-08 2022-04-19 Nanya Technology Corporation Electronic system, die assembly and device die
KR20220086309A (ko) * 2020-12-16 2022-06-23 에스케이하이닉스 주식회사 적층 반도체 칩을 포함하는 반도체 패키지
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KR102891519B1 (ko) * 2021-07-01 2025-11-25 삼성전자 주식회사 반도체 패키지

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JP2009164160A (ja) * 2007-12-28 2009-07-23 Panasonic Corp 半導体デバイス積層体および実装方法
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