JP2010278318A - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
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- JP2010278318A JP2010278318A JP2009130804A JP2009130804A JP2010278318A JP 2010278318 A JP2010278318 A JP 2010278318A JP 2009130804 A JP2009130804 A JP 2009130804A JP 2009130804 A JP2009130804 A JP 2009130804A JP 2010278318 A JP2010278318 A JP 2010278318A
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- pads
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Abstract
【解決手段】主面3aに複数のパッド21が形成されたマイコンチップ(半導体チップ)3が、主面3aを配線基板2の上面2aと対向させた状態で搭載される。上面2aには、複数の端子(ボンディングリード)11が形成されるパッド21は、他のパッド21とは異なる固有の電流が流れる複数の第1パッド21A、および複数のパッド21に共通する電流が流れる、または電流が流れない複数の第2パッド21Bからなる。第1パッド21Aの隣に第1パッド21Aまたは第2パッド21Bが配置され、複数の第1パッド22Aは、複数のバンプ(第1導電性部材)22Aを介して複数のボンディングリード11とそれぞれ電気的に接続され、複数の第2パッド21Bは、複数のバンプ(第2導電性部材)22Bを介して複数の端子11と接合されている。
【選択図】図7
Description
上面、前記上面とは反対側に位置する下面、前記上面に形成された複数のボンディングリード、および前記下面に形成された複数のランドを有する配線基板と、
四角形の外形形状を成す主面、前記主面の反対側に位置する裏面、および前記主面の各辺に沿って形成された複数のパッドを有し、前記主面を前記配線基板の上面と対向させた状態で前記配線基板上に搭載される半導体チップと、
前記半導体チップの前記複数のパッドと前記配線基板の前記複数のボンディングリードとをそれぞれ電気的に接続する複数の導電性部材と、を含み、
前記複数のパッドは、複数の第1パッドと、複数の第2パッドとを有し、
前記複数の第1パッドには、前記複数の第2パッドとは異なる固有の電流が流れ、
前記複数の第2パッドには、前記複数の第2パッドのうちの他の第2パッドに共通する電流が流れる、または電流が流れず、
前記複数の第1パッドのうちのある第1パッドの隣には、前記複数の第1パッドのうちの他の第1パッド、または前記複数の第2パッドのうちの1つが配置され、
前記複数の第1パッドは、前記複数の導電性部材のうちの第1導電性部材を介して前記複数のボンディングリードとそれぞれ電気的に接続され、
前記複数の第2パッドは、前記複数の導電性部材のうちの第2導電性部材を介して前記複数のボンディングリードと接合されているものである。
本願において、実施の態様の記載は、必要に応じて、便宜上複数のセクション等に分けて記載するが、特にそうでない旨明示した場合を除き、これらは相互に独立別個のものではなく、記載の前後を問わず、単一の例の各部分、一方が他方の一部詳細または一部または全部の変形例等である。また、原則として、同様の部分は繰り返しの説明を省略する。また、実施の態様における各構成要素は、特にそうでない旨明示した場合、理論的にその数に限定される場合および文脈から明らかにそうでない場合を除き、必須のものではない。
図1は本実施の形態の半導体装置の全体構造を示す断面図である。本実施の形態では、本願発明者が具体的に検討した半導体装置の例として、小型情報通信端末機器である携帯電話に搭載されるSIPについて説明する。
前記したように、SIP1では、マイコンチップ3のパッド21を配線基板2の端子11と、メモリチップ4のパッド4dを配線基板2の端子12と接続し、これらを配線基板2に形成された配線を介して接続することによりシステムを構成している。また、マイコンチップ3と外部機器との入出力は、端子11を配線基板2に形成された配線を介して下面2b側の外部端子であるランド13あるいは半田ボール14と接続することにより行う。
本実施の形態では、図4に示すようにマイコンチップ3の主面3aにおいてパッド21が複数列で配置されている。前記したフリップチップ実装を行う際のバンプ22の周辺温度の低下を防止するという観点からは、図4に示すように複数列で配置する方が、1列で配置するよりも好ましい。四角形の外形形状をなすパッド21を複数列で配置する場合、例えば、図4においては主面3aの外周側に配置される1列目のパッド21aの内側の辺と、パッド21aの内側に配置される2列目のパッド21bの外側の辺が対向して配置されることなる。また、各パッド21には、図6に示すように、バンプ22が配置され、パッド21と対向する位置に、表面に半田16が形成された端子11が配置される。このようにパッド21、バンプ22、半田16、および端子11を対向配置することにより、各パッド21に対応する接合部からの放熱経路を少なくすることができるので、温度低下を防止することができる。つまり、パッド21aとパッド21bにそれぞれ接続されるバンプ22および半田16、すなわち接合部の一方が他方の保温壁として機能する。
次に、単にパッド21aとパッド21bを規則的に2列で配置すると、配線基板2の上面2aにおける配線レイアウトに起因して隣り合う配線が短絡してしまう例について説明する。
次に図1に示すSIP1の製造方法について説明する。本実施の形態のSIP1の製造方法では、まず、配線基板を準備する。図15は、本実施の形態の配線基板準備工程において準備する配線基板の一部を拡大して示す要部拡大断面図である。
2 配線基板
2a 上面(表面、主面)
2b 下面(裏面)
2c チップ搭載領域
3 マイコンチップ(半導体チップ)
3a 主面
3b 裏面
3c 側面
3e コア回路形成領域
3f 入出力端子形成領域
3g 入出力回路(I/Oセル)
3 ベース基板(下段側配線基板、配線基板)
4、4A、4B メモリチップ(半導体チップ)
4a 主面
4b 裏面
4d パッド
5 ワイヤ(導電性部材)
6 封止体(封止樹脂)
11、11a、11b、11A、11B 端子(ボンディングリード)
11c ボンディング部
11d 引き出し配線
12 端子(ボンディングリード)
13 ランド
14 半田ボール(バンプ電極、外部端子)
15 アンダフィル樹脂(封止樹脂、封止体)
16、16A、16B 半田(導電性部材)
17a 配線
17b ビア
18 絶縁膜
21、21a、21b、21A、21B パッド(電極パッド)
22、22A、22B バンプ(導電性部材、突起電極)
22a ボール部
22b ワイヤ部
23 回路
23a 制御回路部
23b メモリ回路部
23c アナログ回路部
24、24a、24b 配線
25 半導体素子
25a アナログ回路素子
25b 保護ダイオード
35 マトリクス基板(多数個取り配線基板)
35a 製品形成領域
36 熱源
40 半導体装置
41 配線基板
Claims (17)
- 上面、前記上面とは反対側に位置する下面、前記上面に形成された複数のボンディングリード、および前記下面に形成された複数のランドを有する配線基板と、
四角形の外形形状を成す主面、前記主面の反対側に位置する裏面、および前記主面の各辺に沿って形成された複数のパッドを有し、前記主面を前記配線基板の上面と対向させた状態で前記配線基板上に搭載される半導体チップと、
前記半導体チップの前記複数のパッドと前記配線基板の前記複数のボンディングリードとをそれぞれ電気的に接続する複数の導電性部材と、を含み、
前記複数のパッドは、複数の第1パッドと、複数の第2パッドとを有し、
前記複数の第1パッドには、前記複数の第2パッドとは異なる固有の電流が流れ、
前記複数の第2パッドには、前記複数の第2パッドのうちの他の第2パッドに共通する電流が流れる、または電流が流れず、
前記複数の第1パッドのうちのある第1パッドの隣には、前記複数の第1パッドのうちの他の第1パッド、または前記複数の第2パッドのうちの1つが配置され、
前記複数の第1パッドは、前記複数の導電性部材のうちの第1導電性部材を介して前記複数のボンディングリードとそれぞれ電気的に接続され、
前記複数の第2パッドは、前記複数の導電性部材のうちの第2導電性部材を介して前記複数のボンディングリードと接合されていることを特徴とする半導体装置。 - 請求項1において、
前記第1導電性部材および前記第2導電性部材には、それぞれ半田が含まれ、前記複数のパッドそれぞれの表面に接合された複数の突起電極と、前記半田が接合することにより前記複数のパッドと前記複数のボンディングリードが接続されていることを特徴とする半導体装置。 - 請求項2において、
前記複数のパッドは、前記主面の周縁部の各辺に沿って、1列目パッドと、前記1列目パッドよりも前記主面の内側に形成された2列目パッドとを有し、
前記複数のボンディングリードは、前記1列目パッドと電気的に接続される1列目ボンディングリードと、前記1列目ボンディングリードよりも前記配線基板の上面の内側に形成され、前記2列目パッドと電気的に接続された2列目ボンディングリードとを有し、
前記1列目パッドのうち、前記第1パッドの内側には、前記2列目パッドが対向配置され、
前記2列目パッドのうち、前記第1パッドの外側には、前記1列目パッドが対向配置されていることを特徴とする半導体装置。 - 請求項3において、
前記半導体チップの前記主面は、
前記1列目パッドの中心が、2列目において配列される隣り合う前記2列目パッドの間の延長線上に位置するように千鳥状に前記1列目パッドおよび前記2列目パッドを配置する第1領域と、
前記1列目パッドと前記2列目パッドの対向する辺の中心を揃えて配置する第2領域と、を有していることを特徴とする半導体装置。 - 請求項4において、
前記半導体チップの前記主面には、アナログ回路素子を含む複数の半導体素子、および前記複数の半導体素子と前記複数のパッドをそれぞれ電気的に接続する複数の配線が形成され、
前記第2領域に配置される前記複数のパッドは、前記主面に形成された前記配線を介して前記アナログ回路素子に電気的に接続されていることを特徴とする半導体装置。 - 請求項5において、
前記半導体チップの前記主面に形成される前記配線は、絶縁層を介して積層される複数の配線層に形成され、
前記第2領域に配置される前記複数のパッドと、前記アナログ回路素子を電気的に接続する前記配線の配線経路は、
前記複数の配線層のうち、最表面に配置される配線層の配線経路距離が、下層に配置される配線層の配線経路距離よりも長いことを特徴とする半導体装置。 - 請求項6において、
前記最表面に配置される配線層に形成される配線は、前記下層の配線層に形成される配線と比較して、断面積が大きいことを特徴とする半導体装置。 - 請求項1において、
前記複数の第2パッドに流れる共通する電流は、電源電位または基準電位を供給する電流であることを特徴とする半導体装置。 - 上面、前記上面とは反対側に位置する下面、前記上面に形成された複数のボンディングリード、および前記下面に形成された複数のランドを有する配線基板と、
四角形の外形形状を成す主面、前記主面の反対側に位置する裏面、前記主面に形成された複数の半導体素子、前記複数の半導体素子の周囲にそれぞれ複数列で形成された複数のパッド、および前記主面に形成され、前記複数の半導体素子と前記複数のパッドをそれぞれ電気的に接続する複数の配線を有し、前記主面を前記配線基板の上面と対向させた状態で前記配線基板上に搭載される半導体チップと、
前記半導体チップの前記複数のパッドと前記配線基板の前記複数のボンディングリードとをそれぞれ電気的に接続する複数の導電性部材と、を含み、
前記複数のパッドは、前記主面の周縁部側に形成された1列目パッドと、前記1列目パッドよりも前記主面の内側に形成された2列目パッドとを有し、
前記複数のボンディングリードは、前記1列目パッドと電気的に接続される1列目ボンディングリードと、前記1列目ボンディングリードよりも前記配線基板の上面の内側に形成され、前記2列目パッドと電気的に接続された2列目ボンディングリードとを有し、
前記1列目パッドのうちの第1パッドの内側には、前記2列目パッドのうちの第2パッドが対向配置され、
前記複数の半導体素子の一部は、前記複数の配線を介して前記第1パッドおよび前記第2パッドのそれぞれと電気的に接続されていることを特徴とする半導体装置。 - 請求項9において、
前記複数の半導体素子のうち、前記複数の配線を介して前記複数のパッドに電気的に接続される半導体素子は、アナログ回路素子であることを特徴とする半導体装置。 - 請求項9において、
前記アナログ回路素子に電気的に接続される前記複数のパッドは、前記アナログ回路素子に電源電位、あるいは基準電位を供給するパッドであることを特徴とする半導体装置。 - 上面、前記上面とは反対側に位置する下面、前記上面に形成された複数のボンディングリード、および前記下面に形成された複数のランドを有する配線基板と、
四角形の外形形状を成す主面、前記主面の反対側に位置する裏面、および前記主面の周縁部の各辺に沿って形成された複数のパッドを有し、前記主面を前記配線基板の上面と対向させた状態で搭載される半導体チップと、
前記半導体チップの前記複数のパッドと前記配線基板の前記複数のボンディングリードとをそれぞれ電気的に接続する複数の第1導電性部材と、を含み、
前記複数のパッドは、他のパッドとは異なる固有の電流が流れる複数の第1パッド、および前記複数のパッドに共通する電流が流れる、または電流が流れない複数の第2パッドからなり、
前記主面における前記複数のパッドの配列は、前記主面の角部に前記複数の第2パッドが配置され、前記複数の第2パッドは、複数の第2導電性部材を介して前記複数のボンディングリードと接合されていることを特徴とする半導体装置。 - 請求項12において、
前記複数の第1導電性部材および前記複数の第2導電性部材には、それぞれ半田が含まれ、前記複数のパッドそれぞれの表面に接合された複数の突起電極と、前記半田が接合することにより前記複数のパッドと前記複数のボンディングリードが接続されていることを特徴とする半導体装置。 - 請求項13において、
前記複数のパッドは、前記主面の周縁部の各辺に沿って、1列目パッドと、前記1列目パッドよりも前記主面の内側に形成された2列目パッドとを有し、
前記複数のボンディングリードは、前記1列目パッドと電気的に接続される1列目ボンディングリードと、前記1列目ボンディングリードよりも前記配線基板の上面の内側に形成され、前記2列目パッドと電気的に接続された2列目ボンディングリードとを有し、
前記1列目パッドのうち、前記第1パッドの内側には、前記2列目パッドが対向配置され、
前記2列目パッドのうち、前記第1パッドの外側には、前記1列目パッドが対向配置されていることを特徴とする半導体装置。 - 請求項14において、
前記1列目ボンディングリードは、前記1列目パッドと対向する位置に配置される第1ボンディング部と、前記第1ボンディング部から前記半導体チップを搭載するチップ搭載領域の外側に向かって延在する第1引き出し配線と、からなり、
前記2列目ボンディングリードは、前記2列目パッドと対向する位置に配置される第2ボンディング部と、前記第2ボンディング部から前記チップ搭載領域の内側に向かって延在する第2引き出し配線と、からなり、
前記1列目ボンディングリードおよび前記2列目ボンディングリードは、それぞれ前記配線基板の上面を覆う絶縁膜から露出していることを特徴とする半導体装置。 - 請求項15において、
前記2列目ボンディングリードのうち、前記第2パッドと接合される前記2列目ボンディングリードは、外部機器と電気的に接続されないダミーのボンディングリードであることを特徴とする半導体装置。 - 請求項15において、
前記1列目ボンディングリードのうち、前記第2パッドと接合される前記1列目ボンディングリードは、前記配線基板の前記ランドと電気的に接続され、基準電位電流あるいは電源電位電流が流れることを特徴とする半導体装置。
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Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
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---|---|---|---|---|
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US8513817B2 (en) | 2011-07-12 | 2013-08-20 | Invensas Corporation | Memory module in a package |
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US8698297B2 (en) | 2011-09-23 | 2014-04-15 | Stats Chippac Ltd. | Integrated circuit packaging system with stack device |
US8716065B2 (en) | 2011-09-23 | 2014-05-06 | Stats Chippac Ltd. | Integrated circuit packaging system with encapsulation and method of manufacture thereof |
US8659140B2 (en) | 2011-10-03 | 2014-02-25 | Invensas Corporation | Stub minimization using duplicate sets of signal terminals in assemblies without wirebonds to package substrate |
JP5887415B2 (ja) | 2011-10-03 | 2016-03-16 | インヴェンサス・コーポレイション | 平行な窓を有するマルチダイのワイヤボンドアセンブリのスタブ最小化 |
US8436457B2 (en) | 2011-10-03 | 2013-05-07 | Invensas Corporation | Stub minimization for multi-die wirebond assemblies with parallel windows |
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US10304497B2 (en) | 2017-08-17 | 2019-05-28 | Micron Technology, Inc. | Power supply wiring in a semiconductor memory device |
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US11251148B2 (en) * | 2020-01-28 | 2022-02-15 | Micron Technology, Inc. | Semiconductor devices including array power pads, and associated semiconductor device packages and systems |
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US20230215797A1 (en) * | 2022-01-03 | 2023-07-06 | Mediatek Inc. | Board-level pad pattern for multi-row qfn packages |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07263449A (ja) * | 1994-03-18 | 1995-10-13 | Hitachi Ltd | 半導体装置及びその製法 |
JPH1056093A (ja) * | 1996-08-07 | 1998-02-24 | Hitachi Ltd | 半導体装置およびその半導体装置を組み込んだ電子装置 |
JP2000228459A (ja) * | 1998-12-04 | 2000-08-15 | Nec Saitama Ltd | 裏面電極型電気部品及びそれを実装するための配線板、これらを備える電気部品装置 |
JP2002170848A (ja) * | 2000-11-30 | 2002-06-14 | Kyocera Corp | 回路基板 |
JP2004063761A (ja) * | 2002-07-29 | 2004-02-26 | Nec Electronics Corp | 半導体装置 |
JP2008244206A (ja) * | 2007-03-28 | 2008-10-09 | Renesas Technology Corp | 半導体装置の製造方法 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11219984A (ja) * | 1997-11-06 | 1999-08-10 | Sharp Corp | 半導体装置パッケージおよびその製造方法ならびにそのための回路基板 |
US6150724A (en) * | 1998-03-02 | 2000-11-21 | Motorola, Inc. | Multi-chip semiconductor device and method for making the device by using multiple flip chip interfaces |
US6483190B1 (en) * | 1999-10-20 | 2002-11-19 | Fujitsu Limited | Semiconductor chip element, semiconductor chip element mounting structure, semiconductor chip element mounting device and mounting method |
JP3655179B2 (ja) | 1999-10-20 | 2005-06-02 | 富士通株式会社 | 半導体チップ素子 |
JP2001291744A (ja) | 2000-04-07 | 2001-10-19 | Nippon Dempa Kogyo Co Ltd | Icチップの接合方法及びこれを用いた水晶発振器 |
US6304151B1 (en) * | 1999-12-07 | 2001-10-16 | Nihon Dempa Kogyo Co., Ltd. | Crystal oscillator and method of fabricating the same |
CN1184684C (zh) * | 2000-10-05 | 2005-01-12 | 三洋电机株式会社 | 半导体装置和半导体模块 |
JP2003100801A (ja) | 2001-09-25 | 2003-04-04 | Mitsubishi Electric Corp | 半導体装置 |
DE102004047753B4 (de) * | 2004-09-30 | 2009-01-02 | Advanced Micro Devices, Inc., Sunnyvale | Verbesserte Chip-Kontaktierungsanordnung für Chip-Träger für Flip-Chip-Anwendungen |
JP2006147620A (ja) | 2004-11-16 | 2006-06-08 | Toshiba Corp | フリップチップ実装半導体装置の製造方法及びフリップチップ実装半導体装置 |
JP2008218758A (ja) | 2007-03-06 | 2008-09-18 | Matsushita Electric Ind Co Ltd | 電子回路実装構造体 |
-
2009
- 2009-05-29 JP JP2009130804A patent/JP2010278318A/ja active Pending
-
2010
- 2010-05-24 US US12/785,488 patent/US8698296B2/en active Active
-
2014
- 2014-03-11 US US14/204,988 patent/US8975120B2/en active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07263449A (ja) * | 1994-03-18 | 1995-10-13 | Hitachi Ltd | 半導体装置及びその製法 |
JPH1056093A (ja) * | 1996-08-07 | 1998-02-24 | Hitachi Ltd | 半導体装置およびその半導体装置を組み込んだ電子装置 |
JP2000228459A (ja) * | 1998-12-04 | 2000-08-15 | Nec Saitama Ltd | 裏面電極型電気部品及びそれを実装するための配線板、これらを備える電気部品装置 |
JP2002170848A (ja) * | 2000-11-30 | 2002-06-14 | Kyocera Corp | 回路基板 |
JP2004063761A (ja) * | 2002-07-29 | 2004-02-26 | Nec Electronics Corp | 半導体装置 |
JP2008244206A (ja) * | 2007-03-28 | 2008-10-09 | Renesas Technology Corp | 半導体装置の製造方法 |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9818678B2 (en) | 2011-06-30 | 2017-11-14 | Renesas Electronics Corporation | Semiconductor device |
JP2013115205A (ja) * | 2011-11-28 | 2013-06-10 | Shinko Electric Ind Co Ltd | 半導体装置の製造方法、半導体装置、及び半導体素子 |
JP2014127706A (ja) * | 2012-12-27 | 2014-07-07 | Renesas Electronics Corp | 半導体装置の製造方法および半導体装置 |
US11457531B2 (en) | 2013-04-29 | 2022-09-27 | Samsung Display Co., Ltd. | Electronic component, electric device including the same, and bonding method thereof |
US11696402B2 (en) | 2013-04-29 | 2023-07-04 | Samsung Display Co., Ltd. | Electronic component, electric device including the same, and bonding method thereof |
US11979987B2 (en) | 2013-04-29 | 2024-05-07 | Samsung Display Co., Ltd. | Electronic component, electric device including the same, and bonding method thereof |
JP2020115592A (ja) * | 2014-04-10 | 2020-07-30 | 三星ディスプレイ株式會社Samsung Display Co.,Ltd. | 電子部品 |
KR20150120617A (ko) * | 2014-04-18 | 2015-10-28 | 에스케이하이닉스 주식회사 | 반도체 칩 적층 패키지 |
KR102026979B1 (ko) | 2014-04-18 | 2019-09-30 | 에스케이하이닉스 주식회사 | 반도체 칩 적층 패키지 |
JP2015228511A (ja) * | 2015-08-03 | 2015-12-17 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
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