JP2009182104A5 - - Google Patents

Download PDF

Info

Publication number
JP2009182104A5
JP2009182104A5 JP2008019005A JP2008019005A JP2009182104A5 JP 2009182104 A5 JP2009182104 A5 JP 2009182104A5 JP 2008019005 A JP2008019005 A JP 2008019005A JP 2008019005 A JP2008019005 A JP 2008019005A JP 2009182104 A5 JP2009182104 A5 JP 2009182104A5
Authority
JP
Japan
Prior art keywords
wiring board
main surface
external connection
connection terminal
semiconductor package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2008019005A
Other languages
English (en)
Japanese (ja)
Other versions
JP2009182104A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2008019005A priority Critical patent/JP2009182104A/ja
Priority claimed from JP2008019005A external-priority patent/JP2009182104A/ja
Priority to US12/361,083 priority patent/US7968997B2/en
Publication of JP2009182104A publication Critical patent/JP2009182104A/ja
Publication of JP2009182104A5 publication Critical patent/JP2009182104A5/ja
Pending legal-status Critical Current

Links

JP2008019005A 2008-01-30 2008-01-30 半導体パッケージ Pending JP2009182104A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2008019005A JP2009182104A (ja) 2008-01-30 2008-01-30 半導体パッケージ
US12/361,083 US7968997B2 (en) 2008-01-30 2009-01-28 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008019005A JP2009182104A (ja) 2008-01-30 2008-01-30 半導体パッケージ

Publications (2)

Publication Number Publication Date
JP2009182104A JP2009182104A (ja) 2009-08-13
JP2009182104A5 true JP2009182104A5 (enExample) 2011-02-03

Family

ID=40898306

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008019005A Pending JP2009182104A (ja) 2008-01-30 2008-01-30 半導体パッケージ

Country Status (2)

Country Link
US (1) US7968997B2 (enExample)
JP (1) JP2009182104A (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2503594A1 (en) * 2011-03-21 2012-09-26 Dialog Semiconductor GmbH Signal routing optimized IC package ball/pad layout
JP6076068B2 (ja) * 2012-12-17 2017-02-08 ルネサスエレクトロニクス株式会社 半導体集積回路装置
KR102245132B1 (ko) 2014-05-14 2021-04-28 삼성전자 주식회사 트레이스를 가지는 인쇄회로기판 및 볼 그리드 어레이 패키지
EP3535571B1 (en) * 2016-11-07 2020-12-30 Dnae Diagnostics Limited Isfet array
CN117083656A (zh) * 2021-03-26 2023-11-17 京瓷株式会社 显示装置
CN113629031A (zh) * 2021-06-21 2021-11-09 江西万年芯微电子有限公司 一种tsop48l pin to pin lga48封装设计方法

Family Cites Families (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3398232A (en) * 1965-10-19 1968-08-20 Amp Inc Circuit board with interconnected signal conductors and interconnected shielding conductors
US3838317A (en) * 1973-07-12 1974-09-24 Bell Telephone Labor Inc Cross connect switch
DE3852131T2 (de) * 1988-04-26 1995-05-18 Citizen Watch Co Ltd Speicherkarte.
US7166495B2 (en) * 1996-02-20 2007-01-23 Micron Technology, Inc. Method of fabricating a multi-die semiconductor package assembly
US6515355B1 (en) * 1998-09-02 2003-02-04 Micron Technology, Inc. Passivation layer for packaged integrated circuits
JP2000082757A (ja) 1998-09-07 2000-03-21 Sony Corp 表面実装部品の外部端子構造
US6927491B1 (en) 1998-12-04 2005-08-09 Nec Corporation Back electrode type electronic part and electronic assembly with the same mounted on printed circuit board
JP2001217355A (ja) * 1999-11-25 2001-08-10 Hitachi Ltd 半導体装置
JP2001177266A (ja) 1999-12-16 2001-06-29 Kato Electrical Mach Co Ltd 小型開閉装置
JP2002043503A (ja) * 2000-07-25 2002-02-08 Nec Kyushu Ltd 半導体装置
JP2002057242A (ja) 2000-08-07 2002-02-22 Canon Inc エリアアレイ型半導体パッケージ
JP4341187B2 (ja) * 2001-02-13 2009-10-07 日本電気株式会社 半導体装置
JP3839323B2 (ja) * 2001-04-06 2006-11-01 株式会社ルネサステクノロジ 半導体装置の製造方法
KR100416000B1 (ko) * 2001-07-11 2004-01-24 삼성전자주식회사 다수의 핀을 갖는 부품이 실장되는 인쇄회로기판
JP5004385B2 (ja) * 2001-08-03 2012-08-22 ルネサスエレクトロニクス株式会社 半導体メモリチップとそれを用いた半導体メモリ装置
SG118103A1 (en) * 2001-12-12 2006-01-27 Micron Technology Inc BOC BGA package for die with I-shaped bond pad layout
JP2003234359A (ja) * 2002-02-08 2003-08-22 Hitachi Ltd 半導体装置の製造方法
US20030178707A1 (en) * 2002-03-21 2003-09-25 Abbott Donald C. Preplated stamped small outline no-lead leadframes having etched profiles
JP3942952B2 (ja) 2002-05-10 2007-07-11 松下電器産業株式会社 リフロー半田付け方法
US6940176B2 (en) * 2002-05-21 2005-09-06 United Microelectronics Corp. Solder pads for improving reliability of a package
US20040067606A1 (en) * 2002-10-02 2004-04-08 Fehr Gerald K. Method for stack-packaging integrated circuit die using at least one die in the package as a spacer
JP2004165637A (ja) * 2002-10-21 2004-06-10 Matsushita Electric Ind Co Ltd 半導体装置
JP3880572B2 (ja) * 2003-10-31 2007-02-14 沖電気工業株式会社 半導体チップ及び半導体装置
US6930378B1 (en) * 2003-11-10 2005-08-16 Amkor Technology, Inc. Stacked semiconductor die assembly having at least one support
JP4737995B2 (ja) * 2005-01-14 2011-08-03 ルネサスエレクトロニクス株式会社 半導体装置
JP2006210851A (ja) * 2005-01-31 2006-08-10 Toshiba Corp 回路基板
JP4539396B2 (ja) * 2005-03-28 2010-09-08 ソニー株式会社 半導体装置の実装構造
JP4562579B2 (ja) 2005-04-06 2010-10-13 パナソニック株式会社 半導体装置
JP4237160B2 (ja) * 2005-04-08 2009-03-11 エルピーダメモリ株式会社 積層型半導体装置
JP2006294976A (ja) * 2005-04-13 2006-10-26 Nec Electronics Corp 半導体装置およびその製造方法
JP2007059541A (ja) * 2005-08-23 2007-03-08 Toshiba Corp 半導体装置及びその組立方法
JP2007103423A (ja) * 2005-09-30 2007-04-19 Renesas Technology Corp 半導体装置及びその製造方法
JP4740765B2 (ja) * 2006-02-24 2011-08-03 エルピーダメモリ株式会社 半導体装置及びその製造方法
US7566854B2 (en) * 2006-12-08 2009-07-28 Advanced Chip Engineering Technology Inc. Image sensor module
US7911045B2 (en) * 2007-08-17 2011-03-22 Kabushiki Kaisha Toshiba Semiconductor element and semiconductor device
JP4498403B2 (ja) * 2007-09-28 2010-07-07 株式会社東芝 半導体装置と半導体記憶装置

Similar Documents

Publication Publication Date Title
JP2010109206A5 (enExample)
US10170433B2 (en) Insulated circuit board, power module and power unit
JP2009182104A5 (enExample)
JP2011003715A5 (enExample)
JP2011134956A5 (enExample)
JP2009141169A5 (enExample)
US9029993B2 (en) Semiconductor device including semiconductor chip mounted on lead frame
JP2009027039A5 (enExample)
WO2011142581A3 (ko) 적층형 반도체 패키지
JP6092645B2 (ja) 半導体装置
US7687893B2 (en) Semiconductor package having leadframe with exposed anchor pads
JP2014127706A5 (ja) 半導体装置の製造方法
JP2011044654A5 (enExample)
CN105814682B (zh) 半导体装置
JP2014165319A5 (enExample)
JP5649277B2 (ja) 半導体装置
JP2010287737A5 (enExample)
JP2008147572A5 (enExample)
CN204558457U (zh) 功率模块
CN103811476A (zh) 半导体器件
JP2008211188A5 (enExample)
JP2015065296A5 (enExample)
US20150069592A1 (en) Semiconductor device, method of manufacturing same, and application board mounted with same
US9078380B2 (en) MOSFET stack package
JP2010153651A5 (enExample)