JP2011044654A5 - - Google Patents

Download PDF

Info

Publication number
JP2011044654A5
JP2011044654A5 JP2009193318A JP2009193318A JP2011044654A5 JP 2011044654 A5 JP2011044654 A5 JP 2011044654A5 JP 2009193318 A JP2009193318 A JP 2009193318A JP 2009193318 A JP2009193318 A JP 2009193318A JP 2011044654 A5 JP2011044654 A5 JP 2011044654A5
Authority
JP
Japan
Prior art keywords
interposer
pad
pads
semiconductor device
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2009193318A
Other languages
English (en)
Japanese (ja)
Other versions
JP2011044654A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2009193318A priority Critical patent/JP2011044654A/ja
Priority claimed from JP2009193318A external-priority patent/JP2011044654A/ja
Publication of JP2011044654A publication Critical patent/JP2011044654A/ja
Publication of JP2011044654A5 publication Critical patent/JP2011044654A5/ja
Pending legal-status Critical Current

Links

JP2009193318A 2009-08-24 2009-08-24 半導体装置 Pending JP2011044654A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009193318A JP2011044654A (ja) 2009-08-24 2009-08-24 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009193318A JP2011044654A (ja) 2009-08-24 2009-08-24 半導体装置

Publications (2)

Publication Number Publication Date
JP2011044654A JP2011044654A (ja) 2011-03-03
JP2011044654A5 true JP2011044654A5 (enExample) 2012-08-09

Family

ID=43831837

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009193318A Pending JP2011044654A (ja) 2009-08-24 2009-08-24 半導体装置

Country Status (1)

Country Link
JP (1) JP2011044654A (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8227904B2 (en) 2009-06-24 2012-07-24 Intel Corporation Multi-chip package and method of providing die-to-die interconnects in same
US9275955B2 (en) 2013-12-18 2016-03-01 Intel Corporation Integrated circuit package with embedded bridge
JP2015220291A (ja) * 2014-05-15 2015-12-07 株式会社ソシオネクスト 半導体装置及びその製造方法
JP6398396B2 (ja) * 2014-07-08 2018-10-03 日本電気株式会社 電子装置又はその製造方法
US9666559B2 (en) * 2014-09-05 2017-05-30 Invensas Corporation Multichip modules and methods of fabrication
JP2017092094A (ja) 2015-11-04 2017-05-25 富士通株式会社 電子装置、電子装置の製造方法及び電子機器
US10943851B1 (en) * 2019-12-06 2021-03-09 Intel Corporation Reconstituted wafer assembly
WO2022249600A1 (ja) 2021-05-26 2022-12-01 株式会社村田製作所 電子回路モジュール
CN113948508A (zh) * 2021-10-12 2022-01-18 天津津航计算技术研究所 一种基于硅载板的芯片模块高密度互连方法
CN116053229A (zh) * 2022-03-17 2023-05-02 海光信息技术股份有限公司 芯片封装基板和封装芯片
WO2024053103A1 (ja) * 2022-09-09 2024-03-14 ウルトラメモリ株式会社 Ｉｃブリッジ、ｉｃモジュールおよびｉｃモジュールの製造方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG93192A1 (en) * 1999-01-28 2002-12-17 United Microelectronics Corp Face-to-face multi chip package
JP2001244388A (ja) * 2000-02-28 2001-09-07 Matsushita Electric Ind Co Ltd 半導体装置
JP3833136B2 (ja) * 2002-04-10 2006-10-11 株式会社カイジョー 半導体構造およびボンディング方法
JP2006073651A (ja) * 2004-08-31 2006-03-16 Fujitsu Ltd 半導体装置
JP4581768B2 (ja) * 2005-03-16 2010-11-17 ソニー株式会社 半導体装置の製造方法
JP4417974B2 (ja) * 2007-04-19 2010-02-17 株式会社東芝 積層型半導体装置の製造方法

Similar Documents

Publication Publication Date Title
JP2011044654A5 (enExample)
JP2009545180A5 (enExample)
JP2003309223A5 (enExample)
CN103283019A (zh) 半导体装置
US20160079219A1 (en) Semiconductor device
JP2014515187A5 (enExample)
JP2009110983A5 (enExample)
WO2011142581A3 (ko) 적층형 반도체 패키지
JP2009141169A5 (enExample)
CN106206329B (zh) 半导体装置
JP2009147165A5 (enExample)
JP2018125349A5 (enExample)
JP2020522117A5 (enExample)
TW200939451A (en) Stacked semiconductor package
JP2009099905A5 (enExample)
TWM472946U (zh) 晶粒封裝結構
JP2011003764A5 (ja) 半導体装置
TWI394259B (zh) 多基板堆疊之球格陣列封裝構造
TWI581392B (zh) 電子封裝組件
TWI517354B (zh) 內藏去耦合電容之半導體封裝構造
TWI501370B (zh) 半導體封裝件及其製法
CN104218034A (zh) 半导体封装
CN101615607A (zh) 芯片封装结构
TWI423405B (zh) 具載板之封裝結構
US9293399B2 (en) Semiconductor device and electronic unit provided with the same