JP2009545180A5 - - Google Patents

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Publication number
JP2009545180A5
JP2009545180A5 JP2009522071A JP2009522071A JP2009545180A5 JP 2009545180 A5 JP2009545180 A5 JP 2009545180A5 JP 2009522071 A JP2009522071 A JP 2009522071A JP 2009522071 A JP2009522071 A JP 2009522071A JP 2009545180 A5 JP2009545180 A5 JP 2009545180A5
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JP
Japan
Prior art keywords
patterned
solder
conductive circuit
additional
layer
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JP2009522071A
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English (en)
Japanese (ja)
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JP4988843B2 (ja
JP2009545180A (ja
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Priority claimed from US11/496,111 external-priority patent/US7652374B2/en
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Publication of JP2009545180A publication Critical patent/JP2009545180A/ja
Publication of JP2009545180A5 publication Critical patent/JP2009545180A5/ja
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Publication of JP4988843B2 publication Critical patent/JP4988843B2/ja
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JP2009522071A 2006-07-31 2007-07-23 半導体フリップチップパッケージ用の基板およびプロセス Active JP4988843B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US11/496,111 2006-07-31
US11/496,111 US7652374B2 (en) 2006-07-31 2006-07-31 Substrate and process for semiconductor flip chip package
PCT/CN2007/002228 WO2008017232A1 (en) 2006-07-31 2007-07-23 Substrate and process for semiconductor flip chip package

Publications (3)

Publication Number Publication Date
JP2009545180A JP2009545180A (ja) 2009-12-17
JP2009545180A5 true JP2009545180A5 (enExample) 2010-03-25
JP4988843B2 JP4988843B2 (ja) 2012-08-01

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ID=38985352

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009522071A Active JP4988843B2 (ja) 2006-07-31 2007-07-23 半導体フリップチップパッケージ用の基板およびプロセス

Country Status (7)

Country Link
US (1) US7652374B2 (enExample)
EP (1) EP2054933A4 (enExample)
JP (1) JP4988843B2 (enExample)
KR (1) KR20090042777A (enExample)
CN (1) CN101496168B (enExample)
MY (1) MY151533A (enExample)
WO (1) WO2008017232A1 (enExample)

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US20110285013A1 (en) * 2010-05-20 2011-11-24 Taiwan Semiconductor Manufacturing Company, Ltd. Controlling Solder Bump Profiles by Increasing Heights of Solder Resists
US8922004B2 (en) * 2010-06-11 2014-12-30 Taiwan Semiconductor Manufacturing Company, Ltd. Copper bump structures having sidewall protection layers
DE102010041917B4 (de) 2010-10-04 2014-01-23 Smartrac Ip B.V. Schaltungsanordnung und Verfahren zu deren Herstellung
FR2969374B1 (fr) * 2010-12-16 2013-07-19 St Microelectronics Crolles 2 Procédé d'assemblage de deux circuits intégrés et structure correspondante
US8936967B2 (en) * 2011-03-23 2015-01-20 Intel Corporation Solder in cavity interconnection structures
CN102368495A (zh) * 2011-10-09 2012-03-07 常熟市华海电子有限公司 一种防静电芯片封装结构
US8970035B2 (en) * 2012-08-31 2015-03-03 Taiwan Semiconductor Manufacturing Company, Ltd. Bump structures for semiconductor package
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US9627347B2 (en) * 2012-09-24 2017-04-18 National Institute Of Advanced Industrial Science And Technology Method of manufacturing semiconductor device and semiconductor device manufacturing apparatus
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CN104425287A (zh) * 2013-08-19 2015-03-18 讯芯电子科技（中山）有限公司 封装结构及制造方法
CN103579012B (zh) * 2013-10-24 2016-08-17 天水华天科技股份有限公司 带焊球面阵列四面扁平无引脚封装件生产方法
US20150187681A1 (en) * 2013-12-26 2015-07-02 Ravi V. Mahajan Flexible microelectronic assembly and method
KR101534705B1 (ko) * 2013-12-30 2015-07-07 현대자동차 주식회사 반도체 기판의 접합 방법
KR101542965B1 (ko) * 2013-12-30 2015-08-07 현대자동차 주식회사 반도체 기판의 접합 방법
CN106471612B (zh) * 2014-06-27 2019-07-19 索尼公司 半导体器件及其制造方法
KR101691099B1 (ko) * 2015-04-30 2016-12-29 하나 마이크론(주) 팬 아웃 패키지, 팬 아웃 pop 패키지 및 그 제조 방법
US9935072B2 (en) * 2015-11-04 2018-04-03 Sfa Semicon Co., Ltd. Semiconductor package and method for manufacturing the same
TWI606565B (zh) * 2016-08-31 2017-11-21 金寶電子工業股份有限公司 封裝結構及其製作方法
CN106816417B (zh) * 2017-01-13 2019-02-12 南京大学 一种高密度封装及其制造方法
KR20190117514A (ko) * 2017-02-17 2019-10-16 소니 세미컨덕터 솔루션즈 가부시키가이샤 반도체 장치, 칩형상 반도체 소자, 반도체 장치를 구비한 전자 기기 및 반도체 장치의 제조 방법
KR102432216B1 (ko) * 2017-07-11 2022-08-12 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 발광소자 패키지
US10269672B2 (en) * 2017-08-24 2019-04-23 Advanced Semiconductor Engineering, Inc. Semiconductor package device and method of manufacturing the same
KR102393035B1 (ko) * 2017-09-01 2022-05-02 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 발광소자 패키지
WO2019054548A1 (ko) * 2017-09-12 2019-03-21 엘지이노텍 주식회사 발광소자 패키지
US10598874B2 (en) * 2017-11-02 2020-03-24 International Business Machines Corporation Fabrication method of high aspect ratio solder bumping with stud bump and injection molded solder, and flip chip joining with the solder bump
DE102018104279B4 (de) 2018-02-26 2025-02-06 Tdk Corporation Elektronische Vorrichtung
JP7214966B2 (ja) 2018-03-16 2023-01-31 富士電機株式会社 半導体装置及び半導体装置の製造方法
KR20230020129A (ko) 2021-08-03 2023-02-10 삼성전자주식회사 반도체 패키지 및 반도체 패키지의 제조 방법
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