JP4988843B2 - 半導体フリップチップパッケージ用の基板およびプロセス - Google Patents

半導体フリップチップパッケージ用の基板およびプロセス Download PDF

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JP4988843B2
JP4988843B2 JP2009522071A JP2009522071A JP4988843B2 JP 4988843 B2 JP4988843 B2 JP 4988843B2 JP 2009522071 A JP2009522071 A JP 2009522071A JP 2009522071 A JP2009522071 A JP 2009522071A JP 4988843 B2 JP4988843 B2 JP 4988843B2
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bump
patterned
solder
substrate
conductive circuit
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JP2009545180A5 (enExample
JP2009545180A (ja
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コク，チー・ワー
タム，イー・チン
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インテレクチュアル・ベンチャーズ・ファンド・２７・リミテッド・ライアビリティ・カンパニー
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    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
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US20080023829A1 (en) 2008-01-31
CN101496168A (zh) 2009-07-29
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