JP2008211188A5 - - Google Patents
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- Publication number
- JP2008211188A5 JP2008211188A5 JP2008011473A JP2008011473A JP2008211188A5 JP 2008211188 A5 JP2008211188 A5 JP 2008211188A5 JP 2008011473 A JP2008011473 A JP 2008011473A JP 2008011473 A JP2008011473 A JP 2008011473A JP 2008211188 A5 JP2008211188 A5 JP 2008211188A5
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor element
- semiconductor device
- circuit region
- resin layer
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims 34
- 239000011347 resin Substances 0.000 claims 7
- 229920005989 resin Polymers 0.000 claims 7
- 239000000758 substrate Substances 0.000 claims 5
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008011473A JP5193611B2 (ja) | 2007-01-31 | 2008-01-22 | 半導体装置 |
| US12/022,840 US7893539B2 (en) | 2007-01-31 | 2008-01-30 | Semiconductor apparatus and mobile apparatus |
| CN2008101092128A CN101286507B (zh) | 2007-01-31 | 2008-01-31 | 半导体装置及便携式设备 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007020683 | 2007-01-31 | ||
| JP2007020683 | 2007-01-31 | ||
| JP2008011473A JP5193611B2 (ja) | 2007-01-31 | 2008-01-22 | 半導体装置 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012279956A Division JP5431567B2 (ja) | 2007-01-31 | 2012-12-21 | 半導体装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2008211188A JP2008211188A (ja) | 2008-09-11 |
| JP2008211188A5 true JP2008211188A5 (enExample) | 2011-03-03 |
| JP5193611B2 JP5193611B2 (ja) | 2013-05-08 |
Family
ID=39787192
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008011473A Expired - Fee Related JP5193611B2 (ja) | 2007-01-31 | 2008-01-22 | 半導体装置 |
| JP2012279956A Expired - Fee Related JP5431567B2 (ja) | 2007-01-31 | 2012-12-21 | 半導体装置 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012279956A Expired - Fee Related JP5431567B2 (ja) | 2007-01-31 | 2012-12-21 | 半導体装置 |
Country Status (2)
| Country | Link |
|---|---|
| JP (2) | JP5193611B2 (enExample) |
| CN (1) | CN101286507B (enExample) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6081229B2 (ja) | 2013-03-01 | 2017-02-15 | 株式会社東芝 | 半導体装置、無線装置、及び記憶装置 |
| JP5535351B1 (ja) * | 2013-03-01 | 2014-07-02 | 株式会社東芝 | 半導体装置 |
| JP6004537B2 (ja) | 2013-03-18 | 2016-10-12 | コベルコ建機株式会社 | ジブ |
| KR102501845B1 (ko) | 2021-02-08 | 2023-02-20 | 경희대학교 산학협력단 | 백수오 추출물을 유효성분으로 포함하는 피부 재생 또는 상처 치료용 조성물 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05235113A (ja) * | 1992-02-21 | 1993-09-10 | Toshiba Corp | 半導体装置 |
| JPH06275752A (ja) * | 1993-03-18 | 1994-09-30 | Hitachi Ltd | 半導体装置の冷却装置 |
| JP2001320014A (ja) * | 2000-05-11 | 2001-11-16 | Seiko Epson Corp | 半導体装置及びその製造方法 |
| JP4554152B2 (ja) * | 2002-12-19 | 2010-09-29 | 株式会社半導体エネルギー研究所 | 半導体チップの作製方法 |
| JP2005150456A (ja) * | 2003-11-17 | 2005-06-09 | Oki Electric Ind Co Ltd | 半導体装置及びその製造方法 |
| JP2005268533A (ja) * | 2004-03-18 | 2005-09-29 | Shinko Electric Ind Co Ltd | 積層型半導体装置 |
| JP2006196709A (ja) * | 2005-01-13 | 2006-07-27 | Sharp Corp | 半導体装置およびその製造方法 |
| JP2008177241A (ja) * | 2007-01-16 | 2008-07-31 | Toshiba Corp | 半導体パッケージ |
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2008
- 2008-01-22 JP JP2008011473A patent/JP5193611B2/ja not_active Expired - Fee Related
- 2008-01-31 CN CN2008101092128A patent/CN101286507B/zh not_active Expired - Fee Related
-
2012
- 2012-12-21 JP JP2012279956A patent/JP5431567B2/ja not_active Expired - Fee Related