JP2015065296A5 - - Google Patents
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- Publication number
- JP2015065296A5 JP2015065296A5 JP2013198300A JP2013198300A JP2015065296A5 JP 2015065296 A5 JP2015065296 A5 JP 2015065296A5 JP 2013198300 A JP2013198300 A JP 2013198300A JP 2013198300 A JP2013198300 A JP 2013198300A JP 2015065296 A5 JP2015065296 A5 JP 2015065296A5
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- semiconductor chip
- main surface
- chip
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims 54
- 239000010410 layer Substances 0.000 claims 3
- 238000007789 sealing Methods 0.000 claims 2
- 239000011241 protective layer Substances 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013198300A JP6110769B2 (ja) | 2013-09-25 | 2013-09-25 | 半導体装置 |
| US14/487,762 US9257400B2 (en) | 2013-09-25 | 2014-09-16 | Semiconductor device |
| CN201410498376.XA CN104465592B (zh) | 2013-09-25 | 2014-09-25 | 半导体器件 |
| HK15108392.0A HK1207743B (zh) | 2013-09-25 | 2015-08-28 | 半导体器件 |
| US14/982,155 US20160111357A1 (en) | 2013-09-25 | 2015-12-29 | Semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013198300A JP6110769B2 (ja) | 2013-09-25 | 2013-09-25 | 半導体装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2015065296A JP2015065296A (ja) | 2015-04-09 |
| JP2015065296A5 true JP2015065296A5 (enExample) | 2016-03-24 |
| JP6110769B2 JP6110769B2 (ja) | 2017-04-05 |
Family
ID=52690244
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013198300A Expired - Fee Related JP6110769B2 (ja) | 2013-09-25 | 2013-09-25 | 半導体装置 |
Country Status (3)
| Country | Link |
|---|---|
| US (2) | US9257400B2 (enExample) |
| JP (1) | JP6110769B2 (enExample) |
| CN (1) | CN104465592B (enExample) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017037911A (ja) * | 2015-08-07 | 2017-02-16 | ルネサスエレクトロニクス株式会社 | 半導体装置およびその製造方法 |
| JP2017112327A (ja) * | 2015-12-18 | 2017-06-22 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
| CN111383542A (zh) | 2018-12-29 | 2020-07-07 | 广东聚华印刷显示技术有限公司 | 像素结构和显示面板 |
| US11393774B2 (en) * | 2019-08-21 | 2022-07-19 | Stmicroelectronics, Inc. | Semiconductor device having cavities at an interface of an encapsulant and a die pad or leads |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08130284A (ja) * | 1994-10-31 | 1996-05-21 | Fuji Electric Co Ltd | 半導体装置 |
| JP2000156464A (ja) * | 1998-11-20 | 2000-06-06 | Hitachi Ltd | 半導体装置の製造方法 |
| US6476474B1 (en) * | 2000-10-10 | 2002-11-05 | Siliconware Precision Industries Co., Ltd. | Dual-die package structure and method for fabricating the same |
| JP3670625B2 (ja) * | 2001-06-13 | 2005-07-13 | 松下電器産業株式会社 | 半導体装置およびその製造方法 |
| JP2004296613A (ja) * | 2003-03-26 | 2004-10-21 | Renesas Technology Corp | 半導体装置 |
| JP2005150647A (ja) * | 2003-11-20 | 2005-06-09 | Renesas Technology Corp | 半導体装置及びその製造方法 |
| JP4759948B2 (ja) * | 2004-07-28 | 2011-08-31 | ルネサスエレクトロニクス株式会社 | 半導体装置の製造方法 |
| JP2007165459A (ja) * | 2005-12-12 | 2007-06-28 | Mitsubishi Electric Corp | マルチチップモジュール |
| JP2008091627A (ja) * | 2006-10-02 | 2008-04-17 | Toshiba Corp | 半導体集積チップ及び半導体装置 |
| JP5646830B2 (ja) | 2009-09-02 | 2014-12-24 | ルネサスエレクトロニクス株式会社 | 半導体装置、半導体装置の製造方法、及びリードフレーム |
| JP5667381B2 (ja) * | 2010-06-01 | 2015-02-12 | ピーエスフォー ルクスコ エスエイアールエルＰＳ４ Ｌｕｘｃｏ Ｓ．ａ．ｒ．ｌ． | 半導体装置及びその製造方法 |
| KR20140011687A (ko) * | 2012-07-18 | 2014-01-29 | 삼성전자주식회사 | 반도체 패키지 및 그의 제조 방법 |
| US9379048B2 (en) * | 2013-02-28 | 2016-06-28 | Semiconductor Components Industries, Llc | Dual-flag stacked die package |
-
2013
- 2013-09-25 JP JP2013198300A patent/JP6110769B2/ja not_active Expired - Fee Related
-
2014
- 2014-09-16 US US14/487,762 patent/US9257400B2/en active Active
- 2014-09-25 CN CN201410498376.XA patent/CN104465592B/zh not_active Expired - Fee Related
-
2015
- 2015-12-29 US US14/982,155 patent/US20160111357A1/en not_active Abandoned