JP2016018931A5 - - Google Patents
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- Publication number
- JP2016018931A5 JP2016018931A5 JP2014141584A JP2014141584A JP2016018931A5 JP 2016018931 A5 JP2016018931 A5 JP 2016018931A5 JP 2014141584 A JP2014141584 A JP 2014141584A JP 2014141584 A JP2014141584 A JP 2014141584A JP 2016018931 A5 JP2016018931 A5 JP 2016018931A5
- Authority
- JP
- Japan
- Prior art keywords
- die pad
- external connection
- inner lead
- connection terminal
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims 11
- 239000002184 metal Substances 0.000 claims 8
- 238000007789 sealing Methods 0.000 claims 5
- 239000011347 resin Substances 0.000 claims 4
- 229920005989 resin Polymers 0.000 claims 4
- 238000005452 bending Methods 0.000 claims 2
- 238000005530 etching Methods 0.000 claims 2
- 238000004519 manufacturing process Methods 0.000 claims 2
- 238000003825 pressing Methods 0.000 claims 2
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014141584A JP6357371B2 (ja) | 2014-07-09 | 2014-07-09 | リードフレーム、半導体装置及びリードフレームの製造方法 |
| KR1020150095231A KR102402841B1 (ko) | 2014-07-09 | 2015-07-03 | 리드 프레임, 반도체 장치, 및 리드 프레임의 제조 방법 |
| US14/791,630 US9633933B2 (en) | 2014-07-09 | 2015-07-06 | Lead frame with anchor-shaped lead |
| TW104121787A TWI650840B (zh) | 2014-07-09 | 2015-07-06 | 引線支架、半導體裝置及引線支架之製造方法 |
| CN201510395642.0A CN105261605B (zh) | 2014-07-09 | 2015-07-07 | 引线框架、半导体装置以及引线框架的制造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014141584A JP6357371B2 (ja) | 2014-07-09 | 2014-07-09 | リードフレーム、半導体装置及びリードフレームの製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2016018931A JP2016018931A (ja) | 2016-02-01 |
| JP2016018931A5 true JP2016018931A5 (enExample) | 2017-05-25 |
| JP6357371B2 JP6357371B2 (ja) | 2018-07-11 |
Family
ID=55068140
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014141584A Active JP6357371B2 (ja) | 2014-07-09 | 2014-07-09 | リードフレーム、半導体装置及びリードフレームの製造方法 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US9633933B2 (enExample) |
| JP (1) | JP6357371B2 (enExample) |
| KR (1) | KR102402841B1 (enExample) |
| CN (1) | CN105261605B (enExample) |
| TW (1) | TWI650840B (enExample) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6840466B2 (ja) * | 2016-03-08 | 2021-03-10 | 株式会社アムコー・テクノロジー・ジャパン | 半導体パッケージ及び半導体パッケージの製造方法 |
| JP6500822B2 (ja) * | 2016-03-25 | 2019-04-17 | トヨタ自動車株式会社 | セレクタブルワンウェイクラッチ |
| JP6603169B2 (ja) * | 2016-04-22 | 2019-11-06 | ルネサスエレクトロニクス株式会社 | 半導体装置の製造方法および半導体装置 |
| US9892999B2 (en) | 2016-06-07 | 2018-02-13 | Globalfoundries Inc. | Producing wafer level packaging using leadframe strip and related device |
| US10109563B2 (en) * | 2017-01-05 | 2018-10-23 | Stmicroelectronics, Inc. | Modified leadframe design with adhesive overflow recesses |
| JP7182374B2 (ja) * | 2017-05-15 | 2022-12-02 | 新光電気工業株式会社 | リードフレーム及びその製造方法 |
| JP2020136324A (ja) * | 2019-02-13 | 2020-08-31 | セイコーエプソン株式会社 | 電子デバイスの製造方法 |
| JP7338204B2 (ja) * | 2019-04-01 | 2023-09-05 | 富士電機株式会社 | 半導体装置 |
| WO2022021294A1 (en) | 2020-07-31 | 2022-02-03 | The Procter & Gamble Company | Wearable article comprising an elastic laminate |
| WO2022021266A1 (en) | 2020-07-31 | 2022-02-03 | The Procter & Gamble Company | Wearable article comprising an elastic laminate |
| WO2022021295A1 (en) | 2020-07-31 | 2022-02-03 | The Procter & Gamble Company | Wearable article comprising an elastic laminate having good wicking properties |
| JP7479771B2 (ja) * | 2020-10-01 | 2024-05-09 | 三菱電機株式会社 | 半導体装置、半導体装置の製造方法及び電力変換装置 |
Family Cites Families (25)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4827611A (en) * | 1988-03-28 | 1989-05-09 | Control Data Corporation | Compliant S-leads for chip carriers |
| DE3911711A1 (de) * | 1989-04-10 | 1990-10-11 | Ibm | Modul-aufbau mit integriertem halbleiterchip und chiptraeger |
| JP2568915B2 (ja) * | 1989-07-19 | 1997-01-08 | イビデン株式会社 | Ｉｃカード |
| JPH05144992A (ja) * | 1991-11-18 | 1993-06-11 | Mitsubishi Electric Corp | 半導体装置およびその製造方法ならびにその製造に使用されるリードフレームおよびその製造方法 |
| JPH09260568A (ja) * | 1996-03-27 | 1997-10-03 | Mitsubishi Electric Corp | 半導体装置及びその製造方法 |
| KR980006174A (ko) * | 1996-06-18 | 1998-03-30 | 문정환 | 버틈 리드 패키지 |
| DE19625228C2 (de) * | 1996-06-24 | 1998-05-14 | Siemens Ag | Systemträger für die Montage einer integrierten Schaltung in einem Spritzgußgehäuse |
| KR100214544B1 (ko) * | 1996-12-28 | 1999-08-02 | 구본준 | 볼 그리드 어레이 반도체 패키지 |
| US6329705B1 (en) * | 1998-05-20 | 2001-12-11 | Micron Technology, Inc. | Leadframes including offsets extending from a major plane thereof, packaged semiconductor devices including same, and method of designing and fabricating such leadframes |
| KR100319616B1 (ko) * | 1999-04-17 | 2002-01-05 | 김영환 | 리드프레임 및 이를 이용한 버텀리드 반도체패키지 |
| US6521483B1 (en) * | 1999-07-22 | 2003-02-18 | Seiko Epson Corporation | Semiconductor device, method of manufacture thereof, circuit board, and electronic device |
| KR100355749B1 (ko) * | 1999-11-04 | 2002-10-19 | 앰코 테크놀로지 코리아 주식회사 | 리드 프레임의 구조와 그 제조방법 그리고 이 리드프레임을 적용한 반도체 패키지 |
| US6320251B1 (en) * | 2000-01-18 | 2001-11-20 | Amkor Technology, Inc. | Stackable package for an integrated circuit |
| TW473965B (en) * | 2000-09-04 | 2002-01-21 | Siliconware Precision Industries Co Ltd | Thin type semiconductor device and the manufacturing method thereof |
| US7057273B2 (en) * | 2001-05-15 | 2006-06-06 | Gem Services, Inc. | Surface mount package |
| JP3497847B2 (ja) * | 2001-08-23 | 2004-02-16 | 沖電気工業株式会社 | 半導体装置およびその製造方法 |
| JP2003309242A (ja) | 2002-04-15 | 2003-10-31 | Dainippon Printing Co Ltd | リードフレーム部材とリードフレーム部材の製造方法、及び該リードフレーム部材を用いた半導体パッケージとその製造方法 |
| JP2003309241A (ja) | 2002-04-15 | 2003-10-31 | Dainippon Printing Co Ltd | リードフレーム部材とリードフレーム部材の製造方法、及び該リードフレーム部材を用いた半導体パッケージとその製造方法 |
| EP1547141A4 (en) * | 2002-09-17 | 2010-02-24 | Chippac Inc | SEMICONDUCTOR MULTIPLE CAPACITY MODULE WITH WIRE BOND CONNECTION BETWEEN STACKED CAPSULES |
| TWI228303B (en) * | 2003-10-29 | 2005-02-21 | Advanced Semiconductor Eng | Semiconductor package, method for manufacturing the same and lead frame for use in the same |
| US7315077B2 (en) * | 2003-11-13 | 2008-01-01 | Fairchild Korea Semiconductor, Ltd. | Molded leadless package having a partially exposed lead frame pad |
| US8395251B2 (en) * | 2005-05-12 | 2013-03-12 | Stats Chippac Ltd. | Integrated circuit package to package stacking system |
| US7868471B2 (en) * | 2007-09-13 | 2011-01-11 | Stats Chippac Ltd. | Integrated circuit package-in-package system with leads |
| JP6092645B2 (ja) * | 2013-02-07 | 2017-03-08 | エスアイアイ・セミコンダクタ株式会社 | 半導体装置 |
| US9355945B1 (en) * | 2015-09-02 | 2016-05-31 | Freescale Semiconductor, Inc. | Semiconductor device with heat-dissipating lead frame |
-
2014
- 2014-07-09 JP JP2014141584A patent/JP6357371B2/ja active Active
-
2015
- 2015-07-03 KR KR1020150095231A patent/KR102402841B1/ko active Active
- 2015-07-06 TW TW104121787A patent/TWI650840B/zh active
- 2015-07-06 US US14/791,630 patent/US9633933B2/en active Active
- 2015-07-07 CN CN201510395642.0A patent/CN105261605B/zh active Active