KR102402841B1 - 리드 프레임, 반도체 장치, 및 리드 프레임의 제조 방법 - Google Patents

리드 프레임, 반도체 장치, 및 리드 프레임의 제조 방법 Download PDF

Info

Publication number
KR102402841B1
KR102402841B1 KR1020150095231A KR20150095231A KR102402841B1 KR 102402841 B1 KR102402841 B1 KR 102402841B1 KR 1020150095231 A KR1020150095231 A KR 1020150095231A KR 20150095231 A KR20150095231 A KR 20150095231A KR 102402841 B1 KR102402841 B1 KR 102402841B1
Authority
KR
South Korea
Prior art keywords
lead
external connection
die pad
connection terminal
inner lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020150095231A
Other languages
English (en)
Korean (ko)
Other versions
KR20160006608A (ko
Inventor
신타로 하야시
Original Assignee
신꼬오덴기 고교 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 신꼬오덴기 고교 가부시키가이샤 filed Critical 신꼬오덴기 고교 가부시키가이샤
Publication of KR20160006608A publication Critical patent/KR20160006608A/ko
Application granted granted Critical
Publication of KR102402841B1 publication Critical patent/KR102402841B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H01L23/49551—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H10W70/424—Cross-sectional shapes
    • H10W70/427—Bent parts
    • H01L23/4952—
    • H01L23/49531—
    • H01L23/49575—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/04—Manufacture or treatment of leadframes
    • H10W70/048—Mechanical treatments, e.g. punching, cutting, deforming or cold welding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
KR1020150095231A 2014-07-09 2015-07-03 리드 프레임, 반도체 장치, 및 리드 프레임의 제조 방법 Active KR102402841B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2014-141584 2014-07-09
JP2014141584A JP6357371B2 (ja) 2014-07-09 2014-07-09 リードフレーム、半導体装置及びリードフレームの製造方法

Publications (2)

Publication Number Publication Date
KR20160006608A KR20160006608A (ko) 2016-01-19
KR102402841B1 true KR102402841B1 (ko) 2022-05-27

Family

ID=55068140

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020150095231A Active KR102402841B1 (ko) 2014-07-09 2015-07-03 리드 프레임, 반도체 장치, 및 리드 프레임의 제조 방법

Country Status (5)

Country Link
US (1) US9633933B2 (enExample)
JP (1) JP6357371B2 (enExample)
KR (1) KR102402841B1 (enExample)
CN (1) CN105261605B (enExample)
TW (1) TWI650840B (enExample)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6840466B2 (ja) * 2016-03-08 2021-03-10 株式会社アムコー・テクノロジー・ジャパン 半導体パッケージ及び半導体パッケージの製造方法
JP6500822B2 (ja) * 2016-03-25 2019-04-17 トヨタ自動車株式会社 セレクタブルワンウェイクラッチ
JP6603169B2 (ja) * 2016-04-22 2019-11-06 ルネサスエレクトロニクス株式会社 半導体装置の製造方法および半導体装置
US9892999B2 (en) 2016-06-07 2018-02-13 Globalfoundries Inc. Producing wafer level packaging using leadframe strip and related device
US10109563B2 (en) * 2017-01-05 2018-10-23 Stmicroelectronics, Inc. Modified leadframe design with adhesive overflow recesses
JP7182374B2 (ja) * 2017-05-15 2022-12-02 新光電気工業株式会社 リードフレーム及びその製造方法
JP2020136324A (ja) * 2019-02-13 2020-08-31 セイコーエプソン株式会社 電子デバイスの製造方法
JP7338204B2 (ja) * 2019-04-01 2023-09-05 富士電機株式会社 半導体装置
EP4188303B1 (en) 2020-07-31 2025-11-26 The Procter & Gamble Company Wearable article comprising an elastic laminate having good wicking properties
WO2022021294A1 (en) 2020-07-31 2022-02-03 The Procter & Gamble Company Wearable article comprising an elastic laminate
EP4188298B1 (en) 2020-07-31 2025-06-11 The Procter & Gamble Company Wearable article comprising an elastic laminate
JP7479771B2 (ja) * 2020-10-01 2024-05-09 三菱電機株式会社 半導体装置、半導体装置の製造方法及び電力変換装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2568915B2 (ja) * 1989-07-19 1997-01-08 イビデン株式会社 Ｉｃカード
US20030038361A1 (en) 2001-08-23 2003-02-27 Akio Nakamura Semiconductor apparatus and method for fabricating the same

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4827611A (en) * 1988-03-28 1989-05-09 Control Data Corporation Compliant S-leads for chip carriers
DE3911711A1 (de) * 1989-04-10 1990-10-11 Ibm Modul-aufbau mit integriertem halbleiterchip und chiptraeger
JPH05144992A (ja) * 1991-11-18 1993-06-11 Mitsubishi Electric Corp 半導体装置およびその製造方法ならびにその製造に使用されるリードフレームおよびその製造方法
JPH09260568A (ja) * 1996-03-27 1997-10-03 Mitsubishi Electric Corp 半導体装置及びその製造方法
KR980006174A (ko) * 1996-06-18 1998-03-30 문정환 버틈 리드 패키지
DE19625228C2 (de) * 1996-06-24 1998-05-14 Siemens Ag Systemträger für die Montage einer integrierten Schaltung in einem Spritzgußgehäuse
KR100214544B1 (ko) * 1996-12-28 1999-08-02 구본준 볼 그리드 어레이 반도체 패키지
US6329705B1 (en) * 1998-05-20 2001-12-11 Micron Technology, Inc. Leadframes including offsets extending from a major plane thereof, packaged semiconductor devices including same, and method of designing and fabricating such leadframes
KR100319616B1 (ko) * 1999-04-17 2002-01-05 김영환 리드프레임 및 이를 이용한 버텀리드 반도체패키지
JP4051531B2 (ja) * 1999-07-22 2008-02-27 セイコーエプソン株式会社 半導体装置及びその製造方法、回路基板並びに電子機器
KR100355749B1 (ko) * 1999-11-04 2002-10-19 앰코 테크놀로지 코리아 주식회사 리드 프레임의 구조와 그 제조방법 그리고 이 리드프레임을 적용한 반도체 패키지
US6320251B1 (en) * 2000-01-18 2001-11-20 Amkor Technology, Inc. Stackable package for an integrated circuit
TW473965B (en) * 2000-09-04 2002-01-21 Siliconware Precision Industries Co Ltd Thin type semiconductor device and the manufacturing method thereof
US7057273B2 (en) * 2001-05-15 2006-06-06 Gem Services, Inc. Surface mount package
JP2003309242A (ja) 2002-04-15 2003-10-31 Dainippon Printing Co Ltd リードフレーム部材とリードフレーム部材の製造方法、及び該リードフレーム部材を用いた半導体パッケージとその製造方法
JP2003309241A (ja) 2002-04-15 2003-10-31 Dainippon Printing Co Ltd リードフレーム部材とリードフレーム部材の製造方法、及び該リードフレーム部材を用いた半導体パッケージとその製造方法
AU2003272405A1 (en) * 2002-09-17 2004-04-08 Chippac, Inc. Semiconductor multi-package module having wire bond interconnection between stacked packages
TWI228303B (en) * 2003-10-29 2005-02-21 Advanced Semiconductor Eng Semiconductor package, method for manufacturing the same and lead frame for use in the same
US7315077B2 (en) * 2003-11-13 2008-01-01 Fairchild Korea Semiconductor, Ltd. Molded leadless package having a partially exposed lead frame pad
US8395251B2 (en) * 2005-05-12 2013-03-12 Stats Chippac Ltd. Integrated circuit package to package stacking system
US7868471B2 (en) * 2007-09-13 2011-01-11 Stats Chippac Ltd. Integrated circuit package-in-package system with leads
JP6092645B2 (ja) * 2013-02-07 2017-03-08 エスアイアイ・セミコンダクタ株式会社 半導体装置
US9355945B1 (en) * 2015-09-02 2016-05-31 Freescale Semiconductor, Inc. Semiconductor device with heat-dissipating lead frame

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2568915B2 (ja) * 1989-07-19 1997-01-08 イビデン株式会社 Ｉｃカード
US20030038361A1 (en) 2001-08-23 2003-02-27 Akio Nakamura Semiconductor apparatus and method for fabricating the same

Also Published As

Publication number Publication date
JP6357371B2 (ja) 2018-07-11
CN105261605A (zh) 2016-01-20
US20160013120A1 (en) 2016-01-14
TW201603221A (zh) 2016-01-16
JP2016018931A (ja) 2016-02-01
KR20160006608A (ko) 2016-01-19
CN105261605B (zh) 2019-08-02
US9633933B2 (en) 2017-04-25
TWI650840B (zh) 2019-02-11

Similar Documents

Publication Publication Date Title
KR102402841B1 (ko) 리드 프레임, 반도체 장치, 및 리드 프레임의 제조 방법
US6437429B1 (en) Semiconductor package with metal pads
US7042068B2 (en) Leadframe and semiconductor package made using the leadframe
US8836101B2 (en) Multi-chip semiconductor packages and assembly thereof
US7635910B2 (en) Semiconductor package and method
US6157074A (en) Lead frame adapted for variable sized devices, semiconductor package with such lead frame and method for using same
CN101661893B (zh) 树脂密封型半导体装置及其制造方法、引线框
US8184453B1 (en) Increased capacity semiconductor package
US9275945B2 (en) Method of manufacturing semiconductor device and semiconductor device
CN110010489B (zh) 用于制作带有侧壁凹陷的半导体器件的方法及相关器件
US10840172B2 (en) Leadframe, semiconductor package including a leadframe and method for forming a semiconductor package
CN102576698A (zh) 具有增强的接地接合可靠性的引线框封装
KR20150105923A (ko) 반도체 장치 및 그 제조 방법
TWI775747B (zh) 半導體裝置之製造方法及半導體裝置
KR100621555B1 (ko) 리드 프레임, 이를 이용한 반도체 칩 패키지 및 그의 제조방법
JP2010199412A (ja) 樹脂封止型半導体装置、多面付樹脂封止型半導体装置、リードフレーム、および樹脂封止型半導体装置の製造方法
JP4530863B2 (ja) 樹脂封止型半導体装置
US20110062569A1 (en) Semiconductor device package with down-set leads
CN104952825A (zh) 包含具有槽口内引线的引线框架的半导体器件
JP5622128B2 (ja) 樹脂封止型半導体装置、多面付樹脂封止型半導体装置、リードフレーム、および樹脂封止型半導体装置の製造方法
JP3938525B2 (ja) 半導体装置の製造方法
HK1204506B (zh) 半导体装置以及半导体装置的制造方法

Legal Events

Date Code Title Description
PA0109 Patent application

St.27 status event code: A-0-1-A10-A12-nap-PA0109

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000

E13-X000 Pre-grant limitation requested

St.27 status event code: A-2-3-E10-E13-lim-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

R17-X000 Change to representative recorded

St.27 status event code: A-3-3-R10-R17-oth-X000

D13-X000 Search requested

St.27 status event code: A-1-2-D10-D13-srh-X000

D14-X000 Search report completed

St.27 status event code: A-1-2-D10-D14-srh-X000

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

E13-X000 Pre-grant limitation requested

St.27 status event code: A-2-3-E10-E13-lim-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U11-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 4

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000