CN105261605B - 引线框架、半导体装置以及引线框架的制造方法 - Google Patents

引线框架、半导体装置以及引线框架的制造方法 Download PDF

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Publication number
CN105261605B
CN105261605B CN201510395642.0A CN201510395642A CN105261605B CN 105261605 B CN105261605 B CN 105261605B CN 201510395642 A CN201510395642 A CN 201510395642A CN 105261605 B CN105261605 B CN 105261605B
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CN
China
Prior art keywords
lead
external connection
bonding pad
chip bonding
connection terminals
Prior art date
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Active
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CN201510395642.0A
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English (en)
Chinese (zh)
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CN105261605A (zh
Inventor
林真太郎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Co Ltd
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Shinko Electric Co Ltd
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Publication of CN105261605A publication Critical patent/CN105261605A/zh
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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H10W70/424—Cross-sectional shapes
    • H10W70/427—Bent parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/04—Manufacture or treatment of leadframes
    • H10W70/048—Mechanical treatments, e.g. punching, cutting, deforming or cold welding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
CN201510395642.0A 2014-07-09 2015-07-07 引线框架、半导体装置以及引线框架的制造方法 Active CN105261605B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014-141584 2014-07-09
JP2014141584A JP6357371B2 (ja) 2014-07-09 2014-07-09 リードフレーム、半導体装置及びリードフレームの製造方法

Publications (2)

Publication Number Publication Date
CN105261605A CN105261605A (zh) 2016-01-20
CN105261605B true CN105261605B (zh) 2019-08-02

Family

ID=55068140

Family Applications (1)

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CN201510395642.0A Active CN105261605B (zh) 2014-07-09 2015-07-07 引线框架、半导体装置以及引线框架的制造方法

Country Status (5)

Country Link
US (1) US9633933B2 (enExample)
JP (1) JP6357371B2 (enExample)
KR (1) KR102402841B1 (enExample)
CN (1) CN105261605B (enExample)
TW (1) TWI650840B (enExample)

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JP6840466B2 (ja) * 2016-03-08 2021-03-10 株式会社アムコー・テクノロジー・ジャパン 半導体パッケージ及び半導体パッケージの製造方法
JP6500822B2 (ja) * 2016-03-25 2019-04-17 トヨタ自動車株式会社 セレクタブルワンウェイクラッチ
JP6603169B2 (ja) * 2016-04-22 2019-11-06 ルネサスエレクトロニクス株式会社 半導体装置の製造方法および半導体装置
US9892999B2 (en) 2016-06-07 2018-02-13 Globalfoundries Inc. Producing wafer level packaging using leadframe strip and related device
US10109563B2 (en) * 2017-01-05 2018-10-23 Stmicroelectronics, Inc. Modified leadframe design with adhesive overflow recesses
JP7182374B2 (ja) * 2017-05-15 2022-12-02 新光電気工業株式会社 リードフレーム及びその製造方法
JP2020136324A (ja) * 2019-02-13 2020-08-31 セイコーエプソン株式会社 電子デバイスの製造方法
JP7338204B2 (ja) * 2019-04-01 2023-09-05 富士電機株式会社 半導体装置
EP4188303B1 (en) 2020-07-31 2025-11-26 The Procter & Gamble Company Wearable article comprising an elastic laminate having good wicking properties
WO2022021294A1 (en) 2020-07-31 2022-02-03 The Procter & Gamble Company Wearable article comprising an elastic laminate
EP4188298B1 (en) 2020-07-31 2025-06-11 The Procter & Gamble Company Wearable article comprising an elastic laminate
JP7479771B2 (ja) * 2020-10-01 2024-05-09 三菱電機株式会社 半導体装置、半導体装置の製造方法及び電力変換装置

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US4827611A (en) * 1988-03-28 1989-05-09 Control Data Corporation Compliant S-leads for chip carriers
US4996587A (en) * 1989-04-10 1991-02-26 International Business Machines Corporation Integrated semiconductor chip package
US6614100B1 (en) * 1996-06-24 2003-09-02 Infineon Technologies Ag Lead frame for the installation of an integrated circuit in an injection-molded package

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JP2568915B2 (ja) * 1989-07-19 1997-01-08 イビデン株式会社 Ｉｃカード
JPH05144992A (ja) * 1991-11-18 1993-06-11 Mitsubishi Electric Corp 半導体装置およびその製造方法ならびにその製造に使用されるリードフレームおよびその製造方法
JPH09260568A (ja) * 1996-03-27 1997-10-03 Mitsubishi Electric Corp 半導体装置及びその製造方法
KR980006174A (ko) * 1996-06-18 1998-03-30 문정환 버틈 리드 패키지
KR100214544B1 (ko) * 1996-12-28 1999-08-02 구본준 볼 그리드 어레이 반도체 패키지
US6329705B1 (en) * 1998-05-20 2001-12-11 Micron Technology, Inc. Leadframes including offsets extending from a major plane thereof, packaged semiconductor devices including same, and method of designing and fabricating such leadframes
KR100319616B1 (ko) * 1999-04-17 2002-01-05 김영환 리드프레임 및 이를 이용한 버텀리드 반도체패키지
JP4051531B2 (ja) * 1999-07-22 2008-02-27 セイコーエプソン株式会社 半導体装置及びその製造方法、回路基板並びに電子機器
KR100355749B1 (ko) * 1999-11-04 2002-10-19 앰코 테크놀로지 코리아 주식회사 리드 프레임의 구조와 그 제조방법 그리고 이 리드프레임을 적용한 반도체 패키지
US6320251B1 (en) * 2000-01-18 2001-11-20 Amkor Technology, Inc. Stackable package for an integrated circuit
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JP2003309241A (ja) 2002-04-15 2003-10-31 Dainippon Printing Co Ltd リードフレーム部材とリードフレーム部材の製造方法、及び該リードフレーム部材を用いた半導体パッケージとその製造方法
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TWI228303B (en) * 2003-10-29 2005-02-21 Advanced Semiconductor Eng Semiconductor package, method for manufacturing the same and lead frame for use in the same
US7315077B2 (en) * 2003-11-13 2008-01-01 Fairchild Korea Semiconductor, Ltd. Molded leadless package having a partially exposed lead frame pad
US8395251B2 (en) * 2005-05-12 2013-03-12 Stats Chippac Ltd. Integrated circuit package to package stacking system
US7868471B2 (en) * 2007-09-13 2011-01-11 Stats Chippac Ltd. Integrated circuit package-in-package system with leads
JP6092645B2 (ja) * 2013-02-07 2017-03-08 エスアイアイ・セミコンダクタ株式会社 半導体装置
US9355945B1 (en) * 2015-09-02 2016-05-31 Freescale Semiconductor, Inc. Semiconductor device with heat-dissipating lead frame

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4827611A (en) * 1988-03-28 1989-05-09 Control Data Corporation Compliant S-leads for chip carriers
US4996587A (en) * 1989-04-10 1991-02-26 International Business Machines Corporation Integrated semiconductor chip package
US6614100B1 (en) * 1996-06-24 2003-09-02 Infineon Technologies Ag Lead frame for the installation of an integrated circuit in an injection-molded package

Also Published As

Publication number Publication date
JP6357371B2 (ja) 2018-07-11
CN105261605A (zh) 2016-01-20
US20160013120A1 (en) 2016-01-14
TW201603221A (zh) 2016-01-16
KR102402841B1 (ko) 2022-05-27
JP2016018931A (ja) 2016-02-01
KR20160006608A (ko) 2016-01-19
US9633933B2 (en) 2017-04-25
TWI650840B (zh) 2019-02-11

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