JP2014030321A5 - - Google Patents

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Publication number
JP2014030321A5
JP2014030321A5 JP2012170279A JP2012170279A JP2014030321A5 JP 2014030321 A5 JP2014030321 A5 JP 2014030321A5 JP 2012170279 A JP2012170279 A JP 2012170279A JP 2012170279 A JP2012170279 A JP 2012170279A JP 2014030321 A5 JP2014030321 A5 JP 2014030321A5
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JP
Japan
Prior art keywords
terminal
wiring
end connected
inter
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2012170279A
Other languages
English (en)
Japanese (ja)
Other versions
JP2014030321A (ja
JP5710555B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2012170279A priority Critical patent/JP5710555B2/ja
Priority claimed from JP2012170279A external-priority patent/JP5710555B2/ja
Priority to US13/788,257 priority patent/US8866535B2/en
Priority to CN201310083762.8A priority patent/CN103579146A/zh
Publication of JP2014030321A publication Critical patent/JP2014030321A/ja
Publication of JP2014030321A5 publication Critical patent/JP2014030321A5/ja
Application granted granted Critical
Publication of JP5710555B2 publication Critical patent/JP5710555B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2012170279A 2012-07-31 2012-07-31 半導体装置 Active JP5710555B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2012170279A JP5710555B2 (ja) 2012-07-31 2012-07-31 半導体装置
US13/788,257 US8866535B2 (en) 2012-07-31 2013-03-07 Semiconductor device
CN201310083762.8A CN103579146A (zh) 2012-07-31 2013-03-15 半导体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012170279A JP5710555B2 (ja) 2012-07-31 2012-07-31 半導体装置

Publications (3)

Publication Number Publication Date
JP2014030321A JP2014030321A (ja) 2014-02-13
JP2014030321A5 true JP2014030321A5 (enExample) 2014-06-05
JP5710555B2 JP5710555B2 (ja) 2015-04-30

Family

ID=50024884

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012170279A Active JP5710555B2 (ja) 2012-07-31 2012-07-31 半導体装置

Country Status (3)

Country Link
US (1) US8866535B2 (enExample)
JP (1) JP5710555B2 (enExample)
CN (1) CN103579146A (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6427589B2 (ja) * 2014-02-14 2018-11-21 アーベーベー・シュバイツ・アーゲー ２つの補助エミッタ導体経路を有する半導体モジュール
DE112017000077T5 (de) * 2016-05-19 2018-04-19 Fuji Electric Co., Ltd. Halbleitervorrichtung mit isolierendem gate und verfahren zum herstellen einer halbleitervorrichtung mit isolierendem gate
JP6910726B2 (ja) * 2017-09-25 2021-07-28 三菱電機株式会社 半導体集積回路
JP7447480B2 (ja) * 2019-12-23 2024-03-12 富士電機株式会社 電子回路、半導体モジュール及び半導体装置
JP2023006385A (ja) * 2021-06-30 2023-01-18 株式会社Flosfia 半導体装置
JP7258113B1 (ja) * 2021-12-16 2023-04-14 三菱電機株式会社 電力変換装置
US11804837B1 (en) * 2022-06-15 2023-10-31 Delta Electronics, Inc. Switch circuit and power module
DE102023004643A1 (de) 2023-11-15 2025-05-15 Mercedes-Benz Group AG Vorrichtung und Verfahren zum Testen und zur Durchführung von Load- und Sourcedumps

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3696285A (en) * 1970-04-14 1972-10-03 Ibm Inverter circuits utilizing minority carrier injection in a semiconductor deivce
FR2770053B1 (fr) * 1997-10-22 2000-01-07 Sgs Thomson Microelectronics Circuit amplificateur a double gain
JP2003298355A (ja) * 2002-03-29 2003-10-17 Kawasaki Microelectronics Kk ミキサおよび差動アンプ
JP2004304330A (ja) * 2003-03-28 2004-10-28 Nec Electronics Corp 周波数特性可変増幅回路及び半導体集積回路装置
JP4115882B2 (ja) 2003-05-14 2008-07-09 株式会社ルネサステクノロジ 半導体装置
US7265623B2 (en) * 2004-08-03 2007-09-04 Scintera Networks, Inc. Differential amplifier having independently tunable base gain, peak gain and boost frequency, and uses of same
US7109798B2 (en) * 2004-10-29 2006-09-19 Broadcom Corporation Method and system for common mode feedback circuitry for RF buffers
JP2006319621A (ja) * 2005-05-12 2006-11-24 Matsushita Electric Ind Co Ltd 発振器およびこれを用いたｐｌｌ回路
US7599754B2 (en) * 2006-06-05 2009-10-06 National Institute Of Advanced Industrial Science And Technology Method and system for designing a power converter
ITMI20070141A1 (it) * 2007-01-30 2008-07-31 St Microelectronics Srl Circuito di pilotaggio per una configurazione emitter-switching di transistori
JP2009135774A (ja) * 2007-11-30 2009-06-18 Mitsubishi Electric Corp 差動アンプ回路
JP2009278772A (ja) * 2008-05-14 2009-11-26 Toyota Industries Corp インバータモジュール
JP5779025B2 (ja) * 2010-11-08 2015-09-16 株式会社東芝 半導体装置

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