JP2016039304A5 - - Google Patents

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Publication number
JP2016039304A5
JP2016039304A5 JP2014162643A JP2014162643A JP2016039304A5 JP 2016039304 A5 JP2016039304 A5 JP 2016039304A5 JP 2014162643 A JP2014162643 A JP 2014162643A JP 2014162643 A JP2014162643 A JP 2014162643A JP 2016039304 A5 JP2016039304 A5 JP 2016039304A5
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JP
Japan
Prior art keywords
region
metallization
electrode
semiconductor laser
chip
Prior art date
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Application number
JP2014162643A
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English (en)
Japanese (ja)
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JP2016039304A (ja
JP6542514B2 (ja
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Publication date
Application filed filed Critical
Priority to JP2014162643A priority Critical patent/JP6542514B2/ja
Priority claimed from JP2014162643A external-priority patent/JP6542514B2/ja
Priority to PCT/JP2015/003966 priority patent/WO2016021203A1/en
Priority to CN201580001570.5A priority patent/CN105518950B/zh
Publication of JP2016039304A publication Critical patent/JP2016039304A/ja
Publication of JP2016039304A5 publication Critical patent/JP2016039304A5/ja
Application granted granted Critical
Publication of JP6542514B2 publication Critical patent/JP6542514B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2014162643A 2014-08-08 2014-08-08 半導体レーザ装置 Active JP6542514B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2014162643A JP6542514B2 (ja) 2014-08-08 2014-08-08 半導体レーザ装置
PCT/JP2015/003966 WO2016021203A1 (en) 2014-08-08 2015-08-06 Laser assembly and method to assemble laser assembly
CN201580001570.5A CN105518950B (zh) 2014-08-08 2015-08-06 激光组件和组装激光组件的方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014162643A JP6542514B2 (ja) 2014-08-08 2014-08-08 半導体レーザ装置

Publications (3)

Publication Number Publication Date
JP2016039304A JP2016039304A (ja) 2016-03-22
JP2016039304A5 true JP2016039304A5 (enExample) 2017-07-27
JP6542514B2 JP6542514B2 (ja) 2019-07-10

Family

ID=55263494

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014162643A Active JP6542514B2 (ja) 2014-08-08 2014-08-08 半導体レーザ装置

Country Status (3)

Country Link
JP (1) JP6542514B2 (enExample)
CN (1) CN105518950B (enExample)
WO (1) WO2016021203A1 (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6794140B2 (ja) * 2016-05-23 2020-12-02 オプト エレクトロニクス ソリューションズ 光送信機及びこれを含む光モジュール
DE102017108050B4 (de) 2017-04-13 2022-01-13 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Halbleiterstrahlungsquelle
JP7097169B2 (ja) * 2017-10-27 2022-07-07 古河電気工業株式会社 光素子モジュール及び光素子モジュールの評価方法
JP2019087656A (ja) * 2017-11-08 2019-06-06 三菱電機株式会社 光モジュールおよびその製造方法
US11811191B2 (en) * 2019-08-22 2023-11-07 Sumitomo Electric Device Innovations, Inc. Optical semiconductor device and carrier
CN114556724B (zh) * 2019-10-25 2024-04-02 三菱电机株式会社 光半导体装置

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4547063B2 (ja) * 2000-02-24 2010-09-22 シチズン電子株式会社 レーザダイオード用マウント構造及びその実装方法
JP3889933B2 (ja) * 2001-03-02 2007-03-07 シャープ株式会社 半導体発光装置
JP4349552B2 (ja) * 2001-12-26 2009-10-21 株式会社Ｋｅｌｋ ペルチェ素子熱電変換モジュール、ペルチェ素子熱電変換モジュールの製造方法および光通信モジュール
JP2005203553A (ja) * 2004-01-15 2005-07-28 Matsushita Electric Ind Co Ltd 光送受信モジュールおよび光送受信装置
US7317742B2 (en) * 2004-02-19 2008-01-08 Sumitomo Electric Industries, Ltd. Optical sub-assembly having a thermo-electric cooler and an optical transceiver using the optical sub-assembly
JP4772560B2 (ja) * 2006-03-31 2011-09-14 住友電工デバイス・イノベーション株式会社 光半導体装置、およびその制御方法
JP4994173B2 (ja) * 2007-09-27 2012-08-08 京セラ株式会社 電子部品
JP2012119637A (ja) * 2010-12-03 2012-06-21 Sumitomo Electric Device Innovations Inc 光半導体装置の製造方法
US8821042B2 (en) * 2011-07-04 2014-09-02 Sumitomo Electic Industries, Ltd. Optical module with lens assembly directly mounted on carrier by soldering and laser diode indirectly mounted on carrier through sub-mount
JP2013074187A (ja) * 2011-09-28 2013-04-22 Oki Electric Ind Co Ltd モード同期半導体レーザ装置及びモード同期半導体レーザ装置の制御方法

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