CN105518950B - 激光组件和组装激光组件的方法 - Google Patents

激光组件和组装激光组件的方法 Download PDF

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Publication number
CN105518950B
CN105518950B CN201580001570.5A CN201580001570A CN105518950B CN 105518950 B CN105518950 B CN 105518950B CN 201580001570 A CN201580001570 A CN 201580001570A CN 105518950 B CN105518950 B CN 105518950B
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China
Prior art keywords
brazing material
area
mounting
region
capacitor
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CN201580001570.5A
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English (en)
Chinese (zh)
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CN105518950A (zh
Inventor
冈良喜
中泽敬司
宫田充宜
河村浩充
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Sumitomo Electric Device Innovations Inc
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Sumitomo Electric Device Innovations Inc
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Publication of CN105518950A publication Critical patent/CN105518950A/zh
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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0235—Method for mounting laser chips
    • H01S5/02355—Fixing laser chips on mounts
    • H01S5/0237—Fixing laser chips on mounts by soldering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/02208—Mountings; Housings characterised by the shape of the housings
    • H01S5/02216—Butterfly-type, i.e. with electrode pins extending horizontally from the housings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/026—Monolithically integrated components, e.g. waveguides, monitoring photo-detectors, drivers
    • H01S5/0261—Non-optical elements, e.g. laser driver components, heaters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/026—Monolithically integrated components, e.g. waveguides, monitoring photo-detectors, drivers
    • H01S5/0265—Intensity modulators
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/06—Arrangements for controlling the laser output parameters, e.g. by operating on the active medium
    • H01S5/062—Arrangements for controlling the laser output parameters, e.g. by operating on the active medium by varying the potential of the electrodes
    • H01S5/0625—Arrangements for controlling the laser output parameters, e.g. by operating on the active medium by varying the potential of the electrodes in multi-section lasers
    • H01S5/06255—Controlling the frequency of the radiation
    • H01S5/06256—Controlling the frequency of the radiation with DBR-structure

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Semiconductor Lasers (AREA)
CN201580001570.5A 2014-08-08 2015-08-06 激光组件和组装激光组件的方法 Active CN105518950B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2014-162643 2014-08-08
JP2014162643A JP6542514B2 (ja) 2014-08-08 2014-08-08 半導体レーザ装置
PCT/JP2015/003966 WO2016021203A1 (en) 2014-08-08 2015-08-06 Laser assembly and method to assemble laser assembly

Publications (2)

Publication Number Publication Date
CN105518950A CN105518950A (zh) 2016-04-20
CN105518950B true CN105518950B (zh) 2018-12-07

Family

ID=55263494

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201580001570.5A Active CN105518950B (zh) 2014-08-08 2015-08-06 激光组件和组装激光组件的方法

Country Status (3)

Country Link
JP (1) JP6542514B2 (enExample)
CN (1) CN105518950B (enExample)
WO (1) WO2016021203A1 (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6794140B2 (ja) * 2016-05-23 2020-12-02 オプト エレクトロニクス ソリューションズ 光送信機及びこれを含む光モジュール
DE102017108050B4 (de) 2017-04-13 2022-01-13 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Halbleiterstrahlungsquelle
JP7097169B2 (ja) * 2017-10-27 2022-07-07 古河電気工業株式会社 光素子モジュール及び光素子モジュールの評価方法
JP2019087656A (ja) * 2017-11-08 2019-06-06 三菱電機株式会社 光モジュールおよびその製造方法
US11811191B2 (en) * 2019-08-22 2023-11-07 Sumitomo Electric Device Innovations, Inc. Optical semiconductor device and carrier
CN114556724B (zh) * 2019-10-25 2024-04-02 三菱电机株式会社 光半导体装置

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001237481A (ja) * 2000-02-24 2001-08-31 Citizen Electronics Co Ltd レーザダイオード用マウント構造及びその実装方法
US20020121863A1 (en) * 2001-03-02 2002-09-05 Yukiko Morishita Semiconductor light-emitting device
JP2003197982A (ja) * 2001-12-26 2003-07-11 Komatsu Electronics Inc 金スズ接合ペルチェ素子熱電変換モジュール
US20050214957A1 (en) * 2004-02-19 2005-09-29 Toshiaki Kihara Method for manufacturing a transmitting optical sub-assembly with a thermo-electric cooler therein
CN1902763A (zh) * 2004-01-15 2007-01-24 松下电器产业株式会社 光学收发器模组和光学收发器
US20120138665A1 (en) * 2010-12-03 2012-06-07 Sumitomo Electric Device Innovations, Inc. Method for fabricating optical semiconductor device
US20130011104A1 (en) * 2011-07-04 2013-01-10 Sumitomo Electric Industries, Ltd. Optical module with lens assembly soldered to carrier

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4772560B2 (ja) * 2006-03-31 2011-09-14 住友電工デバイス・イノベーション株式会社 光半導体装置、およびその制御方法
JP4994173B2 (ja) * 2007-09-27 2012-08-08 京セラ株式会社 電子部品
JP2013074187A (ja) * 2011-09-28 2013-04-22 Oki Electric Ind Co Ltd モード同期半導体レーザ装置及びモード同期半導体レーザ装置の制御方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001237481A (ja) * 2000-02-24 2001-08-31 Citizen Electronics Co Ltd レーザダイオード用マウント構造及びその実装方法
US20020121863A1 (en) * 2001-03-02 2002-09-05 Yukiko Morishita Semiconductor light-emitting device
JP2003197982A (ja) * 2001-12-26 2003-07-11 Komatsu Electronics Inc 金スズ接合ペルチェ素子熱電変換モジュール
CN1902763A (zh) * 2004-01-15 2007-01-24 松下电器产业株式会社 光学收发器模组和光学收发器
US20050214957A1 (en) * 2004-02-19 2005-09-29 Toshiaki Kihara Method for manufacturing a transmitting optical sub-assembly with a thermo-electric cooler therein
US20120138665A1 (en) * 2010-12-03 2012-06-07 Sumitomo Electric Device Innovations, Inc. Method for fabricating optical semiconductor device
US20130011104A1 (en) * 2011-07-04 2013-01-10 Sumitomo Electric Industries, Ltd. Optical module with lens assembly soldered to carrier

Also Published As

Publication number Publication date
JP2016039304A (ja) 2016-03-22
JP6542514B2 (ja) 2019-07-10
CN105518950A (zh) 2016-04-20
WO2016021203A1 (en) 2016-02-11

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