WO2015189056A3 - Optoelektronisches halbleiterbauelement - Google Patents

Optoelektronisches halbleiterbauelement Download PDF

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Publication number
WO2015189056A3
WO2015189056A3 PCT/EP2015/062009 EP2015062009W WO2015189056A3 WO 2015189056 A3 WO2015189056 A3 WO 2015189056A3 EP 2015062009 W EP2015062009 W EP 2015062009W WO 2015189056 A3 WO2015189056 A3 WO 2015189056A3
Authority
WO
WIPO (PCT)
Prior art keywords
semiconductor
layer
current spreading
semiconductor layer
semiconductor component
Prior art date
Application number
PCT/EP2015/062009
Other languages
English (en)
French (fr)
Other versions
WO2015189056A2 (de
Inventor
Korbinian Perzlmaier
Fabian Kopp
Christian Eichinger
Björn MUERMANN
Original Assignee
Osram Opto Semiconductors Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram Opto Semiconductors Gmbh filed Critical Osram Opto Semiconductors Gmbh
Priority to US15/310,558 priority Critical patent/US9859463B2/en
Publication of WO2015189056A2 publication Critical patent/WO2015189056A2/de
Publication of WO2015189056A3 publication Critical patent/WO2015189056A3/de

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/14—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a carrier transport control structure, e.g. highly-doped semiconductor layer or current-blocking structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/20—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate
    • H01L33/22—Roughened surfaces, e.g. at the interface between epitaxial layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/36—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
    • H01L33/38—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes with a particular shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/36—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
    • H01L33/40—Materials therefor
    • H01L33/42—Transparent materials

Abstract

Es wird ein optoelektronisches Halbleiterbauelement (1) mit einem Halbleiterkörper (2), der eine Halbleiterschichtenfolge mit einem zum Erzeugen von Strahlung vorgesehenen aktiven Bereich (20), einer Halbleiterschicht (21) und einer weiteren Halbleiterschicht (22) aufweist, angegeben, wobei der aktive Bereich zwischen der Halbleiterschicht und der weiteren Halbleiterschicht angeordnet ist; auf einer Strahlungsaustrittsfläche (210) des Halbleiterkörpers eine Stromaufweitungsschicht angeordnet ist; die Stromaufweitungsschicht elektrisch leitend mit einer Kontaktstruktur (4) für die externe elektrische Kontaktierung der Halbleiterschicht verbunden ist; die Stromaufweitungsschicht in Draufsicht auf das Halbleiterbauelement in einem Anschlussbereich (30) an die Halbleiterschicht angrenzt, und die Stromaufweitungsschicht eine Strukturierung (31) mit einer Mehrzahl von Ausnehmungen (35) aufweist, durch die im Betrieb Strahlung aus dem Halbleiterbauelement austritt.
PCT/EP2015/062009 2014-06-12 2015-05-29 Optoelektronisches halbleiterbauelement WO2015189056A2 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US15/310,558 US9859463B2 (en) 2014-06-12 2015-05-29 Optoelectronic semiconductor device

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102014108300.8A DE102014108300B4 (de) 2014-06-12 2014-06-12 Optoelektronische Halbleiterbauelemente
DE102014108300.8 2014-06-12

Publications (2)

Publication Number Publication Date
WO2015189056A2 WO2015189056A2 (de) 2015-12-17
WO2015189056A3 true WO2015189056A3 (de) 2016-02-04

Family

ID=53268824

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2015/062009 WO2015189056A2 (de) 2014-06-12 2015-05-29 Optoelektronisches halbleiterbauelement

Country Status (4)

Country Link
US (1) US9859463B2 (de)
DE (1) DE102014108300B4 (de)
TW (1) TWI569465B (de)
WO (1) WO2015189056A2 (de)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6697275B2 (ja) * 2016-01-22 2020-05-20 スタンレー電気株式会社 半導体発光装置、照明装置、および、車両用照明装置
DE102016116986A1 (de) 2016-09-09 2018-03-15 Osram Opto Semiconductors Gmbh Bauelement zur Darstellung eines Piktogramms und Verfahren zur Herstellung eines Bauelements
DE102017117504A1 (de) * 2017-08-02 2019-02-07 Osram Opto Semiconductors Gmbh Lichtemittierender Halbleiterchip und optoelektronisches Bauteil
DE102018111324A1 (de) * 2018-05-11 2019-11-14 Osram Opto Semiconductors Gmbh Optoelektronischer Halbleiterchip
DE102018131579A1 (de) * 2018-12-10 2020-06-10 Osram Opto Semiconductors Gmbh Optoelektronisches bauteil und verfahren zur herstellung eines optoelektronischen bauteils
DE102019114169A1 (de) * 2019-05-27 2020-12-03 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelektronisches halbleiterbauelement mit verbindungsbereichen und verfahren zur herstellung des optoelektronischen halbleiterbauelements

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100072487A1 (en) * 2008-09-22 2010-03-25 Industrial Technology Research Institute Light emitting diode, package structure and manufacturing method thereof
JP2010074182A (ja) * 2009-12-17 2010-04-02 Mitsubishi Chemicals Corp 窒化物半導体発光素子
US20100197055A1 (en) * 2003-08-19 2010-08-05 Hisanori Tanaka Semiconductor light emitting device with protrusions to improve external efficiency and crystal growth
EP2226859A2 (de) * 2009-03-03 2010-09-08 Kabushiki Kaisha Toshiba Lichtemittierendes Halbleiterbauelement
CN102479903A (zh) * 2010-11-25 2012-05-30 同方光电科技有限公司 一种能增强横向电流扩展的发光二极管

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6335546B1 (en) 1998-07-31 2002-01-01 Sharp Kabushiki Kaisha Nitride semiconductor structure, method for producing a nitride semiconductor structure, and light emitting device
JP3556916B2 (ja) 2000-09-18 2004-08-25 三菱電線工業株式会社 半導体基材の製造方法
DE10346605B4 (de) * 2003-08-29 2022-02-24 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Strahlungemittierendes Halbleiterbauelement
JP4549434B2 (ja) 2008-02-13 2010-09-22 三洋電機株式会社 モータ駆動装置
KR100986560B1 (ko) * 2010-02-11 2010-10-07 엘지이노텍 주식회사 발광소자 및 그 제조방법
JP5687858B2 (ja) * 2010-07-30 2015-03-25 スタンレー電気株式会社 半導体発光装置
US9056422B2 (en) * 2013-04-09 2015-06-16 Massachusetts Institute Of Technology Methods and apparatus for encoded textures

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100197055A1 (en) * 2003-08-19 2010-08-05 Hisanori Tanaka Semiconductor light emitting device with protrusions to improve external efficiency and crystal growth
US20100072487A1 (en) * 2008-09-22 2010-03-25 Industrial Technology Research Institute Light emitting diode, package structure and manufacturing method thereof
EP2226859A2 (de) * 2009-03-03 2010-09-08 Kabushiki Kaisha Toshiba Lichtemittierendes Halbleiterbauelement
JP2010074182A (ja) * 2009-12-17 2010-04-02 Mitsubishi Chemicals Corp 窒化物半導体発光素子
CN102479903A (zh) * 2010-11-25 2012-05-30 同方光电科技有限公司 一种能增强横向电流扩展的发光二极管

Also Published As

Publication number Publication date
DE102014108300B4 (de) 2022-02-24
US9859463B2 (en) 2018-01-02
TW201607077A (zh) 2016-02-16
DE102014108300A1 (de) 2015-12-17
TWI569465B (zh) 2017-02-01
WO2015189056A2 (de) 2015-12-17
US20170092808A1 (en) 2017-03-30

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