JP2015035554A5 - - Google Patents

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Publication number
JP2015035554A5
JP2015035554A5 JP2013166808A JP2013166808A JP2015035554A5 JP 2015035554 A5 JP2015035554 A5 JP 2015035554A5 JP 2013166808 A JP2013166808 A JP 2013166808A JP 2013166808 A JP2013166808 A JP 2013166808A JP 2015035554 A5 JP2015035554 A5 JP 2015035554A5
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JP
Japan
Prior art keywords
terminal
exposed
resin sealing
sealing portion
die pad
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2013166808A
Other languages
English (en)
Japanese (ja)
Other versions
JP2015035554A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2013166808A priority Critical patent/JP2015035554A/ja
Priority claimed from JP2013166808A external-priority patent/JP2015035554A/ja
Publication of JP2015035554A publication Critical patent/JP2015035554A/ja
Publication of JP2015035554A5 publication Critical patent/JP2015035554A5/ja
Pending legal-status Critical Current

Links

JP2013166808A 2013-08-09 2013-08-09 半導体装置 Pending JP2015035554A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2013166808A JP2015035554A (ja) 2013-08-09 2013-08-09 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013166808A JP2015035554A (ja) 2013-08-09 2013-08-09 半導体装置

Publications (2)

Publication Number Publication Date
JP2015035554A JP2015035554A (ja) 2015-02-19
JP2015035554A5 true JP2015035554A5 (enExample) 2016-09-23

Family

ID=52543869

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013166808A Pending JP2015035554A (ja) 2013-08-09 2013-08-09 半導体装置

Country Status (1)

Country Link
JP (1) JP2015035554A (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6791794B2 (ja) * 2017-03-29 2020-11-25 旭化成エレクトロニクス株式会社 半導体装置
CN111615747B (zh) * 2017-12-27 2023-10-03 三菱电机株式会社 半导体装置
CN108831871A (zh) * 2018-06-08 2018-11-16 郑州云海信息技术有限公司 一种提升qfn封装零件焊接质量的设计方法
US11145578B2 (en) * 2019-09-24 2021-10-12 Infineon Technologies Ag Semiconductor package with top or bottom side cooling and method for manufacturing the semiconductor package
JP7636186B2 (ja) * 2021-02-02 2025-02-26 ローム株式会社 半導体装置および検査方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3461720B2 (ja) * 1998-04-20 2003-10-27 松下電器産業株式会社 樹脂封止型半導体装置
JP2001177007A (ja) * 1999-12-21 2001-06-29 Hitachi Ltd 半導体装置及びその製造方法
JP3524545B2 (ja) * 2002-01-23 2004-05-10 松下電器産業株式会社 回路部品内蔵モジュールの製造方法
KR20060121823A (ko) * 2003-08-26 2006-11-29 어드밴스드 인터커넥트 테크놀로지스 리미티드 가역 리드리스 패키지, 및 이를 제조 및 사용하기 위한방법

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