JP2015035554A - 半導体装置 - Google Patents

半導体装置 Download PDF

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Publication number
JP2015035554A
JP2015035554A JP2013166808A JP2013166808A JP2015035554A JP 2015035554 A JP2015035554 A JP 2015035554A JP 2013166808 A JP2013166808 A JP 2013166808A JP 2013166808 A JP2013166808 A JP 2013166808A JP 2015035554 A JP2015035554 A JP 2015035554A
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JP
Japan
Prior art keywords
wiring
chip
terminal
resin sealing
semiconductor device
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Pending
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JP2013166808A
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English (en)
Japanese (ja)
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JP2015035554A5 (enExample
Inventor
真吾 井上
Shingo Inoue
真吾 井上
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Electric Device Innovations Inc
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Sumitomo Electric Device Innovations Inc
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Application filed by Sumitomo Electric Device Innovations Inc filed Critical Sumitomo Electric Device Innovations Inc
Priority to JP2013166808A priority Critical patent/JP2015035554A/ja
Publication of JP2015035554A publication Critical patent/JP2015035554A/ja
Publication of JP2015035554A5 publication Critical patent/JP2015035554A5/ja
Pending legal-status Critical Current

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    • H10W72/884—
    • H10W90/736—
    • H10W90/753—
    • H10W90/756—

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  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP2013166808A 2013-08-09 2013-08-09 半導体装置 Pending JP2015035554A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2013166808A JP2015035554A (ja) 2013-08-09 2013-08-09 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013166808A JP2015035554A (ja) 2013-08-09 2013-08-09 半導体装置

Publications (2)

Publication Number Publication Date
JP2015035554A true JP2015035554A (ja) 2015-02-19
JP2015035554A5 JP2015035554A5 (enExample) 2016-09-23

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ID=52543869

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JP2013166808A Pending JP2015035554A (ja) 2013-08-09 2013-08-09 半導体装置

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JP (1) JP2015035554A (enExample)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018170331A (ja) * 2017-03-29 2018-11-01 旭化成エレクトロニクス株式会社 半導体装置
CN108831871A (zh) * 2018-06-08 2018-11-16 郑州云海信息技术有限公司 一种提升qfn封装零件焊接质量的设计方法
KR20200087200A (ko) * 2017-12-27 2020-07-20 미쓰비시덴키 가부시키가이샤 반도체 장치
CN112635411A (zh) * 2019-09-24 2021-04-09 英飞凌科技股份有限公司 具有顶侧或底侧冷却的半导体封装
JP2022118411A (ja) * 2021-02-02 2022-08-15 ローム株式会社 半導体装置および検査方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11307675A (ja) * 1998-04-20 1999-11-05 Matsushita Electron Corp 樹脂封止型半導体装置及びその製造方法
JP2001177007A (ja) * 1999-12-21 2001-06-29 Hitachi Ltd 半導体装置及びその製造方法
JP2003289128A (ja) * 2002-01-23 2003-10-10 Matsushita Electric Ind Co Ltd 回路部品内蔵モジュールおよびその製造方法
JP2007503721A (ja) * 2003-08-26 2007-02-22 アドバンスド インターコネクト テクノロジーズ リミテッド リバーシブル・リードレス・パッケージとその製造および使用方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11307675A (ja) * 1998-04-20 1999-11-05 Matsushita Electron Corp 樹脂封止型半導体装置及びその製造方法
JP2001177007A (ja) * 1999-12-21 2001-06-29 Hitachi Ltd 半導体装置及びその製造方法
JP2003289128A (ja) * 2002-01-23 2003-10-10 Matsushita Electric Ind Co Ltd 回路部品内蔵モジュールおよびその製造方法
JP2007503721A (ja) * 2003-08-26 2007-02-22 アドバンスド インターコネクト テクノロジーズ リミテッド リバーシブル・リードレス・パッケージとその製造および使用方法

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018170331A (ja) * 2017-03-29 2018-11-01 旭化成エレクトロニクス株式会社 半導体装置
KR20200087200A (ko) * 2017-12-27 2020-07-20 미쓰비시덴키 가부시키가이샤 반도체 장치
KR102351764B1 (ko) * 2017-12-27 2022-01-14 미쓰비시덴키 가부시키가이샤 반도체 장치
US11335619B2 (en) 2017-12-27 2022-05-17 Mitsubishi Electric Corporation Semiconductor device
CN108831871A (zh) * 2018-06-08 2018-11-16 郑州云海信息技术有限公司 一种提升qfn封装零件焊接质量的设计方法
CN112635411A (zh) * 2019-09-24 2021-04-09 英飞凌科技股份有限公司 具有顶侧或底侧冷却的半导体封装
JP2022118411A (ja) * 2021-02-02 2022-08-15 ローム株式会社 半導体装置および検査方法
JP7636186B2 (ja) 2021-02-02 2025-02-26 ローム株式会社 半導体装置および検査方法

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