JP2014103148A5 - - Google Patents

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Publication number
JP2014103148A5
JP2014103148A5 JP2012252211A JP2012252211A JP2014103148A5 JP 2014103148 A5 JP2014103148 A5 JP 2014103148A5 JP 2012252211 A JP2012252211 A JP 2012252211A JP 2012252211 A JP2012252211 A JP 2012252211A JP 2014103148 A5 JP2014103148 A5 JP 2014103148A5
Authority
JP
Japan
Prior art keywords
groove portion
light emitting
substrate
wiring portions
emitting element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2012252211A
Other languages
English (en)
Japanese (ja)
Other versions
JP6079159B2 (ja
JP2014103148A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from JP2012252211A external-priority patent/JP6079159B2/ja
Priority to JP2012252211A priority Critical patent/JP6079159B2/ja
Priority to US14/080,495 priority patent/US9279571B2/en
Priority to CA2833466A priority patent/CA2833466C/en
Priority to CN201310572217.5A priority patent/CN103824847B/zh
Priority to EP13193261.8A priority patent/EP2733751B1/en
Publication of JP2014103148A publication Critical patent/JP2014103148A/ja
Publication of JP2014103148A5 publication Critical patent/JP2014103148A5/ja
Publication of JP6079159B2 publication Critical patent/JP6079159B2/ja
Application granted granted Critical
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2012252211A 2012-11-16 2012-11-16 発光装置 Active JP6079159B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2012252211A JP6079159B2 (ja) 2012-11-16 2012-11-16 発光装置
US14/080,495 US9279571B2 (en) 2012-11-16 2013-11-14 Light emitting device
CA2833466A CA2833466C (en) 2012-11-16 2013-11-15 Light emitting device
CN201310572217.5A CN103824847B (zh) 2012-11-16 2013-11-15 发光装置
EP13193261.8A EP2733751B1 (en) 2012-11-16 2013-11-18 Light Emitting Device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012252211A JP6079159B2 (ja) 2012-11-16 2012-11-16 発光装置

Publications (3)

Publication Number Publication Date
JP2014103148A JP2014103148A (ja) 2014-06-05
JP2014103148A5 true JP2014103148A5 (enExample) 2015-12-24
JP6079159B2 JP6079159B2 (ja) 2017-02-15

Family

ID=49619819

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012252211A Active JP6079159B2 (ja) 2012-11-16 2012-11-16 発光装置

Country Status (5)

Country Link
US (1) US9279571B2 (enExample)
EP (1) EP2733751B1 (enExample)
JP (1) JP6079159B2 (enExample)
CN (1) CN103824847B (enExample)
CA (1) CA2833466C (enExample)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102014110781A1 (de) * 2014-07-30 2016-02-04 Osram Opto Semiconductors Gmbh Herstellung einer Vorrichtung und Vorrichtung
JP6458492B2 (ja) * 2014-12-25 2019-01-30 大日本印刷株式会社 Ｌｅｄ素子用基板、及びそれを用いたｌｅｄ実装モジュールの製造方法
JP6458493B2 (ja) * 2014-12-25 2019-01-30 大日本印刷株式会社 Ｌｅｄ素子用基板、及びそれを用いたｌｅｄ実装モジュールの製造方法
JP2016167034A (ja) * 2015-03-10 2016-09-15 株式会社東芝 表示装置、発光装置及びライトユニット
JP2017034218A (ja) * 2015-08-03 2017-02-09 株式会社東芝 半導体発光装置
JP7014948B2 (ja) * 2017-06-13 2022-02-02 日亜化学工業株式会社 発光装置の製造方法および発光装置
DE102017130008A1 (de) * 2017-12-14 2019-06-19 Siteco Beleuchtungstechnik Gmbh Led-bauteil mit kachelartigem muster von kontaktflächen
CN209431157U (zh) * 2019-02-10 2019-09-24 中山市蓝德电子有限公司 一种柔性led倒装软灯条
JP7001937B2 (ja) * 2019-03-28 2022-02-04 日亜化学工業株式会社 発光装置
US11227985B2 (en) 2019-03-28 2022-01-18 Nichia Corporation Light-emitting device
KR102751425B1 (ko) * 2019-09-04 2025-01-13 삼성디스플레이 주식회사 표시 장치
KR102794235B1 (ko) * 2019-12-27 2025-04-15 삼성디스플레이 주식회사 표시 장치
US11487194B2 (en) * 2020-12-25 2022-11-01 Seiko Epson Corporation Wavelength conversion element, light source device, and projector
JP7389363B2 (ja) * 2021-05-26 2023-11-30 日亜化学工業株式会社 発光装置

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0770363B2 (ja) * 1987-02-28 1995-07-31 イビデン株式会社 印刷抵抗体付プリント配線板
JPH0525749U (ja) * 1991-09-10 1993-04-02 株式会社小糸製作所 チツプ型発光ダイオードの取付構造
JPH0545812U (ja) 1991-11-22 1993-06-18 株式会社小糸製作所 車輌用灯具
JP2000188001A (ja) 1998-12-21 2000-07-04 Hiyoshi Denshi Kk Ｌｅｄ報知灯
DE10025563B4 (de) * 2000-05-24 2005-12-01 Osram Opto Semiconductors Gmbh Modul für die Anordnung von elektrischen lichtemittierenden Elementen,integrierbar in ein Leuchtengehäuse,und Verfahren zur Herstellung eines derartigen Moduls
JP4724965B2 (ja) * 2001-07-10 2011-07-13 ソニー株式会社 フレキシブル配線基板
JP2004103993A (ja) 2002-09-12 2004-04-02 Ichikoh Ind Ltd Ｌｅｄ設置用フレキシブル基板及びそのｌｅｄ設置用フレキシブル基板を用いた車両用灯具
JP2004356144A (ja) 2003-05-27 2004-12-16 Fujikura Ltd 部品実装フレキシブル回路基板
US20050247944A1 (en) 2004-05-05 2005-11-10 Haque Ashim S Semiconductor light emitting device with flexible substrate
WO2006037068A2 (en) 2004-09-28 2006-04-06 Intraglobal Corporation Method for micropackaging of leds and micropackage
EP1875519A2 (en) 2005-03-30 2008-01-09 Koninklijke Philips Electronics N.V. Flexible led array
US8567992B2 (en) * 2006-09-12 2013-10-29 Huizhou Light Engine Ltd. Integrally formed light emitting diode light wire and uses thereof
ATE503149T1 (de) * 2006-09-12 2011-04-15 Paul Lo Integral geformter einteiliger leuchtdraht für eine lichtemissionsdiode
RU2419740C1 (ru) 2007-02-16 2011-05-27 Шарп Кабусики Кайся Устройство подсветки и устройство плоского дисплея, использующее его
KR101476423B1 (ko) * 2008-05-23 2014-12-26 서울반도체 주식회사 Ｌｅｄ 패키지
AU2011213705B2 (en) 2009-01-16 2011-10-27 Huizhou Light Engine Ltd. Integrally formed single piece light emitting diode light wire and uses thereof
JP5659519B2 (ja) 2009-11-19 2015-01-28 豊田合成株式会社 発光装置、発光装置の製造方法、発光装置の実装方法及び光源装置
JP5533183B2 (ja) 2010-04-20 2014-06-25 日亜化学工業株式会社 Ｌｅｄ光源装置及びその製造方法
CN201638816U (zh) * 2010-04-21 2010-11-17 广州南科集成电子有限公司 Led集成光源板及专用模具
JP5885922B2 (ja) 2010-12-28 2016-03-16 日亜化学工業株式会社 発光装置
CN103460813B (zh) 2011-03-22 2017-07-11 飞利浦照明控股有限公司 用于安装多个发光元件的基板

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