JP5710555B2 - 半導体装置 - Google Patents

半導体装置 Download PDF

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Publication number
JP5710555B2
JP5710555B2 JP2012170279A JP2012170279A JP5710555B2 JP 5710555 B2 JP5710555 B2 JP 5710555B2 JP 2012170279 A JP2012170279 A JP 2012170279A JP 2012170279 A JP2012170279 A JP 2012170279A JP 5710555 B2 JP5710555 B2 JP 5710555B2
Authority
JP
Japan
Prior art keywords
wiring
terminal
switching element
resistor
inductance
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2012170279A
Other languages
English (en)
Japanese (ja)
Other versions
JP2014030321A5 (enExample
JP2014030321A (ja
Inventor
和人 高尾
和人 高尾
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP2012170279A priority Critical patent/JP5710555B2/ja
Priority to US13/788,257 priority patent/US8866535B2/en
Priority to CN201310083762.8A priority patent/CN103579146A/zh
Publication of JP2014030321A publication Critical patent/JP2014030321A/ja
Publication of JP2014030321A5 publication Critical patent/JP2014030321A5/ja
Application granted granted Critical
Publication of JP5710555B2 publication Critical patent/JP5710555B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03K—PULSE TECHNIQUE
    • H03K17/00—Electronic switching or gating, i.e. not by contact-making and –breaking
    • H03K17/51—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the components used
    • H03K17/56—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the components used by the use, as active elements, of semiconductor devices
    • H03K17/687—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the components used by the use, as active elements, of semiconductor devices the devices being field-effect transistors
    • H03K17/6871—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the components used by the use, as active elements, of semiconductor devices the devices being field-effect transistors the output circuit comprising more than one controlled field-effect transistor
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03K—PULSE TECHNIQUE
    • H03K17/00—Electronic switching or gating, i.e. not by contact-making and –breaking
    • H03K17/12—Modifications for increasing the maximum permissible switched current
    • H03K17/127—Modifications for increasing the maximum permissible switched current in composite switches
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03K—PULSE TECHNIQUE
    • H03K17/00—Electronic switching or gating, i.e. not by contact-making and –breaking
    • H03K17/51—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the components used
    • H03K17/56—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the components used by the use, as active elements, of semiconductor devices
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03K—PULSE TECHNIQUE
    • H03K17/00—Electronic switching or gating, i.e. not by contact-making and –breaking
    • H03K17/51—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the components used
    • H03K17/56—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the components used by the use, as active elements, of semiconductor devices
    • H03K17/60—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the components used by the use, as active elements, of semiconductor devices the devices being bipolar transistors
    • H03K17/64—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the components used by the use, as active elements, of semiconductor devices the devices being bipolar transistors having inductive loads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49175—Parallel arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1305—Bipolar Junction Transistor [BJT]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1305—Bipolar Junction Transistor [BJT]
    • H01L2924/13055—Insulated gate bipolar transistor [IGBT]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1306—Field-effect transistor [FET]
    • H01L2924/13091—Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]

Landscapes

  • Power Conversion In General (AREA)
JP2012170279A 2012-07-31 2012-07-31 半導体装置 Active JP5710555B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2012170279A JP5710555B2 (ja) 2012-07-31 2012-07-31 半導体装置
US13/788,257 US8866535B2 (en) 2012-07-31 2013-03-07 Semiconductor device
CN201310083762.8A CN103579146A (zh) 2012-07-31 2013-03-15 半导体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012170279A JP5710555B2 (ja) 2012-07-31 2012-07-31 半導体装置

Publications (3)

Publication Number Publication Date
JP2014030321A JP2014030321A (ja) 2014-02-13
JP2014030321A5 JP2014030321A5 (enExample) 2014-06-05
JP5710555B2 true JP5710555B2 (ja) 2015-04-30

Family

ID=50024884

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012170279A Active JP5710555B2 (ja) 2012-07-31 2012-07-31 半導体装置

Country Status (3)

Country Link
US (1) US8866535B2 (enExample)
JP (1) JP5710555B2 (enExample)
CN (1) CN103579146A (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6427589B2 (ja) * 2014-02-14 2018-11-21 アーベーベー・シュバイツ・アーゲー ２つの補助エミッタ導体経路を有する半導体モジュール
CN108028646B (zh) * 2016-05-19 2021-05-11 富士电机株式会社 绝缘栅型半导体装置以及绝缘栅型半导体装置的制造方法
JP6910726B2 (ja) * 2017-09-25 2021-07-28 三菱電機株式会社 半導体集積回路
JP7447480B2 (ja) * 2019-12-23 2024-03-12 富士電機株式会社 電子回路、半導体モジュール及び半導体装置
JP2023006385A (ja) * 2021-06-30 2023-01-18 株式会社Flosfia 半導体装置
JP7258113B1 (ja) * 2021-12-16 2023-04-14 三菱電機株式会社 電力変換装置
US11804837B1 (en) * 2022-06-15 2023-10-31 Delta Electronics, Inc. Switch circuit and power module
DE102023004643A1 (de) 2023-11-15 2025-05-15 Mercedes-Benz Group AG Vorrichtung und Verfahren zum Testen und zur Durchführung von Load- und Sourcedumps

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3696285A (en) * 1970-04-14 1972-10-03 Ibm Inverter circuits utilizing minority carrier injection in a semiconductor deivce
FR2770053B1 (fr) * 1997-10-22 2000-01-07 Sgs Thomson Microelectronics Circuit amplificateur a double gain
JP2003298355A (ja) * 2002-03-29 2003-10-17 Kawasaki Microelectronics Kk ミキサおよび差動アンプ
JP2004304330A (ja) * 2003-03-28 2004-10-28 Nec Electronics Corp 周波数特性可変増幅回路及び半導体集積回路装置
JP4115882B2 (ja) 2003-05-14 2008-07-09 株式会社ルネサステクノロジ 半導体装置
US7265623B2 (en) * 2004-08-03 2007-09-04 Scintera Networks, Inc. Differential amplifier having independently tunable base gain, peak gain and boost frequency, and uses of same
US7109798B2 (en) * 2004-10-29 2006-09-19 Broadcom Corporation Method and system for common mode feedback circuitry for RF buffers
JP2006319621A (ja) * 2005-05-12 2006-11-24 Matsushita Electric Ind Co Ltd 発振器およびこれを用いたｐｌｌ回路
US7599754B2 (en) * 2006-06-05 2009-10-06 National Institute Of Advanced Industrial Science And Technology Method and system for designing a power converter
ITMI20070141A1 (it) * 2007-01-30 2008-07-31 St Microelectronics Srl Circuito di pilotaggio per una configurazione emitter-switching di transistori
JP2009135774A (ja) * 2007-11-30 2009-06-18 Mitsubishi Electric Corp 差動アンプ回路
JP2009278772A (ja) * 2008-05-14 2009-11-26 Toyota Industries Corp インバータモジュール
JP5779025B2 (ja) * 2010-11-08 2015-09-16 株式会社東芝 半導体装置

Also Published As

Publication number Publication date
US20140035656A1 (en) 2014-02-06
US8866535B2 (en) 2014-10-21
JP2014030321A (ja) 2014-02-13
CN103579146A (zh) 2014-02-12

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