JP2006253430A5 - - Google Patents

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Publication number
JP2006253430A5
JP2006253430A5 JP2005068362A JP2005068362A JP2006253430A5 JP 2006253430 A5 JP2006253430 A5 JP 2006253430A5 JP 2005068362 A JP2005068362 A JP 2005068362A JP 2005068362 A JP2005068362 A JP 2005068362A JP 2006253430 A5 JP2006253430 A5 JP 2006253430A5
Authority
JP
Japan
Prior art keywords
semiconductor chip
substrate
wire
electrically connected
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2005068362A
Other languages
English (en)
Japanese (ja)
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JP2006253430A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2005068362A priority Critical patent/JP2006253430A/ja
Priority claimed from JP2005068362A external-priority patent/JP2006253430A/ja
Priority to TW095105771A priority patent/TW200731140A/zh
Priority to KR1020060022185A priority patent/KR20060097661A/ko
Priority to CNA2006100568496A priority patent/CN1832166A/zh
Priority to US11/371,929 priority patent/US7352588B2/en
Publication of JP2006253430A publication Critical patent/JP2006253430A/ja
Priority to US12/037,588 priority patent/US20080153205A1/en
Publication of JP2006253430A5 publication Critical patent/JP2006253430A5/ja
Withdrawn legal-status Critical Current

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JP2005068362A 2005-03-11 2005-03-11 半導体装置およびその製造方法 Withdrawn JP2006253430A (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2005068362A JP2006253430A (ja) 2005-03-11 2005-03-11 半導体装置およびその製造方法
TW095105771A TW200731140A (en) 2005-03-11 2006-02-21 A semiconductor device and a method for manufacturing the same
KR1020060022185A KR20060097661A (ko) 2005-03-11 2006-03-09 반도체 장치 및 그 제조 방법
CNA2006100568496A CN1832166A (zh) 2005-03-11 2006-03-09 半导体器件及其制造方法
US11/371,929 US7352588B2 (en) 2005-03-11 2006-03-10 Semiconductor device and a method for manufacturing the same
US12/037,588 US20080153205A1 (en) 2005-03-11 2008-02-26 Semiconductor device and a method for manufacturing the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005068362A JP2006253430A (ja) 2005-03-11 2005-03-11 半導体装置およびその製造方法

Publications (2)

Publication Number Publication Date
JP2006253430A JP2006253430A (ja) 2006-09-21
JP2006253430A5 true JP2006253430A5 (enExample) 2008-04-24

Family

ID=36971628

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005068362A Withdrawn JP2006253430A (ja) 2005-03-11 2005-03-11 半導体装置およびその製造方法

Country Status (5)

Country Link
US (2) US7352588B2 (enExample)
JP (1) JP2006253430A (enExample)
KR (1) KR20060097661A (enExample)
CN (1) CN1832166A (enExample)
TW (1) TW200731140A (enExample)

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Publication number Priority date Publication date Assignee Title
JP2006253430A (ja) * 2005-03-11 2006-09-21 Renesas Technology Corp 半導体装置およびその製造方法
JP4886308B2 (ja) * 2005-09-16 2012-02-29 株式会社東芝 Ｕｓｂメモリ装置
DE602005014498D1 (de) * 2005-12-30 2009-06-25 Incard Sa Modul einer IC-Karte
US8053279B2 (en) * 2007-06-19 2011-11-08 Micron Technology, Inc. Methods and systems for imaging and cutting semiconductor wafers and other semiconductor workpieces
KR20100109243A (ko) 2009-03-31 2010-10-08 삼성전자주식회사 반도체 패키지
TWM362572U (en) * 2009-04-13 2009-08-01 Phytrex Technology Corp Signal convertor
USD686214S1 (en) * 2011-07-28 2013-07-16 Lifenexus, Inc. Smartcard with iChip contact pad
CN102376012B (zh) * 2011-11-01 2016-10-26 上海仪电智能电子有限公司 一种双界面智能卡
US8649820B2 (en) 2011-11-07 2014-02-11 Blackberry Limited Universal integrated circuit card apparatus and related methods
EP2605188A1 (fr) * 2011-12-14 2013-06-19 Gemalto SA Procédé de fabrication de cartes à puce
EP2608114A1 (fr) * 2011-12-19 2013-06-26 Gemalto SA Procédé de fabrication d'un module à puce de circuit intégré protégé par pastille
US8936199B2 (en) 2012-04-13 2015-01-20 Blackberry Limited UICC apparatus and related methods
USD703208S1 (en) 2012-04-13 2014-04-22 Blackberry Limited UICC apparatus
USD701864S1 (en) * 2012-04-23 2014-04-01 Blackberry Limited UICC apparatus
USD759022S1 (en) * 2013-03-13 2016-06-14 Nagrastar Llc Smart card interface
USD758372S1 (en) * 2013-03-13 2016-06-07 Nagrastar Llc Smart card interface
USD729808S1 (en) * 2013-03-13 2015-05-19 Nagrastar Llc Smart card interface
TWD164807S (zh) * 2013-08-06 2014-12-11 璨圓光電股份有限公司 半導體發光元件之部分
CN104021415A (zh) * 2014-06-27 2014-09-03 南通富士通微电子股份有限公司 电子标签
USD736213S1 (en) * 2014-07-01 2015-08-11 Samsung Electronics Co., Ltd. Memory card
USD736212S1 (en) * 2014-07-01 2015-08-11 Samsung Electronics Co., Ltd. Memory card
USD739856S1 (en) * 2014-07-30 2015-09-29 Samsung Electronics Co., Ltd. Memory card
USD736216S1 (en) * 2014-07-30 2015-08-11 Samsung Electronics Co., Ltd. Memory card
USD780763S1 (en) * 2015-03-20 2017-03-07 Nagrastar Llc Smart card interface
USD864968S1 (en) 2015-04-30 2019-10-29 Echostar Technologies L.L.C. Smart card interface
USD783622S1 (en) * 2015-08-25 2017-04-11 Samsung Electronics Co., Ltd. Memory card
USD783621S1 (en) * 2015-08-25 2017-04-11 Samsung Electronics Co., Ltd. Memory card
FR3058545B1 (fr) 2016-11-04 2018-10-26 Smart Packaging Solutions Procede de fabrication d'un module electronique pour carte a puce
CN118607569A (zh) * 2018-02-01 2024-09-06 华为技术有限公司 存储卡和终端
FR3094137A1 (fr) * 2019-03-20 2020-09-25 Stmicroelectronics (Grenoble 2) Sas Boîtier électronique comportant des pistes contactant des fils
TWI708533B (zh) * 2019-07-02 2020-10-21 華泰電子股份有限公司 半導體封裝件及其製法
CN112242388A (zh) * 2019-07-18 2021-01-19 华泰电子股份有限公司 半导体封装件及其制法
CN111863739B (zh) * 2020-07-29 2022-04-08 深圳市邦测检测技术有限公司 一种rf射频通信模块及其制造方法
EP4084063A1 (en) * 2021-04-30 2022-11-02 Infineon Technologies Austria AG Semiconductor module with bond wire loop exposed from a moulded body and method for fabricating the same
DE102021213437A1 (de) 2021-11-29 2023-06-01 Robert Bosch Gesellschaft mit beschränkter Haftung Schaltungsanordnung und Verfahren zum Ausbilden einer Schaltungsanordnung

Family Cites Families (10)

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Publication number Priority date Publication date Assignee Title
US6359335B1 (en) * 1994-05-19 2002-03-19 Tessera, Inc. Method of manufacturing a plurality of semiconductor packages and the resulting semiconductor package structures
KR100386061B1 (ko) * 1995-10-24 2003-08-21 오끼 덴끼 고오교 가부시끼가이샤 크랙을방지하기위한개량된구조를가지는반도체장치및리이드프레임
KR100484962B1 (ko) * 1996-07-12 2005-04-25 후지쯔 가부시끼가이샤 반도체 장치의 제조 방법 및 반도체 장치
US5989939A (en) * 1996-12-13 1999-11-23 Tessera, Inc. Process of manufacturing compliant wirebond packages
JP2978861B2 (ja) * 1997-10-28 1999-11-15 九州日本電気株式会社 モールドｂｇａ型半導体装置及びその製造方法
CN1218276C (zh) 2000-04-28 2005-09-07 株式会社日立制作所 集成电路卡
TW445608B (en) * 2000-05-19 2001-07-11 Siliconware Precision Industries Co Ltd Semiconductor package and manufacturing method thereof of lead frame without flashing
TW524030B (en) * 2000-10-02 2003-03-11 Matsushita Electric Industrial Co Ltd Card-type recording medium and its manufacture method
DE10209922A1 (de) * 2002-03-07 2003-10-02 Infineon Technologies Ag Elektronisches Modul, Nutzen mit zu vereinzelnden elektronischen Modulen und Verfahren zu deren Herstellung
JP2006253430A (ja) * 2005-03-11 2006-09-21 Renesas Technology Corp 半導体装置およびその製造方法

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