TW200731140A - A semiconductor device and a method for manufacturing the same - Google Patents
A semiconductor device and a method for manufacturing the sameInfo
- Publication number
- TW200731140A TW200731140A TW095105771A TW95105771A TW200731140A TW 200731140 A TW200731140 A TW 200731140A TW 095105771 A TW095105771 A TW 095105771A TW 95105771 A TW95105771 A TW 95105771A TW 200731140 A TW200731140 A TW 200731140A
- Authority
- TW
- Taiwan
- Prior art keywords
- wiring board
- sim card
- exposed
- manufacturing
- mold resin
- Prior art date
Links
Classifications
-
- A—HUMAN NECESSITIES
- A47—FURNITURE; DOMESTIC ARTICLES OR APPLIANCES; COFFEE MILLS; SPICE MILLS; SUCTION CLEANERS IN GENERAL
- A47G—HOUSEHOLD OR TABLE EQUIPMENT
- A47G25/00—Household implements used in connection with wearing apparel; Dress, hat or umbrella holders
- A47G25/14—Clothing hangers, e.g. suit hangers
- A47G25/20—Clothing hangers, e.g. suit hangers with devices for preserving the shape of the clothes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49855—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers for flat-cards, e.g. credit cards
-
- A—HUMAN NECESSITIES
- A47—FURNITURE; DOMESTIC ARTICLES OR APPLIANCES; COFFEE MILLS; SPICE MILLS; SUCTION CLEANERS IN GENERAL
- A47G—HOUSEHOLD OR TABLE EQUIPMENT
- A47G25/00—Household implements used in connection with wearing apparel; Dress, hat or umbrella holders
- A47G25/14—Clothing hangers, e.g. suit hangers
- A47G25/48—Hangers with clamps or the like, e.g. for trousers or skirts
- A47G25/50—Hooks on hangers for supporting trousers or skirts
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/0772—Physical layout of the record carrier
- G06K19/07732—Physical layout of the record carrier the record carrier having a housing or construction similar to well-known portable memory devices, such as SD cards, USB or memory sticks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49833—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers the chip support structure consisting of a plurality of insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/93—Batch processes
- H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01029—Copper [Cu]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01057—Lanthanum [La]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
- H01L2924/078—Adhesive characteristics other than chemical
- H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/145—Arrangements wherein electric components are disposed between and simultaneously connected to two planar printed circuit boards, e.g. Cordwood modules
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Theoretical Computer Science (AREA)
- Credit Cards Or The Like (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005068362A JP2006253430A (ja) | 2005-03-11 | 2005-03-11 | 半導体装置およびその製造方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW200731140A true TW200731140A (en) | 2007-08-16 |
Family
ID=36971628
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW095105771A TW200731140A (en) | 2005-03-11 | 2006-02-21 | A semiconductor device and a method for manufacturing the same |
Country Status (5)
Country | Link |
---|---|
US (2) | US7352588B2 (zh) |
JP (1) | JP2006253430A (zh) |
KR (1) | KR20060097661A (zh) |
CN (1) | CN1832166A (zh) |
TW (1) | TW200731140A (zh) |
Families Citing this family (33)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006253430A (ja) * | 2005-03-11 | 2006-09-21 | Renesas Technology Corp | 半導体装置およびその製造方法 |
JP4886308B2 (ja) * | 2005-09-16 | 2012-02-29 | 株式会社東芝 | Usbメモリ装置 |
DE602005014498D1 (de) * | 2005-12-30 | 2009-06-25 | Incard Sa | Modul einer IC-Karte |
US8053279B2 (en) * | 2007-06-19 | 2011-11-08 | Micron Technology, Inc. | Methods and systems for imaging and cutting semiconductor wafers and other semiconductor workpieces |
KR20100109243A (ko) * | 2009-03-31 | 2010-10-08 | 삼성전자주식회사 | 반도체 패키지 |
TWM362572U (en) * | 2009-04-13 | 2009-08-01 | Phytrex Technology Corp | Signal convertor |
CN102376012B (zh) * | 2011-11-01 | 2016-10-26 | 上海仪电智能电子有限公司 | 一种双界面智能卡 |
US8649820B2 (en) | 2011-11-07 | 2014-02-11 | Blackberry Limited | Universal integrated circuit card apparatus and related methods |
EP2605188A1 (fr) * | 2011-12-14 | 2013-06-19 | Gemalto SA | Procédé de fabrication de cartes à puce |
EP2608114A1 (fr) * | 2011-12-19 | 2013-06-26 | Gemalto SA | Procédé de fabrication d'un module à puce de circuit intégré protégé par pastille |
USD703208S1 (en) | 2012-04-13 | 2014-04-22 | Blackberry Limited | UICC apparatus |
US8936199B2 (en) | 2012-04-13 | 2015-01-20 | Blackberry Limited | UICC apparatus and related methods |
USD701864S1 (en) * | 2012-04-23 | 2014-04-01 | Blackberry Limited | UICC apparatus |
USD729808S1 (en) * | 2013-03-13 | 2015-05-19 | Nagrastar Llc | Smart card interface |
USD759022S1 (en) * | 2013-03-13 | 2016-06-14 | Nagrastar Llc | Smart card interface |
USD758372S1 (en) * | 2013-03-13 | 2016-06-07 | Nagrastar Llc | Smart card interface |
CN104021415A (zh) * | 2014-06-27 | 2014-09-03 | 南通富士通微电子股份有限公司 | 电子标签 |
USD736212S1 (en) * | 2014-07-01 | 2015-08-11 | Samsung Electronics Co., Ltd. | Memory card |
USD736213S1 (en) * | 2014-07-01 | 2015-08-11 | Samsung Electronics Co., Ltd. | Memory card |
USD739856S1 (en) * | 2014-07-30 | 2015-09-29 | Samsung Electronics Co., Ltd. | Memory card |
USD736216S1 (en) * | 2014-07-30 | 2015-08-11 | Samsung Electronics Co., Ltd. | Memory card |
USD780763S1 (en) * | 2015-03-20 | 2017-03-07 | Nagrastar Llc | Smart card interface |
USD864968S1 (en) | 2015-04-30 | 2019-10-29 | Echostar Technologies L.L.C. | Smart card interface |
USD783622S1 (en) * | 2015-08-25 | 2017-04-11 | Samsung Electronics Co., Ltd. | Memory card |
USD783621S1 (en) * | 2015-08-25 | 2017-04-11 | Samsung Electronics Co., Ltd. | Memory card |
FR3058545B1 (fr) | 2016-11-04 | 2018-10-26 | Smart Packaging Solutions | Procede de fabrication d'un module electronique pour carte a puce |
CN118171678A (zh) * | 2018-02-01 | 2024-06-11 | 华为技术有限公司 | 存储卡和终端 |
FR3094137A1 (fr) * | 2019-03-20 | 2020-09-25 | Stmicroelectronics (Grenoble 2) Sas | Boîtier électronique comportant des pistes contactant des fils |
TWI708533B (zh) * | 2019-07-02 | 2020-10-21 | 華泰電子股份有限公司 | 半導體封裝件及其製法 |
CN112242388A (zh) * | 2019-07-18 | 2021-01-19 | 华泰电子股份有限公司 | 半导体封装件及其制法 |
CN111863739B (zh) * | 2020-07-29 | 2022-04-08 | 深圳市邦测检测技术有限公司 | 一种rf射频通信模块及其制造方法 |
EP4084063A1 (en) * | 2021-04-30 | 2022-11-02 | Infineon Technologies Austria AG | Semiconductor module with bond wire loop exposed from a moulded body and method for fabricating the same |
DE102021213437A1 (de) | 2021-11-29 | 2023-06-01 | Robert Bosch Gesellschaft mit beschränkter Haftung | Schaltungsanordnung und Verfahren zum Ausbilden einer Schaltungsanordnung |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6359335B1 (en) * | 1994-05-19 | 2002-03-19 | Tessera, Inc. | Method of manufacturing a plurality of semiconductor packages and the resulting semiconductor package structures |
KR100386061B1 (ko) * | 1995-10-24 | 2003-08-21 | 오끼 덴끼 고오교 가부시끼가이샤 | 크랙을방지하기위한개량된구조를가지는반도체장치및리이드프레임 |
EP1271640A3 (en) * | 1996-07-12 | 2003-07-16 | Fujitsu Limited | Mold for manufacturing semiconductor device |
US5989939A (en) * | 1996-12-13 | 1999-11-23 | Tessera, Inc. | Process of manufacturing compliant wirebond packages |
JP2978861B2 (ja) * | 1997-10-28 | 1999-11-15 | 九州日本電気株式会社 | モールドbga型半導体装置及びその製造方法 |
US6669487B1 (en) | 2000-04-28 | 2003-12-30 | Hitachi, Ltd. | IC card |
TW445608B (en) * | 2000-05-19 | 2001-07-11 | Siliconware Precision Industries Co Ltd | Semiconductor package and manufacturing method thereof of lead frame without flashing |
CN1259200C (zh) * | 2000-10-02 | 2006-06-14 | 松下电器产业株式会社 | 卡型记录媒体及其制造方法 |
DE10209922A1 (de) * | 2002-03-07 | 2003-10-02 | Infineon Technologies Ag | Elektronisches Modul, Nutzen mit zu vereinzelnden elektronischen Modulen und Verfahren zu deren Herstellung |
JP2006253430A (ja) * | 2005-03-11 | 2006-09-21 | Renesas Technology Corp | 半導体装置およびその製造方法 |
-
2005
- 2005-03-11 JP JP2005068362A patent/JP2006253430A/ja not_active Withdrawn
-
2006
- 2006-02-21 TW TW095105771A patent/TW200731140A/zh unknown
- 2006-03-09 KR KR1020060022185A patent/KR20060097661A/ko not_active Application Discontinuation
- 2006-03-09 CN CNA2006100568496A patent/CN1832166A/zh active Pending
- 2006-03-10 US US11/371,929 patent/US7352588B2/en active Active
-
2008
- 2008-02-26 US US12/037,588 patent/US20080153205A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
US20060205280A1 (en) | 2006-09-14 |
US20080153205A1 (en) | 2008-06-26 |
US7352588B2 (en) | 2008-04-01 |
CN1832166A (zh) | 2006-09-13 |
JP2006253430A (ja) | 2006-09-21 |
KR20060097661A (ko) | 2006-09-14 |
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