WO2009031588A1 - 回路基板、回路モジュール及び回路基板の製造方法 - Google Patents

回路基板、回路モジュール及び回路基板の製造方法 Download PDF

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Publication number
WO2009031588A1
WO2009031588A1 PCT/JP2008/065897 JP2008065897W WO2009031588A1 WO 2009031588 A1 WO2009031588 A1 WO 2009031588A1 JP 2008065897 W JP2008065897 W JP 2008065897W WO 2009031588 A1 WO2009031588 A1 WO 2009031588A1
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WIPO (PCT)
Prior art keywords
circuit board
circuit
main body
module
mounting surface
Prior art date
Application number
PCT/JP2008/065897
Other languages
English (en)
French (fr)
Inventor
Yutaka Fukuda
Original Assignee
Murata Manufacturing Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co., Ltd. filed Critical Murata Manufacturing Co., Ltd.
Priority to JP2008558128A priority Critical patent/JP4337950B2/ja
Priority to EP08829892A priority patent/EP2187717B1/en
Publication of WO2009031588A1 publication Critical patent/WO2009031588A1/ja
Priority to US12/717,171 priority patent/US20100147573A1/en
Priority to US13/616,102 priority patent/US9185805B2/en

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
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    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4803—Insulating or insulated parts, e.g. mountings, containers, diamond heatsinks
    • H01L21/481—Insulating layers on insulating parts, with or without metallisation
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    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49139—Assembling to base an electrical component, e.g., capacitor, etc. by inserting component lead or terminal into base aperture
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Wire Bonding (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

　突出した端子を備えた回路基板であって、高さの低い回路基板、回路モジュール及び回路基板の製造方法を提供することである。 　ＩＣ（５０）が回路基板（１０）上に実装された回路モジュール（６０）。ＩＣ（５０）は、ＩＣ本体（５２）と、ＩＣ本体（５２）の実装面上に形成されたはんだバンプ（５４）と、を含む。回路基板（１０）は、ＩＣ（５０）が実装される実装面の一部を窪ませることにより形成された凹部（１５）を有する基板本体（１２）と、前記はんだバンプ（５４）と電気的に接続される端子（１４）であって、前記基板本体（１２）の実装面から突出するように前記凹部（１５）内に形成された端子（１４）と、を含む。
PCT/JP2008/065897 2007-09-06 2008-09-03 回路基板、回路モジュール及び回路基板の製造方法 WO2009031588A1 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2008558128A JP4337950B2 (ja) 2007-09-06 2008-09-03 回路基板の製造方法
EP08829892A EP2187717B1 (en) 2007-09-06 2008-09-03 Circuit board manufacturing method
US12/717,171 US20100147573A1 (en) 2007-09-06 2010-03-04 Circuit substrate, circuit module and method for manufacturing the circuit substrate
US13/616,102 US9185805B2 (en) 2007-09-06 2012-09-14 Method of manufacturing a circuit substrate

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2007-231314 2007-09-06
JP2007231314 2007-09-06
JP2008-092195 2008-03-31
JP2008092195 2008-03-31

Related Child Applications (1)

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US12/717,171 Continuation US20100147573A1 (en) 2007-09-06 2010-03-04 Circuit substrate, circuit module and method for manufacturing the circuit substrate

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EP (1) EP2187717B1 (ja)
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JP2012074558A (ja) * 2010-09-29 2012-04-12 Shibuya Kogyo Co Ltd 導電性ボールの搭載装置
JP2021057578A (ja) * 2019-09-27 2021-04-08 シーメンス アクチエンゲゼルシヤフトＳｉｅｍｅｎｓ Ａｋｔｉｅｎｇｅｓｅｌｌｓｃｈａｆｔ 回路基板、パッケージおよびそれらの製造方法

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US8835773B2 (en) * 2009-04-06 2014-09-16 Shinko Electric Industries Co., Ltd. Wiring board and method of manufacturing the same
JP2012074558A (ja) * 2010-09-29 2012-04-12 Shibuya Kogyo Co Ltd 導電性ボールの搭載装置
JP2021057578A (ja) * 2019-09-27 2021-04-08 シーメンス アクチエンゲゼルシヤフトＳｉｅｍｅｎｓ Ａｋｔｉｅｎｇｅｓｅｌｌｓｃｈａｆｔ 回路基板、パッケージおよびそれらの製造方法

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US20130008586A1 (en) 2013-01-10
EP2187717A4 (en) 2011-04-13
JP2009267421A (ja) 2009-11-12
JPWO2009031588A1 (ja) 2010-12-16
EP2187717A1 (en) 2010-05-19
EP2187717B1 (en) 2012-06-20
US20100147573A1 (en) 2010-06-17
JP5278149B2 (ja) 2013-09-04
JP4337950B2 (ja) 2009-09-30
US9185805B2 (en) 2015-11-10

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