FR2837983B1 - Circuit integre en hyperfrequences comprenant une pastille semiconductrice - Google Patents

Circuit integre en hyperfrequences comprenant une pastille semiconductrice

Info

Publication number
FR2837983B1
FR2837983B1 FR0303083A FR0303083A FR2837983B1 FR 2837983 B1 FR2837983 B1 FR 2837983B1 FR 0303083 A FR0303083 A FR 0303083A FR 0303083 A FR0303083 A FR 0303083A FR 2837983 B1 FR2837983 B1 FR 2837983B1
Authority
FR
France
Prior art keywords
signal line
semiconductor
pastille
semiconductor chip
microwave circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
FR0303083A
Other languages
English (en)
Other versions
FR2837983A1 (fr
Inventor
Haruo Kojima
Tomoyuki Kitani
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Publication of FR2837983A1 publication Critical patent/FR2837983A1/fr
Application granted granted Critical
Publication of FR2837983B1 publication Critical patent/FR2837983B1/fr
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

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    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/58Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64Impedance arrangements
    • H01L23/66High-frequency adaptations
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    • H01L2223/6644Packaging aspects of high-frequency amplifiers
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    • H01L2224/02Bonding areas; Manufacturing methods related thereto
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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Microwave Amplifiers (AREA)
  • Wire Bonding (AREA)
  • Waveguide Switches, Polarizers, And Phase Shifters (AREA)
  • Waveguides (AREA)
FR0303083A 2002-03-27 2003-03-13 Circuit integre en hyperfrequences comprenant une pastille semiconductrice Expired - Lifetime FR2837983B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002087509A JP3850325B2 (ja) 2002-03-27 2002-03-27 マイクロ波集積回路

Publications (2)

Publication Number Publication Date
FR2837983A1 FR2837983A1 (fr) 2003-10-03
FR2837983B1 true FR2837983B1 (fr) 2007-08-24

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FR0303083A Expired - Lifetime FR2837983B1 (fr) 2002-03-27 2003-03-13 Circuit integre en hyperfrequences comprenant une pastille semiconductrice

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US (1) US6762493B2 (fr)
JP (1) JP3850325B2 (fr)
FR (1) FR2837983B1 (fr)
GB (1) GB2389458B (fr)

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US6945447B2 (en) * 2002-06-05 2005-09-20 Northrop Grumman Corporation Thermal solder writing eutectic bonding process and apparatus
US7228014B2 (en) * 2004-03-11 2007-06-05 Avanex Corporation System for reducing the electrical return loss of a lithium niobate traveling wave optical modulator with low characteristic impedance
GB2422484B (en) * 2005-01-21 2006-12-06 Artimi Ltd Integrated circuit die connection methods and apparatus
JP5027680B2 (ja) * 2008-01-18 2012-09-19 パナソニック株式会社 半導体リレーモジュール
US20110084374A1 (en) * 2009-10-08 2011-04-14 Jen-Chung Chen Semiconductor package with sectioned bonding wire scheme
JP2012028588A (ja) * 2010-07-23 2012-02-09 Fujitsu Ltd 光増幅モジュール及び光スイッチ装置
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CN109300892B (zh) * 2018-09-04 2021-01-26 中国电子科技集团公司第五十五研究所 基于键合转移的超大功率限幅器mmic及制备方法
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JP2003283273A (ja) 2003-10-03
GB2389458A (en) 2003-12-10
US20030183927A1 (en) 2003-10-02
FR2837983A1 (fr) 2003-10-03
JP3850325B2 (ja) 2006-11-29
GB0306587D0 (en) 2003-04-30
US6762493B2 (en) 2004-07-13

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