WO2008123076A1 - 接続用ボード、プローブカード及びそれを備えた電子部品試験装置 - Google Patents

接続用ボード、プローブカード及びそれを備えた電子部品試験装置 Download PDF

Info

Publication number
WO2008123076A1
WO2008123076A1 PCT/JP2008/054992 JP2008054992W WO2008123076A1 WO 2008123076 A1 WO2008123076 A1 WO 2008123076A1 JP 2008054992 W JP2008054992 W JP 2008054992W WO 2008123076 A1 WO2008123076 A1 WO 2008123076A1
Authority
WO
WIPO (PCT)
Prior art keywords
probe card
electronic component
apparatus provided
testing apparatus
connecting board
Prior art date
Application number
PCT/JP2008/054992
Other languages
English (en)
French (fr)
Inventor
Yoshihiro Abe
Takaji Ishikawa
Noriaki Shimasaki
Shigeru Matsumura
Original Assignee
Advantest Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advantest Corporation filed Critical Advantest Corporation
Priority to JP2009509035A priority Critical patent/JPWO2008123076A1/ja
Priority to US12/532,688 priority patent/US8134381B2/en
Publication of WO2008123076A1 publication Critical patent/WO2008123076A1/ja

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Tests Of Electronic Circuits (AREA)

Abstract

プローブカード５０Ａは、半導体ウェハＷ上に造り込まれたＩＣデバイスの入出力端子に電気的に接触するプローブ針６０と、プローブ針６０が実装されているマウントベース５１と、マウントベース５１を支持する支柱５３と、ボンディングワイヤ５２を介してプローブ針６０に電気的に接続された配線パターンを有する配線基板５５と、プローブカード５０Ａを補強するためのベース部材５６及びスティフナ５７と、を備え、マウントベース５１と配線基板５５とが非接触となっている。
PCT/JP2008/054992 2007-03-26 2008-03-18 接続用ボード、プローブカード及びそれを備えた電子部品試験装置 WO2008123076A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2009509035A JPWO2008123076A1 (ja) 2007-03-26 2008-03-18 接続用ボード、プローブカード及びそれを備えた電子部品試験装置
US12/532,688 US8134381B2 (en) 2007-03-26 2008-03-18 Connection board, probe card, and electronic device test apparatus comprising same

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-079194 2007-03-26
JP2007079194 2007-03-26

Publications (1)

Publication Number Publication Date
WO2008123076A1 true WO2008123076A1 (ja) 2008-10-16

Family

ID=39830578

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/054992 WO2008123076A1 (ja) 2007-03-26 2008-03-18 接続用ボード、プローブカード及びそれを備えた電子部品試験装置

Country Status (6)

Country Link
US (1) US8134381B2 (ja)
JP (1) JPWO2008123076A1 (ja)
KR (1) KR20090120513A (ja)
CN (1) CN101663591A (ja)
TW (1) TW200903685A (ja)
WO (1) WO2008123076A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013137281A (ja) * 2011-12-28 2013-07-11 Seiko Epson Corp プローブ装置

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5164543B2 (ja) * 2007-12-05 2013-03-21 東京エレクトロン株式会社 プローブカードの製造方法
JP4873083B2 (ja) * 2010-01-08 2012-02-08 横河電機株式会社 半導体試験装置
JP2011163807A (ja) 2010-02-05 2011-08-25 Advantest Corp 電子部品試験装置
JP5557547B2 (ja) * 2010-02-10 2014-07-23 株式会社アドバンテスト テストヘッド及びそれを備えた半導体ウェハ試験装置
TWI421506B (zh) * 2010-03-11 2014-01-01 Mpi Corp Probe card and matching method for impedance matching structure of replaceable electronic components
JP5798435B2 (ja) 2011-03-07 2015-10-21 日本特殊陶業株式会社 電子部品検査装置用配線基板およびその製造方法
US9134357B1 (en) * 2011-03-25 2015-09-15 Maxim Integrated, Inc. Universal direct docking at probe test
ITMI20120996A1 (it) * 2012-06-08 2013-12-09 Technoprobe Spa Scheda di misura per un'apparecchiatura di test di dispositivi elettronici
WO2014002078A1 (en) * 2012-06-29 2014-01-03 Hydrovision Asia Pte Ltd An improved suspended sediment meter
JP5690321B2 (ja) * 2012-11-29 2015-03-25 株式会社アドバンテスト プローブ装置および試験装置
US11426900B2 (en) 2013-02-28 2022-08-30 Hewlett-Packard Development Company, L.P. Molding a fluid flow structure
PL3296113T3 (pl) 2013-02-28 2020-02-28 Hewlett-Packard Development Company, L.P. Formowana szyna drukująca
US9354254B2 (en) * 2013-03-14 2016-05-31 Taiwan Semiconductor Manufacturing Co., Ltd. Test-yield improvement devices for high-density probing techniques and method of implementing the same
US11249112B2 (en) 2013-03-15 2022-02-15 Taiwan Semiconductor Manufacturing Co., Ltd. Devices for high-density probing techniques and method of implementing the same
CN105189122B (zh) 2013-03-20 2017-05-10 惠普发展公司，有限责任合伙企业 具有暴露的前表面和后表面的模制芯片条
JP6042761B2 (ja) * 2013-03-28 2016-12-14 東京エレクトロン株式会社 プローブ装置
JP6259590B2 (ja) * 2013-06-12 2018-01-10 株式会社日本マイクロニクス プローブカード及びその製造方法
JP6184301B2 (ja) * 2013-11-14 2017-08-23 株式会社日本マイクロニクス 検査装置
JP6466128B2 (ja) * 2014-10-08 2019-02-06 株式会社日本マイクロニクス プローブカード
US20180358321A1 (en) * 2017-06-13 2018-12-13 International Business Machines Corporation Pressing solder bumps to match probe profile during wafer level testing
CN109884505B (zh) * 2019-03-14 2021-02-12 中国科学院半导体研究所 一种用于光电子芯片测试的可配置结构
JP7198127B2 (ja) * 2019-03-20 2022-12-28 株式会社アドバンテスト インタポーザ、ソケット、ソケット組立体、及び、配線板組立体
JP7471778B2 (ja) * 2019-03-29 2024-04-22 株式会社日本マイクロニクス プローブカード

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11295342A (ja) * 1998-04-06 1999-10-29 Japan Electronic Materials Corp プローブカード及びその製造方法
WO2005069019A1 (ja) * 2004-01-20 2005-07-28 Tokyo Electron Limited プローブカード
JP2006507479A (ja) * 2002-06-24 2006-03-02 ナノネクサス インク ウエハレベルのスプリングを有するプローブカードアセンブリおよびパッケージの構造および製造工程

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5808475A (en) * 1996-06-07 1998-09-15 Keithley Instruments, Inc. Semiconductor probe card for low current measurements
US6799976B1 (en) 1999-07-28 2004-10-05 Nanonexus, Inc. Construction structures and manufacturing processes for integrated circuit wafer probe card assemblies
KR100347765B1 (ko) 2000-10-18 2002-08-09 삼성전자 주식회사 웨이퍼의 전기적 특성을 검사하는 방법 및 장치
KR200230906Y1 (ko) 2001-01-22 2001-07-03 이세현 자동 취반기의 오수 처리장치
US6729019B2 (en) * 2001-07-11 2004-05-04 Formfactor, Inc. Method of manufacturing a probe card
JP2003107105A (ja) * 2001-09-27 2003-04-09 Mitsubishi Electric Corp プローブカード
US7071715B2 (en) * 2004-01-16 2006-07-04 Formfactor, Inc. Probe card configuration for low mechanical flexural strength electrical routing substrates
US7285968B2 (en) * 2005-04-19 2007-10-23 Formfactor, Inc. Apparatus and method for managing thermally induced motion of a probe card assembly
JP4860242B2 (ja) * 2005-11-11 2012-01-25 東京エレクトロン株式会社 プローブ装置
US7180316B1 (en) * 2006-02-03 2007-02-20 Touchdown Technologies, Inc. Probe head with machined mounting pads and method of forming same
US7400156B2 (en) * 2006-09-06 2008-07-15 Mjc Probe Incorporation Vertical probe device
KR100817083B1 (ko) * 2007-01-30 2008-03-26 삼성전자주식회사 프로브 카드
US7595651B2 (en) * 2007-02-13 2009-09-29 Mpi Corporation Cantilever-type probe card for high frequency application
KR100965923B1 (ko) * 2007-06-05 2010-06-25 엠피아이 코포레이션 프로브 테스트 장치

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11295342A (ja) * 1998-04-06 1999-10-29 Japan Electronic Materials Corp プローブカード及びその製造方法
JP2006507479A (ja) * 2002-06-24 2006-03-02 ナノネクサス インク ウエハレベルのスプリングを有するプローブカードアセンブリおよびパッケージの構造および製造工程
WO2005069019A1 (ja) * 2004-01-20 2005-07-28 Tokyo Electron Limited プローブカード

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013137281A (ja) * 2011-12-28 2013-07-11 Seiko Epson Corp プローブ装置

Also Published As

Publication number Publication date
KR20090120513A (ko) 2009-11-24
TWI368961B (ja) 2012-07-21
TW200903685A (en) 2009-01-16
JPWO2008123076A1 (ja) 2010-07-15
US8134381B2 (en) 2012-03-13
US20100102837A1 (en) 2010-04-29
CN101663591A (zh) 2010-03-03

Similar Documents

Publication Publication Date Title
WO2008123076A1 (ja) 接続用ボード、プローブカード及びそれを備えた電子部品試験装置
TW200605253A (en) Method of manufacturing semiconductor integrated circuit and probe card
KR100843202B1 (ko) 기판 양면에 검사용 패드를 갖는 반도체 패키지 및검사방법
EP1191588A3 (en) A spiral contactor and manufacturing method therefor
TW200633108A (en) Device probing using a matching device
TW200730834A (en) Electronic component test device and method for installing performance board of the electronic component test device
TW200731140A (en) A semiconductor device and a method for manufacturing the same
US20030040139A1 (en) Spring contact for establishing non-permanent electrical connection between an integrated circuit device lead element and a substrate, apparatus including same and method of use
JP4911495B2 (ja) 半導体集積回路用ソケット
TWI230992B (en) Semiconductor device
US20060125501A1 (en) Modularized probe head
CN102539851A (zh) 高频探测结构
TW200745572A (en) Manufacturing method of wafer-level testing circuit board, and the structure thereof
JP5588347B2 (ja) プローブ装置および試験装置
US20090027072A1 (en) Apparatus for testing chips with ball grid array
WO2008008581A3 (en) An electronics package with an integrated circuit device having post wafer fabrication integrated passive components
US9869697B2 (en) Wiring substrate with filled vias to accommodate custom terminals
TW200508614A (en) Test apparatus for semiconductor package
TW200616124A (en) Method for reducing lead precipitation during wafer processing
TW200643440A (en) Semiconductor test interface
TW200601401A (en) Dut interface of semiconductor test apparatus
MY122960A (en) Method and apparatus for testing electronic devices
WO2004099793A3 (en) Device probing using a matching device
US20100330830A1 (en) Vertical probe intrface system
JPH0348171A (ja) 混成集積回路板の電気的特性検査を行う方法

Legal Events

Date Code Title Description
WWE Wipo information: entry into national phase

Ref document number: 200880009631.2

Country of ref document: CN

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 08722386

Country of ref document: EP

Kind code of ref document: A1

ENP Entry into the national phase

Ref document number: 2009509035

Country of ref document: JP

Kind code of ref document: A

WWE Wipo information: entry into national phase

Ref document number: 12532688

Country of ref document: US

NENP Non-entry into the national phase

Ref country code: DE

ENP Entry into the national phase

Ref document number: 20097021342

Country of ref document: KR

Kind code of ref document: A

122 Ep: pct application non-entry in european phase

Ref document number: 08722386

Country of ref document: EP

Kind code of ref document: A1