JP2008218758A5 - - Google Patents
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- Publication number
- JP2008218758A5 JP2008218758A5 JP2007054957A JP2007054957A JP2008218758A5 JP 2008218758 A5 JP2008218758 A5 JP 2008218758A5 JP 2007054957 A JP2007054957 A JP 2007054957A JP 2007054957 A JP2007054957 A JP 2007054957A JP 2008218758 A5 JP2008218758 A5 JP 2008218758A5
- Authority
- JP
- Japan
- Prior art keywords
- bumps
- semiconductor elements
- substrate
- rows
- resin adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000004065 semiconductor Substances 0.000 claims 29
- 239000011347 resin Substances 0.000 claims 15
- 229920005989 resin Polymers 0.000 claims 15
- 239000000758 substrate Substances 0.000 claims 15
- 239000012790 adhesive layer Substances 0.000 claims 11
- 230000002093 peripheral effect Effects 0.000 claims 4
- 229920001187 thermosetting polymer Polymers 0.000 claims 2
- 230000005611 electricity Effects 0.000 claims 1
- 238000004806 packaging method and process Methods 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007054957A JP2008218758A (ja) | 2007-03-06 | 2007-03-06 | 電子回路実装構造体 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007054957A JP2008218758A (ja) | 2007-03-06 | 2007-03-06 | 電子回路実装構造体 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2008218758A JP2008218758A (ja) | 2008-09-18 |
| JP2008218758A5 true JP2008218758A5 (enExample) | 2009-11-12 |
Family
ID=39838433
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007054957A Withdrawn JP2008218758A (ja) | 2007-03-06 | 2007-03-06 | 電子回路実装構造体 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2008218758A (enExample) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010278318A (ja) | 2009-05-29 | 2010-12-09 | Renesas Electronics Corp | 半導体装置 |
| WO2015056430A1 (ja) * | 2013-10-16 | 2015-04-23 | パナソニック株式会社 | 半導体装置 |
| JP5770258B2 (ja) * | 2013-12-20 | 2015-08-26 | ルネサスエレクトロニクス株式会社 | 半導体装置の製造方法 |
| JP6394021B2 (ja) * | 2014-03-20 | 2018-09-26 | 富士通株式会社 | 電子装置、電子装置の製造方法及び電子部品の製造方法 |
| JP6783648B2 (ja) * | 2016-12-26 | 2020-11-11 | 新光電気工業株式会社 | 配線基板、半導体装置 |
| KR102722915B1 (ko) | 2019-10-30 | 2024-10-28 | 삼성전자주식회사 | 반도체 패키지 및 그 제조방법 |
-
2007
- 2007-03-06 JP JP2007054957A patent/JP2008218758A/ja not_active Withdrawn
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