JP2008218758A5 - - Google Patents

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Publication number
JP2008218758A5
JP2008218758A5 JP2007054957A JP2007054957A JP2008218758A5 JP 2008218758 A5 JP2008218758 A5 JP 2008218758A5 JP 2007054957 A JP2007054957 A JP 2007054957A JP 2007054957 A JP2007054957 A JP 2007054957A JP 2008218758 A5 JP2008218758 A5 JP 2008218758A5
Authority
JP
Japan
Prior art keywords
bumps
semiconductor elements
substrate
rows
resin adhesive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2007054957A
Other languages
English (en)
Japanese (ja)
Other versions
JP2008218758A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2007054957A priority Critical patent/JP2008218758A/ja
Priority claimed from JP2007054957A external-priority patent/JP2008218758A/ja
Publication of JP2008218758A publication Critical patent/JP2008218758A/ja
Publication of JP2008218758A5 publication Critical patent/JP2008218758A5/ja
Withdrawn legal-status Critical Current

Links

JP2007054957A 2007-03-06 2007-03-06 電子回路実装構造体 Withdrawn JP2008218758A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007054957A JP2008218758A (ja) 2007-03-06 2007-03-06 電子回路実装構造体

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007054957A JP2008218758A (ja) 2007-03-06 2007-03-06 電子回路実装構造体

Publications (2)

Publication Number Publication Date
JP2008218758A JP2008218758A (ja) 2008-09-18
JP2008218758A5 true JP2008218758A5 (enExample) 2009-11-12

Family

ID=39838433

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007054957A Withdrawn JP2008218758A (ja) 2007-03-06 2007-03-06 電子回路実装構造体

Country Status (1)

Country Link
JP (1) JP2008218758A (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010278318A (ja) 2009-05-29 2010-12-09 Renesas Electronics Corp 半導体装置
WO2015056430A1 (ja) * 2013-10-16 2015-04-23 パナソニック株式会社 半導体装置
JP5770258B2 (ja) * 2013-12-20 2015-08-26 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
JP6394021B2 (ja) * 2014-03-20 2018-09-26 富士通株式会社 電子装置、電子装置の製造方法及び電子部品の製造方法
JP6783648B2 (ja) * 2016-12-26 2020-11-11 新光電気工業株式会社 配線基板、半導体装置
KR102722915B1 (ko) 2019-10-30 2024-10-28 삼성전자주식회사 반도체 패키지 및 그 제조방법

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