JP2009192309A5 - - Google Patents

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Publication number
JP2009192309A5
JP2009192309A5 JP2008031896A JP2008031896A JP2009192309A5 JP 2009192309 A5 JP2009192309 A5 JP 2009192309A5 JP 2008031896 A JP2008031896 A JP 2008031896A JP 2008031896 A JP2008031896 A JP 2008031896A JP 2009192309 A5 JP2009192309 A5 JP 2009192309A5
Authority
JP
Japan
Prior art keywords
contacts
inspection apparatus
relay substrate
main surface
semiconductor inspection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2008031896A
Other languages
English (en)
Japanese (ja)
Other versions
JP2009192309A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2008031896A priority Critical patent/JP2009192309A/ja
Priority claimed from JP2008031896A external-priority patent/JP2009192309A/ja
Priority to US12/370,072 priority patent/US7884632B2/en
Publication of JP2009192309A publication Critical patent/JP2009192309A/ja
Publication of JP2009192309A5 publication Critical patent/JP2009192309A5/ja
Pending legal-status Critical Current

Links

JP2008031896A 2008-02-13 2008-02-13 半導体検査装置 Pending JP2009192309A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2008031896A JP2009192309A (ja) 2008-02-13 2008-02-13 半導体検査装置
US12/370,072 US7884632B2 (en) 2008-02-13 2009-02-12 Semiconductor inspecting device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008031896A JP2009192309A (ja) 2008-02-13 2008-02-13 半導体検査装置

Publications (2)

Publication Number Publication Date
JP2009192309A JP2009192309A (ja) 2009-08-27
JP2009192309A5 true JP2009192309A5 (enExample) 2011-01-20

Family

ID=40954531

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008031896A Pending JP2009192309A (ja) 2008-02-13 2008-02-13 半導体検査装置

Country Status (2)

Country Link
US (1) US7884632B2 (enExample)
JP (1) JP2009192309A (enExample)

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012047674A (ja) 2010-08-30 2012-03-08 Advantest Corp 試験用個片基板、プローブ、及び半導体ウェハ試験装置
US9249265B1 (en) 2014-09-08 2016-02-02 Sirrus, Inc. Emulsion polymers including one or more 1,1-disubstituted alkene compounds, emulsion methods, and polymer compositions
JP5798435B2 (ja) * 2011-03-07 2015-10-21 日本特殊陶業株式会社 電子部品検査装置用配線基板およびその製造方法
JP5777997B2 (ja) 2011-03-07 2015-09-16 日本特殊陶業株式会社 電子部品検査装置用配線基板およびその製造方法
MX370256B (es) 2011-10-19 2019-12-09 Sirrus Inc Monomeros multifuncionales, procedimientos para la preparación de monomeros multifuncionales, composiciones polimerizables y productos formados a partir de los mismos.
TWI484191B (zh) * 2012-09-28 2015-05-11 Hermes Epitek Corp 電路測試探針卡
JP6246507B2 (ja) * 2012-11-05 2017-12-13 新光電気工業株式会社 プローブカード及びその製造方法
JP6208486B2 (ja) * 2013-07-19 2017-10-04 新光電気工業株式会社 プローブカード及びその製造方法
JP6092729B2 (ja) * 2013-07-19 2017-03-08 新光電気工業株式会社 プローブカード及びその製造方法
JP6189187B2 (ja) * 2013-11-19 2017-08-30 新光電気工業株式会社 プローブカード及びプローブカードの製造方法
US9416091B1 (en) 2015-02-04 2016-08-16 Sirrus, Inc. Catalytic transesterification of ester compounds with groups reactive under transesterification conditions
US9315597B2 (en) 2014-09-08 2016-04-19 Sirrus, Inc. Compositions containing 1,1-disubstituted alkene compounds for preparing polymers having enhanced glass transition temperatures
KR101493901B1 (ko) * 2014-10-28 2015-02-17 (주)인아에스시 반도체 패키지 테스트용 유연성 실리콘 부싱 소켓
US10501400B2 (en) 2015-02-04 2019-12-10 Sirrus, Inc. Heterogeneous catalytic transesterification of ester compounds with groups reactive under transesterification conditions
JP6392171B2 (ja) * 2015-05-28 2018-09-19 新光電気工業株式会社 半導体装置及びその製造方法
US10428177B2 (en) 2016-06-03 2019-10-01 Sirrus, Inc. Water absorbing or water soluble polymers, intermediate compounds, and methods thereof
US11262384B2 (en) * 2016-12-23 2022-03-01 Intel Corporation Fine pitch probe card methods and systems
US11268983B2 (en) 2017-06-30 2022-03-08 Intel Corporation Chevron interconnect for very fine pitch probing
US10775414B2 (en) 2017-09-29 2020-09-15 Intel Corporation Low-profile gimbal platform for high-resolution in situ co-planarity adjustment
US11061068B2 (en) 2017-12-05 2021-07-13 Intel Corporation Multi-member test probe structure
US11204555B2 (en) 2017-12-28 2021-12-21 Intel Corporation Method and apparatus to develop lithographically defined high aspect ratio interconnects
US11073538B2 (en) 2018-01-03 2021-07-27 Intel Corporation Electrical testing apparatus with lateral movement of a probe support substrate
US10866264B2 (en) 2018-01-05 2020-12-15 Intel Corporation Interconnect structure with varying modulus of elasticity
US10488438B2 (en) 2018-01-05 2019-11-26 Intel Corporation High density and fine pitch interconnect structures in an electric test apparatus
US11543454B2 (en) 2018-09-25 2023-01-03 Intel Corporation Double-beam test probe
US10935573B2 (en) 2018-09-28 2021-03-02 Intel Corporation Slip-plane MEMS probe for high-density and fine pitch interconnects
US11094668B2 (en) * 2019-12-12 2021-08-17 Micron Technology, Inc. Solderless interconnect for semiconductor device assembly
KR102518123B1 (ko) * 2022-07-11 2023-04-10 성심세미콘 주식회사 전자 부품 검사용 소켓 및 소켓 핀

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01160371U (enExample) * 1988-04-27 1989-11-07
JP3388307B2 (ja) * 1996-05-17 2003-03-17 東京エレクトロン株式会社 プローブカード及びその組立方法
DE69737599T2 (de) * 1996-09-13 2007-12-20 International Business Machines Corp. Integrierte nachgiebige sonde für waferprüfung und einbrennen
JPH10332780A (ja) * 1997-05-27 1998-12-18 Oki Electric Ind Co Ltd 半導体測定装置
US6705876B2 (en) * 1998-07-13 2004-03-16 Formfactor, Inc. Electrical interconnect assemblies and methods
JP2000346875A (ja) * 1999-06-07 2000-12-15 Advantest Corp プローブカードおよびこれを用いたｉｃ試験装置
JP2001091543A (ja) 1999-09-27 2001-04-06 Hitachi Ltd 半導体検査装置
US6498504B2 (en) * 2000-08-28 2002-12-24 Nec Corporation Wafer inspection device and wafer inspection method
JP3936547B2 (ja) * 2001-03-30 2007-06-27 ジェネシス・テクノロジー株式会社 コンタクトプローブおよびそれを備えたプローブ装置並びにコンタクトプローブの製造方法
JP2003130891A (ja) * 2001-10-22 2003-05-08 Advantest Corp プローブピン、プローブピンの製造方法及びプローブカード
US7394265B2 (en) * 2002-01-25 2008-07-01 Advantest Corp. Flat portions of a probe card flattened to have same vertical level with one another by compensating the unevenness of a substrate and each identical height needle being mounted on the corresponding flat portion through an adhesive
US6784674B2 (en) * 2002-05-08 2004-08-31 Formfactor, Inc. Test signal distribution system for IC tester
DE10320381B4 (de) * 2003-05-06 2010-11-04 Scorpion Technologies Ag Platinentestvorrichtung mit schrägstehend angetriebenen Kontaktiernadeln
JP3791689B2 (ja) * 2004-01-09 2006-06-28 日本電子材料株式会社 プローブカード
JP4711800B2 (ja) * 2005-10-07 2011-06-29 日本電子材料株式会社 プローブカードの製作方法
US7456640B2 (en) * 2006-02-16 2008-11-25 International Business Machines Corporation Structure for coupling probes of probe device to corresponding electrical contacts on product substrate

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