JP2009192309A - 半導体検査装置 - Google Patents

半導体検査装置 Download PDF

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Publication number
JP2009192309A
JP2009192309A JP2008031896A JP2008031896A JP2009192309A JP 2009192309 A JP2009192309 A JP 2009192309A JP 2008031896 A JP2008031896 A JP 2008031896A JP 2008031896 A JP2008031896 A JP 2008031896A JP 2009192309 A JP2009192309 A JP 2009192309A
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JP
Japan
Prior art keywords
probe
inspection apparatus
semiconductor inspection
substrate
wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2008031896A
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English (en)
Japanese (ja)
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JP2009192309A5 (enExample
Inventor
Akinori Shiraishi
晶紀 白石
Mitsutoshi Higashi
光敏 東
Hiroshi Murayama
啓 村山
Katsunori Yamagishi
勝則 山岸
Mitsuhiro Aizawa
光浩 相澤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
Original Assignee
Shinko Electric Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to JP2008031896A priority Critical patent/JP2009192309A/ja
Priority to US12/370,072 priority patent/US7884632B2/en
Publication of JP2009192309A publication Critical patent/JP2009192309A/ja
Publication of JP2009192309A5 publication Critical patent/JP2009192309A5/ja
Pending legal-status Critical Current

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G01R1/06727—Cantilever beams

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
JP2008031896A 2008-02-13 2008-02-13 半導体検査装置 Pending JP2009192309A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2008031896A JP2009192309A (ja) 2008-02-13 2008-02-13 半導体検査装置
US12/370,072 US7884632B2 (en) 2008-02-13 2009-02-12 Semiconductor inspecting device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008031896A JP2009192309A (ja) 2008-02-13 2008-02-13 半導体検査装置

Publications (2)

Publication Number Publication Date
JP2009192309A true JP2009192309A (ja) 2009-08-27
JP2009192309A5 JP2009192309A5 (enExample) 2011-01-20

Family

ID=40954531

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008031896A Pending JP2009192309A (ja) 2008-02-13 2008-02-13 半導体検査装置

Country Status (2)

Country Link
US (1) US7884632B2 (enExample)
JP (1) JP2009192309A (enExample)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012047674A (ja) * 2010-08-30 2012-03-08 Advantest Corp 試験用個片基板、プローブ、及び半導体ウェハ試験装置
KR101493901B1 (ko) * 2014-10-28 2015-02-17 (주)인아에스시 반도체 패키지 테스트용 유연성 실리콘 부싱 소켓
TWI484191B (zh) * 2012-09-28 2015-05-11 Hermes Epitek Corp 電路測試探針卡
KR102518123B1 (ko) * 2022-07-11 2023-04-10 성심세미콘 주식회사 전자 부품 검사용 소켓 및 소켓 핀

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US9249265B1 (en) 2014-09-08 2016-02-02 Sirrus, Inc. Emulsion polymers including one or more 1,1-disubstituted alkene compounds, emulsion methods, and polymer compositions
JP5798435B2 (ja) * 2011-03-07 2015-10-21 日本特殊陶業株式会社 電子部品検査装置用配線基板およびその製造方法
JP5777997B2 (ja) 2011-03-07 2015-09-16 日本特殊陶業株式会社 電子部品検査装置用配線基板およびその製造方法
MX370256B (es) 2011-10-19 2019-12-09 Sirrus Inc Monomeros multifuncionales, procedimientos para la preparación de monomeros multifuncionales, composiciones polimerizables y productos formados a partir de los mismos.
JP6246507B2 (ja) * 2012-11-05 2017-12-13 新光電気工業株式会社 プローブカード及びその製造方法
JP6208486B2 (ja) * 2013-07-19 2017-10-04 新光電気工業株式会社 プローブカード及びその製造方法
JP6092729B2 (ja) * 2013-07-19 2017-03-08 新光電気工業株式会社 プローブカード及びその製造方法
JP6189187B2 (ja) * 2013-11-19 2017-08-30 新光電気工業株式会社 プローブカード及びプローブカードの製造方法
US9416091B1 (en) 2015-02-04 2016-08-16 Sirrus, Inc. Catalytic transesterification of ester compounds with groups reactive under transesterification conditions
US9315597B2 (en) 2014-09-08 2016-04-19 Sirrus, Inc. Compositions containing 1,1-disubstituted alkene compounds for preparing polymers having enhanced glass transition temperatures
US10501400B2 (en) 2015-02-04 2019-12-10 Sirrus, Inc. Heterogeneous catalytic transesterification of ester compounds with groups reactive under transesterification conditions
JP6392171B2 (ja) * 2015-05-28 2018-09-19 新光電気工業株式会社 半導体装置及びその製造方法
US10428177B2 (en) 2016-06-03 2019-10-01 Sirrus, Inc. Water absorbing or water soluble polymers, intermediate compounds, and methods thereof
US11262384B2 (en) * 2016-12-23 2022-03-01 Intel Corporation Fine pitch probe card methods and systems
US11268983B2 (en) 2017-06-30 2022-03-08 Intel Corporation Chevron interconnect for very fine pitch probing
US10775414B2 (en) 2017-09-29 2020-09-15 Intel Corporation Low-profile gimbal platform for high-resolution in situ co-planarity adjustment
US11061068B2 (en) 2017-12-05 2021-07-13 Intel Corporation Multi-member test probe structure
US11204555B2 (en) 2017-12-28 2021-12-21 Intel Corporation Method and apparatus to develop lithographically defined high aspect ratio interconnects
US11073538B2 (en) 2018-01-03 2021-07-27 Intel Corporation Electrical testing apparatus with lateral movement of a probe support substrate
US10866264B2 (en) 2018-01-05 2020-12-15 Intel Corporation Interconnect structure with varying modulus of elasticity
US10488438B2 (en) 2018-01-05 2019-11-26 Intel Corporation High density and fine pitch interconnect structures in an electric test apparatus
US11543454B2 (en) 2018-09-25 2023-01-03 Intel Corporation Double-beam test probe
US10935573B2 (en) 2018-09-28 2021-03-02 Intel Corporation Slip-plane MEMS probe for high-density and fine pitch interconnects
US11094668B2 (en) * 2019-12-12 2021-08-17 Micron Technology, Inc. Solderless interconnect for semiconductor device assembly

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01160371U (enExample) * 1988-04-27 1989-11-07
JPH10332780A (ja) * 1997-05-27 1998-12-18 Oki Electric Ind Co Ltd 半導体測定装置
JP2000346875A (ja) * 1999-06-07 2000-12-15 Advantest Corp プローブカードおよびこれを用いたｉｃ試験装置
JP2001330625A (ja) * 2001-03-30 2001-11-30 Mitsubishi Materials Corp コンタクトプローブおよびそれを備えたプローブ装置並びにコンタクトプローブの製造方法
JP2003130891A (ja) * 2001-10-22 2003-05-08 Advantest Corp プローブピン、プローブピンの製造方法及びプローブカード
WO2003062837A1 (fr) * 2002-01-25 2003-07-31 Advantest Corporation Carte sonde
JP2004251910A (ja) * 1998-07-13 2004-09-09 Formfactor Inc プリント回路基板用相互接続アセンブリ及び製造方法
JP2007101506A (ja) * 2005-10-07 2007-04-19 Japan Electronic Materials Corp プローブカードの製作方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3388307B2 (ja) * 1996-05-17 2003-03-17 東京エレクトロン株式会社 プローブカード及びその組立方法
DE69737599T2 (de) * 1996-09-13 2007-12-20 International Business Machines Corp. Integrierte nachgiebige sonde für waferprüfung und einbrennen
JP2001091543A (ja) 1999-09-27 2001-04-06 Hitachi Ltd 半導体検査装置
US6498504B2 (en) * 2000-08-28 2002-12-24 Nec Corporation Wafer inspection device and wafer inspection method
US6784674B2 (en) * 2002-05-08 2004-08-31 Formfactor, Inc. Test signal distribution system for IC tester
DE10320381B4 (de) * 2003-05-06 2010-11-04 Scorpion Technologies Ag Platinentestvorrichtung mit schrägstehend angetriebenen Kontaktiernadeln
JP3791689B2 (ja) * 2004-01-09 2006-06-28 日本電子材料株式会社 プローブカード
US7456640B2 (en) * 2006-02-16 2008-11-25 International Business Machines Corporation Structure for coupling probes of probe device to corresponding electrical contacts on product substrate

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01160371U (enExample) * 1988-04-27 1989-11-07
JPH10332780A (ja) * 1997-05-27 1998-12-18 Oki Electric Ind Co Ltd 半導体測定装置
JP2004251910A (ja) * 1998-07-13 2004-09-09 Formfactor Inc プリント回路基板用相互接続アセンブリ及び製造方法
JP2000346875A (ja) * 1999-06-07 2000-12-15 Advantest Corp プローブカードおよびこれを用いたｉｃ試験装置
JP2001330625A (ja) * 2001-03-30 2001-11-30 Mitsubishi Materials Corp コンタクトプローブおよびそれを備えたプローブ装置並びにコンタクトプローブの製造方法
JP2003130891A (ja) * 2001-10-22 2003-05-08 Advantest Corp プローブピン、プローブピンの製造方法及びプローブカード
WO2003062837A1 (fr) * 2002-01-25 2003-07-31 Advantest Corporation Carte sonde
JP2007101506A (ja) * 2005-10-07 2007-04-19 Japan Electronic Materials Corp プローブカードの製作方法

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012047674A (ja) * 2010-08-30 2012-03-08 Advantest Corp 試験用個片基板、プローブ、及び半導体ウェハ試験装置
US8922232B2 (en) 2010-08-30 2014-12-30 Advantest Corporation Test-use individual substrate, probe, and semiconductor wafer testing apparatus
TWI484191B (zh) * 2012-09-28 2015-05-11 Hermes Epitek Corp 電路測試探針卡
US9423423B2 (en) 2012-09-28 2016-08-23 Hermes-Epitek Corp. Probe card for testing wafers
US9970961B2 (en) 2012-09-28 2018-05-15 Hermes-Epitek Corp. Probe card for testing wafers with fine pitch circuit
KR101493901B1 (ko) * 2014-10-28 2015-02-17 (주)인아에스시 반도체 패키지 테스트용 유연성 실리콘 부싱 소켓
KR102518123B1 (ko) * 2022-07-11 2023-04-10 성심세미콘 주식회사 전자 부품 검사용 소켓 및 소켓 핀

Also Published As

Publication number Publication date
US7884632B2 (en) 2011-02-08
US20090206861A1 (en) 2009-08-20

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