JP2011237256A5 - - Google Patents

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Publication number
JP2011237256A5
JP2011237256A5 JP2010108370A JP2010108370A JP2011237256A5 JP 2011237256 A5 JP2011237256 A5 JP 2011237256A5 JP 2010108370 A JP2010108370 A JP 2010108370A JP 2010108370 A JP2010108370 A JP 2010108370A JP 2011237256 A5 JP2011237256 A5 JP 2011237256A5
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JP
Japan
Prior art keywords
thermal
arm portion
substrate
detector
arm
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2010108370A
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English (en)
Japanese (ja)
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JP2011237256A (ja
JP5569134B2 (ja
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Publication date
Application filed filed Critical
Priority to JP2010108370A priority Critical patent/JP5569134B2/ja
Priority claimed from JP2010108370A external-priority patent/JP5569134B2/ja
Priority to US13/095,337 priority patent/US8610064B2/en
Publication of JP2011237256A publication Critical patent/JP2011237256A/ja
Publication of JP2011237256A5 publication Critical patent/JP2011237256A5/ja
Application granted granted Critical
Publication of JP5569134B2 publication Critical patent/JP5569134B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2010108370A 2010-05-10 2010-05-10 熱型光検出装置および電子機器 Expired - Fee Related JP5569134B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2010108370A JP5569134B2 (ja) 2010-05-10 2010-05-10 熱型光検出装置および電子機器
US13/095,337 US8610064B2 (en) 2010-05-10 2011-04-27 Thermal detector, thermal detector device, and electronic instrument

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010108370A JP5569134B2 (ja) 2010-05-10 2010-05-10 熱型光検出装置および電子機器

Publications (3)

Publication Number Publication Date
JP2011237256A JP2011237256A (ja) 2011-11-24
JP2011237256A5 true JP2011237256A5 (enExample) 2013-06-20
JP5569134B2 JP5569134B2 (ja) 2014-08-13

Family

ID=44901337

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010108370A Expired - Fee Related JP5569134B2 (ja) 2010-05-10 2010-05-10 熱型光検出装置および電子機器

Country Status (2)

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US (1) US8610064B2 (enExample)
JP (1) JP5569134B2 (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5771900B2 (ja) * 2010-03-26 2015-09-02 セイコーエプソン株式会社 熱型光検出器、熱型光検出装置及び電子機器
US8411442B2 (en) * 2010-09-09 2013-04-02 Texas Instruments Incorporated Vias in substrate between IC seat and peripheral thermal cage
EP2802009B1 (en) * 2013-05-08 2021-03-24 ams AG Integrated imaging device for infrared radiation and method of production
JP6119602B2 (ja) * 2013-12-26 2017-04-26 株式会社デンソー 電子装置
CN107004691B (zh) * 2015-11-12 2022-02-11 松下知识产权经营株式会社 光检测装置
JP7173125B2 (ja) * 2018-03-06 2022-11-16 Tdk株式会社 熱利用デバイス
CN111504480B (zh) * 2020-06-30 2020-10-09 北京北方高业科技有限公司 一种红外探测器
CN117222873A (zh) * 2021-05-11 2023-12-12 松下知识产权经营株式会社 热电堆型传感器和传感器阵列

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5777329A (en) * 1995-07-21 1998-07-07 Texas Instruments Incorporated Bolometer array spectrometer
US6020216A (en) * 1996-08-30 2000-02-01 Texas Instruments Incorporated Thermal detector with stress-aligned thermally sensitive element and method
JPH11148868A (ja) * 1997-11-17 1999-06-02 Masanori Okuyama 熱検知素子およびその製造方法
JP2000230860A (ja) * 1999-02-12 2000-08-22 Nissan Motor Co Ltd 熱型赤外線センサ、その製造方法および熱型赤外線アレイ素子
JP3460810B2 (ja) * 1999-07-26 2003-10-27 日本電気株式会社 熱分離構造を有する熱型赤外線検出器
FR2802338B1 (fr) * 1999-12-10 2002-01-18 Commissariat Energie Atomique Dispositif de detection de rayonnement electromagnetique
KR100538996B1 (ko) * 2003-06-19 2005-12-27 한국전자통신연구원 적외선 흡수층으로 실리콘 산화막을 사용한 적외선 센서및 그 제조 방법
JP2007150025A (ja) 2005-11-29 2007-06-14 Seiko Epson Corp 強誘電体メモリの製造方法
JP4792980B2 (ja) * 2006-01-12 2011-10-12 日産自動車株式会社 赤外線検出素子
JP5122866B2 (ja) 2006-05-25 2013-01-16 パナソニック株式会社 赤外線センサー
KR101076666B1 (ko) 2006-05-25 2011-10-26 파나소닉 전공 주식회사 적외선 센서
FR2904910B1 (fr) * 2006-08-14 2009-02-06 Ulis Soc Par Actions Simplifie Detecteur de rayonnement infrarouge et dispositif d'aide a la conduite ou au pilotage comprenant un tel dispositif
JP2008218782A (ja) 2007-03-06 2008-09-18 Seiko Epson Corp 半導体装置及びその製造方法
JP4741541B2 (ja) * 2007-03-30 2011-08-03 本田技研工業株式会社 エンジンの動弁装置
JP2009065089A (ja) 2007-09-10 2009-03-26 Seiko Epson Corp 半導体装置及びその製造方法
JP2009071022A (ja) 2007-09-13 2009-04-02 Seiko Epson Corp 半導体装置の製造方法、及び半導体装置
JP2009071242A (ja) 2007-09-18 2009-04-02 Seiko Epson Corp 半導体装置及びその製造方法
JP2009071241A (ja) 2007-09-18 2009-04-02 Seiko Epson Corp 半導体装置及びその製造方法
JP2009124017A (ja) 2007-11-16 2009-06-04 Seiko Epson Corp 強誘電体メモリ装置およびその製造方法
JP4453846B2 (ja) 2007-11-20 2010-04-21 セイコーエプソン株式会社 強誘電体メモリ装置およびその製造方法
JP2009130188A (ja) 2007-11-26 2009-06-11 Seiko Epson Corp メモリ装置の製造方法
JP2009141179A (ja) 2007-12-07 2009-06-25 Seiko Epson Corp 強誘電体メモリ装置およびその製造方法
JP2009180682A (ja) * 2008-01-31 2009-08-13 Ritsumeikan 赤外線センサ
JP2009229260A (ja) * 2008-03-24 2009-10-08 Toshiba Corp 赤外線センサ素子
FR2930639B1 (fr) * 2008-04-29 2011-07-01 Ulis Detecteur thermique a haute isolation

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