JP4970401B2 - 半導体装置 - Google Patents

半導体装置 Download PDF

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Publication number
JP4970401B2
JP4970401B2 JP2008267102A JP2008267102A JP4970401B2 JP 4970401 B2 JP4970401 B2 JP 4970401B2 JP 2008267102 A JP2008267102 A JP 2008267102A JP 2008267102 A JP2008267102 A JP 2008267102A JP 4970401 B2 JP4970401 B2 JP 4970401B2
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Prior art keywords
lead
semiconductor
semiconductor device
lead frame
mounting region
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JP2008267102A
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English (en)
Japanese (ja)
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JP2009117819A (ja
JP2009117819A5 (enExample
Inventor
善秋 後藤
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Toshiba Corp
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Toshiba Corp
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Priority to JP2008267102A priority Critical patent/JP4970401B2/ja
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Publication of JP2009117819A5 publication Critical patent/JP2009117819A5/ja
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    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/73—Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
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    • H01L2924/01—Chemical elements
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    • H01L2924/01—Chemical elements
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    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
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    • H01L2924/01—Chemical elements
    • H01L2924/01057—Lanthanum [La]
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    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
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    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Lead Frames For Integrated Circuits (AREA)
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JP5275019B2 (ja) * 2008-12-26 2013-08-28 株式会社東芝 半導体装置
JP5361426B2 (ja) 2009-02-05 2013-12-04 株式会社東芝 半導体デバイス
KR101685057B1 (ko) * 2010-01-22 2016-12-09 삼성전자주식회사 반도체 소자의 적층 패키지
JP5032623B2 (ja) * 2010-03-26 2012-09-26 株式会社東芝 半導体記憶装置
JP5924313B2 (ja) * 2012-08-06 2016-05-25 株式会社デンソー ダイオード
JP6680274B2 (ja) * 2017-06-27 2020-04-15 日亜化学工業株式会社 発光装置及び樹脂付リードフレーム

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US8618643B2 (en) 2013-12-31
US20110260312A1 (en) 2011-10-27
US20190139849A1 (en) 2019-05-09
US10199300B2 (en) 2019-02-05
US9589870B2 (en) 2017-03-07
US20200388547A1 (en) 2020-12-10
US20170154832A1 (en) 2017-06-01
US20090096073A1 (en) 2009-04-16
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US20160027720A1 (en) 2016-01-28
US9177900B2 (en) 2015-11-03
US20140077348A1 (en) 2014-03-20
US11688659B2 (en) 2023-06-27
US10777479B2 (en) 2020-09-15
JP4970610B2 (ja) 2012-07-11

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