JP4751351B2 - 半導体装置とそれを用いた半導体モジュール - Google Patents
半導体装置とそれを用いた半導体モジュール Download PDFInfo
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- JP4751351B2 JP4751351B2 JP2007038862A JP2007038862A JP4751351B2 JP 4751351 B2 JP4751351 B2 JP 4751351B2 JP 2007038862 A JP2007038862 A JP 2007038862A JP 2007038862 A JP2007038862 A JP 2007038862A JP 4751351 B2 JP4751351 B2 JP 4751351B2
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- semiconductor
- electrode pad
- circuit board
- semiconductor element
- pad
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Description
Claims (5)
- 第1の接続パッドを有する第1の主面と、第2の接続パッドを有し、前記第1の主面とは反対側の第2の主面と、前記第1の接続パッドの近傍を貫通するように設けられた第1の開口部と、前記第2の接続パッドの近傍を貫通するように設けられた第2の開口部とを備える回路基板と、
第1の電極パッドを有し、前記第1の電極パッドが前記第2の開口部内に露出するように、前記回路基板の第1の主面に搭載された第1の半導体素子と、
第2の電極パッドを有し、前記第2の電極パッドが前記第1の開口部内に露出するように、前記回路基板の第2の主面に搭載された第2の半導体素子と、
前記第1の開口部を介して配置され、前記第1の接続パッドと前記第2の電極パッドとを電気的に接続する第1の接続部と、
前記第2の開口部を介して配置され、前記第2の接続パッドと前記第1の電極パッドとを電気的に接続する第2の接続部と、
前記第1および第2の半導体素子を前記第1および第2の接続部と前記回路基板の一部と共に封止する封止部と
を具備することを特徴とする半導体装置。 - 請求項1記載の半導体装置において、
前記回路基板は前記第2の主面の前記封止部による封止領域を除く領域に形成された外部接続端子を有することを特徴とする半導体装置。 - 請求項1または請求項2記載の半導体装置において、
さらに、第3の電極パッドを有する第3の半導体素子を具備し、
前記第3の半導体素子は前記第3の電極パッドが前記第2の開口部内に露出するように、前記第1の半導体素子と積層されており、かつ前記第3の電極パッドは前記第2の接続パッドと電気的に接続されており、
前記第3の電極パッドは、前記第1の電極パッドを介して前記第2の接続部により前記第2の接続パッドと電気的に接続された、前記第1の電極パッドとの共通電極を有することを特徴とする半導体装置。 - 請求項1ないし請求項3のいずれか1項記載の半導体装置において、
さらに、第4の電極パッドを有する第4の半導体素子を具備し、
前記第4の半導体素子は前記第4の電極パッドが前記第1の開口部内に露出するように、前記第2の半導体素子と積層されており、かつ前記第4の電極パッドは前記第1の接続パッドと電気的に接続されており、
前記第4の電極パッドは、前記第2の電極パッドを介して前記第1の接続部により前記第1の接続パッドと電気的に接続された、前記第2の電極パッドとの共通電極を有することを特徴とする半導体装置。 - 請求項2ないし請求項4のいずれか1項記載の半導体装置を複数具備する半導体モジュールであって、前記複数の半導体装置は積層されていると共に、それぞれ前記外部接続端子を介して電気的に接続されていることを特徴とする半導体モジュール。
Priority Applications (5)
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JP2007038862A JP4751351B2 (ja) | 2007-02-20 | 2007-02-20 | 半導体装置とそれを用いた半導体モジュール |
US12/032,104 US7763964B2 (en) | 2007-02-20 | 2008-02-15 | Semiconductor device and semiconductor module using the same |
TW097105624A TWI389285B (zh) | 2007-02-20 | 2008-02-18 | 半導體裝置及使用其之半導體模組 |
KR1020080014692A KR100966684B1 (ko) | 2007-02-20 | 2008-02-19 | 반도체 장치와 그것을 이용한 반도체 모듈 |
CN2008100920287A CN101257013B (zh) | 2007-02-20 | 2008-02-20 | 半导体装置和采用其的半导体模块 |
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JP2007038862A JP4751351B2 (ja) | 2007-02-20 | 2007-02-20 | 半導体装置とそれを用いた半導体モジュール |
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JP (1) | JP4751351B2 (ja) |
KR (1) | KR100966684B1 (ja) |
CN (1) | CN101257013B (ja) |
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KR100575590B1 (ko) * | 2003-12-17 | 2006-05-03 | 삼성전자주식회사 | 열방출형 적층 패키지 및 그들이 실장된 모듈 |
JP4103796B2 (ja) * | 2003-12-25 | 2008-06-18 | 沖電気工業株式会社 | 半導体チップパッケージ及びマルチチップパッケージ |
US7135781B2 (en) * | 2004-08-10 | 2006-11-14 | Texas Instruments Incorporated | Low profile, chip-scale package and method of fabrication |
US8324725B2 (en) * | 2004-09-27 | 2012-12-04 | Formfactor, Inc. | Stacked die module |
JP2007035864A (ja) * | 2005-07-26 | 2007-02-08 | Toshiba Corp | 半導体パッケージ |
US7352058B2 (en) * | 2005-11-01 | 2008-04-01 | Sandisk Corporation | Methods for a multiple die integrated circuit package |
JP2007134486A (ja) * | 2005-11-10 | 2007-05-31 | Toshiba Corp | 積層型半導体装置及びその製造方法 |
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TW200901427A (en) | 2009-01-01 |
JP2008205143A (ja) | 2008-09-04 |
KR100966684B1 (ko) | 2010-06-29 |
TWI389285B (zh) | 2013-03-11 |
US7763964B2 (en) | 2010-07-27 |
US20080197472A1 (en) | 2008-08-21 |
CN101257013B (zh) | 2011-04-13 |
CN101257013A (zh) | 2008-09-03 |
KR20080077566A (ko) | 2008-08-25 |
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