JP4489094B2 - 半導体パッケージ - Google Patents
半導体パッケージ Download PDFInfo
- Publication number
- JP4489094B2 JP4489094B2 JP2007119798A JP2007119798A JP4489094B2 JP 4489094 B2 JP4489094 B2 JP 4489094B2 JP 2007119798 A JP2007119798 A JP 2007119798A JP 2007119798 A JP2007119798 A JP 2007119798A JP 4489094 B2 JP4489094 B2 JP 4489094B2
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- Prior art keywords
- semiconductor
- semiconductor element
- electrode
- semiconductor elements
- lead frame
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Description
Claims (2)
- 素子支持部と、インナーリードとアウターリードとを有するリード部とを備え、前記素子支持部から前記インナーリードまでが平坦なリードフレームと、
第1の電極パッドが形成された第1の電極形成面を有し、前記第1の電極形成面を下方に向けて前記リードフレームの下面側に第1の接着層を介して接着された第1の半導体素子と、
第2の電極パッドが形成された第2の電極形成面を有し、前記第2の電極形成面を下方に向けて前記第1の半導体素子の第1の電極形成面に第2の接着層を介して接着された第2の半導体素子と、
前記インナーリードと前記第1の電極パッドとに接続され、前記第1の半導体素子との接続側端部が前記第2の接着層内に埋め込まれた第1の金属ワイヤと、
前記インナーリードと前記第2の電極パッドとに接続された第2の金属ワイヤと、
前記第1および第2の半導体素子を前記第1および第2の金属ワイヤと共に封止する樹脂封止部とを具備し、
前記第1および第2の前記電極パッドはそれぞれ前記第1および第2の半導体素子の片側の長辺に沿って配列されており、
かつ、前記アウターリードは前記第1および第2の半導体素子の対向する短辺からそれぞれ突出するように配置されていると共に、前記インナーリードは前記アウターリードから前記第1および第2の電極パッドが配列された前記第1および第2の半導体素子の長辺に向けて引き回されていることを特徴とする半導体パッケージ。 - 請求項1記載の半導体パッケージにおいて、
さらに、第3の電極パッドが形成された第3の電極形成面を有し、前記第3の電極形成面を下方に向けて前記第2の半導体素子の第2の電極形成面に第3の接着層を介して接着された第3の半導体素子と、
第4の電極パッドが形成された第4の電極形成面を有し、前記第4の電極形成面を下方に向けて前記第3の半導体素子の第3の電極形成面に第4の接着層を介して接着された第4の半導体素子と、
前記インナーリードと前記第3の電極パッドとに接続された第3の金属ワイヤと、
前記インナーリードと前記第4の電極パッドとに接続された第4の金属ワイヤとを具備し、
前記第2の金属ワイヤの前記第2の半導体素子との接続側端部は前記第3の接着層内に埋め込まれており、かつ前記第3の金属ワイヤの前記第3の半導体素子との接続側端部は前記第4の接着層内に埋め込まれており、
前記第3および第4の電極パッドはそれぞれ前記第3および第4の半導体素子の片側の長辺に沿って配列されていることを特徴とする半導体パッケージ。
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JP2007119798A JP4489094B2 (ja) | 2007-04-27 | 2007-04-27 | 半導体パッケージ |
TW101100070A TWI397167B (zh) | 2007-04-27 | 2008-04-21 | 半導體裝置 |
TW097114533A TWI363417B (en) | 2007-04-27 | 2008-04-21 | Semiconductor device |
TW101123783A TWI515871B (zh) | 2007-04-27 | 2008-04-21 | 導線架 |
US12/106,511 US8022515B2 (en) | 2007-04-27 | 2008-04-21 | Semiconductor device |
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US8680686B2 (en) * | 2010-06-29 | 2014-03-25 | Spansion Llc | Method and system for thin multi chip stack package with film on wire and copper wire |
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US8022515B2 (en) | 2011-09-20 |
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TWI515871B (zh) | 2016-01-01 |
TW201246512A (en) | 2012-11-16 |
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US20080277770A1 (en) | 2008-11-13 |
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