JP2011114192A5 - - Google Patents

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Publication number
JP2011114192A5
JP2011114192A5 JP2009269789A JP2009269789A JP2011114192A5 JP 2011114192 A5 JP2011114192 A5 JP 2011114192A5 JP 2009269789 A JP2009269789 A JP 2009269789A JP 2009269789 A JP2009269789 A JP 2009269789A JP 2011114192 A5 JP2011114192 A5 JP 2011114192A5
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JP
Japan
Prior art keywords
wiring board
semiconductor device
wiring
cap
semiconductor element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2009269789A
Other languages
English (en)
Japanese (ja)
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JP2011114192A (ja
JP5231382B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2009269789A priority Critical patent/JP5231382B2/ja
Priority claimed from JP2009269789A external-priority patent/JP5231382B2/ja
Priority to US12/953,808 priority patent/US8592959B2/en
Publication of JP2011114192A publication Critical patent/JP2011114192A/ja
Publication of JP2011114192A5 publication Critical patent/JP2011114192A5/ja
Application granted granted Critical
Publication of JP5231382B2 publication Critical patent/JP5231382B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2009269789A 2009-11-27 2009-11-27 半導体装置 Active JP5231382B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2009269789A JP5231382B2 (ja) 2009-11-27 2009-11-27 半導体装置
US12/953,808 US8592959B2 (en) 2009-11-27 2010-11-24 Semiconductor device mounted on a wiring board having a cap

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009269789A JP5231382B2 (ja) 2009-11-27 2009-11-27 半導体装置

Publications (3)

Publication Number Publication Date
JP2011114192A JP2011114192A (ja) 2011-06-09
JP2011114192A5 true JP2011114192A5 (enExample) 2012-09-20
JP5231382B2 JP5231382B2 (ja) 2013-07-10

Family

ID=44068235

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009269789A Active JP5231382B2 (ja) 2009-11-27 2009-11-27 半導体装置

Country Status (2)

Country Link
US (1) US8592959B2 (enExample)
JP (1) JP5231382B2 (enExample)

Families Citing this family (28)

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JP2011128140A (ja) * 2009-11-19 2011-06-30 Dainippon Printing Co Ltd センサデバイス及びその製造方法
JP5827476B2 (ja) * 2011-03-08 2015-12-02 株式会社東芝 半導体モジュール及びその製造方法
JP6003897B2 (ja) * 2011-09-26 2016-10-05 日本電気株式会社 中空封止構造
KR20130041645A (ko) * 2011-10-17 2013-04-25 삼성전기주식회사 인쇄회로기판
FR2995721B1 (fr) * 2012-09-17 2014-11-21 Commissariat Energie Atomique Capot pour dispositif a rainure et a puce, dispositif equipe du capot, assemblage du dispositif avec un element filaire et procede de fabrication
JP2014072346A (ja) * 2012-09-28 2014-04-21 Nec Corp 中空封止構造及び中空封止構造の製造方法
JP6383147B2 (ja) * 2013-12-10 2018-08-29 日本特殊陶業株式会社 パッケージ
JP6247106B2 (ja) * 2014-02-03 2017-12-13 新光電気工業株式会社 半導体装置
US9693445B2 (en) * 2015-01-30 2017-06-27 Avago Technologies General Ip (Singapore) Pte. Ltd. Printed circuit board with thermal via
GB2555289B (en) * 2015-06-10 2020-09-23 Mitsubishi Electric Corp Semiconductor device and method of manufacturing the same
JP2017038019A (ja) * 2015-08-13 2017-02-16 富士電機株式会社 半導体装置
CN107534022B (zh) * 2015-11-25 2019-03-15 京瓷株式会社 电子部件收纳用封装体、电子装置以及电子模块
DE112016005452B4 (de) * 2015-11-30 2022-05-05 W.L. Gore & Associates, Inc. Umgebungsschutzbarriere für einen Chip
US9870967B2 (en) * 2016-03-10 2018-01-16 Analog Devices, Inc. Plurality of seals for integrated device package
US9887143B2 (en) * 2016-03-25 2018-02-06 Infineon Technologies Americas Corp. Surface mount device package having improved reliability
US10177064B2 (en) * 2016-08-26 2019-01-08 Qorvo Us, Inc. Air cavity package
US10269669B2 (en) * 2016-12-14 2019-04-23 Taiwan Semiconductor Manufacturing Co., Ltd. Semiconductor package and method of forming the same
US10629545B2 (en) * 2017-03-09 2020-04-21 Taiwan Semiconductor Manufacturing Company Ltd. Semiconductor device
FR3069406A1 (fr) * 2017-07-18 2019-01-25 Stmicroelectronics (Grenoble 2) Sas Boitier electronique et procede de fabrication
WO2019093269A1 (ja) * 2017-11-09 2019-05-16 Ｎｇｋエレクトロデバイス株式会社 蓋体および電子装置
JP6929210B2 (ja) * 2017-12-11 2021-09-01 株式会社ブリヂストン タイヤ
US10867955B2 (en) * 2018-09-27 2020-12-15 Taiwan Semiconductor Manufacturing Company, Ltd. Package structure having adhesive layer surrounded dam structure
CN111193492B (zh) * 2018-11-14 2023-08-15 天津大学 封装结构、半导体器件、电子设备
CN113692644B (zh) * 2019-04-22 2024-10-25 京瓷株式会社 电子部件收纳用封装件、电子装置以及电子模块
US20200411407A1 (en) * 2019-06-26 2020-12-31 Intel Corporation Integrated circuit packages with solder thermal interface material
KR102430750B1 (ko) * 2019-08-22 2022-08-08 스템코 주식회사 회로 기판 및 그 제조 방법
CN115312549A (zh) * 2021-05-05 2022-11-08 胜丽国际股份有限公司 传感器封装结构
US11948893B2 (en) * 2021-12-21 2024-04-02 Qorvo Us, Inc. Electronic component with lid to manage radiation feedback

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JPS58106947A (ja) 1981-12-21 1983-06-25 Fujitsu Ltd 光センサ
JPS58177946A (ja) 1982-04-13 1983-10-18 Mitsui Toatsu Chem Inc ３，３′−ジアミノベンゾフエノンの製造方法
JPS58106947U (ja) * 1982-01-14 1983-07-21 株式会社日立製作所 半導体の実装構造
JPS58177946U (ja) * 1982-05-21 1983-11-28 富士通株式会社 Ｉｃ収容「きよう」体
JPH0216758A (ja) * 1988-07-05 1990-01-19 Nec Corp 半導体装置用キャップ
JPH03114247A (ja) * 1989-09-28 1991-05-15 Nec Yamagata Ltd パッケージ型半導体装置
JP2906756B2 (ja) * 1991-08-06 1999-06-21 イビデン株式会社 電子部品搭載用基板
US5311402A (en) * 1992-02-14 1994-05-10 Nec Corporation Semiconductor device package having locating mechanism for properly positioning semiconductor device within package
JPH0746709A (ja) 1993-08-04 1995-02-14 Fuji Heavy Ind Ltd パラレルハイブリッド車のバッテリ充放電制御装置
JPH09232551A (ja) * 1996-02-26 1997-09-05 Toshiba Corp 光電変換装置
JP3859340B2 (ja) * 1998-01-06 2006-12-20 三菱電機株式会社 半導体装置
AU2001272814A1 (en) * 2000-07-25 2002-02-05 Chan-Ik Park Plastic package base, air cavity type package and their manufacturing methods
JP3533159B2 (ja) * 2000-08-31 2004-05-31 Ｎｅｃ化合物デバイス株式会社 半導体装置及びその製造方法
US7064048B2 (en) * 2003-10-17 2006-06-20 United Microelectronics Corp. Method of forming a semi-insulating region
DE102004021365A1 (de) * 2004-03-16 2005-10-06 Robert Bosch Gmbh Gehäuse für eine elektronische Schaltung und Verfahren zum Abdichten des Gehäuses
JP4511278B2 (ja) * 2004-08-11 2010-07-28 三洋電機株式会社 セラミックパッケージ
TWI299552B (en) * 2006-03-24 2008-08-01 Advanced Semiconductor Eng Package structure

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