JP5231382B2 - 半導体装置 - Google Patents

半導体装置 Download PDF

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Publication number
JP5231382B2
JP5231382B2 JP2009269789A JP2009269789A JP5231382B2 JP 5231382 B2 JP5231382 B2 JP 5231382B2 JP 2009269789 A JP2009269789 A JP 2009269789A JP 2009269789 A JP2009269789 A JP 2009269789A JP 5231382 B2 JP5231382 B2 JP 5231382B2
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JP
Japan
Prior art keywords
wiring
cap
package
cavity
substrate
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JP2009269789A
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English (en)
Japanese (ja)
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JP2011114192A (ja
JP2011114192A5 (enExample
Inventor
朋治 藤井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
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Shinko Electric Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to JP2009269789A priority Critical patent/JP5231382B2/ja
Priority to US12/953,808 priority patent/US8592959B2/en
Publication of JP2011114192A publication Critical patent/JP2011114192A/ja
Publication of JP2011114192A5 publication Critical patent/JP2011114192A5/ja
Application granted granted Critical
Publication of JP5231382B2 publication Critical patent/JP5231382B2/ja
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    • H10W40/228—
    • H10W70/68—
    • H10W76/12—
    • H10W76/153—
    • H10W76/60—
    • H10W70/682—
    • H10W72/5445—
    • H10W72/884—
    • H10W72/932—
    • H10W90/734—
    • H10W90/754—

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  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP2009269789A 2009-11-27 2009-11-27 半導体装置 Active JP5231382B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2009269789A JP5231382B2 (ja) 2009-11-27 2009-11-27 半導体装置
US12/953,808 US8592959B2 (en) 2009-11-27 2010-11-24 Semiconductor device mounted on a wiring board having a cap

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009269789A JP5231382B2 (ja) 2009-11-27 2009-11-27 半導体装置

Publications (3)

Publication Number Publication Date
JP2011114192A JP2011114192A (ja) 2011-06-09
JP2011114192A5 JP2011114192A5 (enExample) 2012-09-20
JP5231382B2 true JP5231382B2 (ja) 2013-07-10

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ID=44068235

Family Applications (1)

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JP2009269789A Active JP5231382B2 (ja) 2009-11-27 2009-11-27 半導体装置

Country Status (2)

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US (1) US8592959B2 (enExample)
JP (1) JP5231382B2 (enExample)

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Publication number Priority date Publication date Assignee Title
JP2011128140A (ja) * 2009-11-19 2011-06-30 Dainippon Printing Co Ltd センサデバイス及びその製造方法
JP5827476B2 (ja) * 2011-03-08 2015-12-02 株式会社東芝 半導体モジュール及びその製造方法
US9125311B2 (en) * 2011-09-26 2015-09-01 Nec Corporation Hollow sealing structure
KR20130041645A (ko) * 2011-10-17 2013-04-25 삼성전기주식회사 인쇄회로기판
FR2995721B1 (fr) * 2012-09-17 2014-11-21 Commissariat Energie Atomique Capot pour dispositif a rainure et a puce, dispositif equipe du capot, assemblage du dispositif avec un element filaire et procede de fabrication
JP2014072346A (ja) * 2012-09-28 2014-04-21 Nec Corp 中空封止構造及び中空封止構造の製造方法
JP6383147B2 (ja) * 2013-12-10 2018-08-29 日本特殊陶業株式会社 パッケージ
JP6247106B2 (ja) 2014-02-03 2017-12-13 新光電気工業株式会社 半導体装置
US9693445B2 (en) * 2015-01-30 2017-06-27 Avago Technologies General Ip (Singapore) Pte. Ltd. Printed circuit board with thermal via
GB2555289B (en) * 2015-06-10 2020-09-23 Mitsubishi Electric Corp Semiconductor device and method of manufacturing the same
JP2017038019A (ja) * 2015-08-13 2017-02-16 富士電機株式会社 半導体装置
KR101943895B1 (ko) 2015-11-25 2019-01-30 쿄세라 코포레이션 전자 부품 수납용 패키지, 전자 장치 및 전자 모듈
KR102204276B1 (ko) * 2015-11-30 2021-01-15 더블유.엘. 고어 앤드 어소시에이트스, 인코포레이티드 다이를 위한 보호용 환경 배리어
US9870967B2 (en) * 2016-03-10 2018-01-16 Analog Devices, Inc. Plurality of seals for integrated device package
US9887143B2 (en) * 2016-03-25 2018-02-06 Infineon Technologies Americas Corp. Surface mount device package having improved reliability
US10177064B2 (en) * 2016-08-26 2019-01-08 Qorvo Us, Inc. Air cavity package
US10269669B2 (en) * 2016-12-14 2019-04-23 Taiwan Semiconductor Manufacturing Co., Ltd. Semiconductor package and method of forming the same
US10629545B2 (en) 2017-03-09 2020-04-21 Taiwan Semiconductor Manufacturing Company Ltd. Semiconductor device
FR3069406A1 (fr) * 2017-07-18 2019-01-25 Stmicroelectronics (Grenoble 2) Sas Boitier electronique et procede de fabrication
JP6888114B2 (ja) * 2017-11-09 2021-06-16 Ｎｇｋエレクトロデバイス株式会社 蓋体および電子装置
JP6929210B2 (ja) * 2017-12-11 2021-09-01 株式会社ブリヂストン タイヤ
US10867955B2 (en) * 2018-09-27 2020-12-15 Taiwan Semiconductor Manufacturing Company, Ltd. Package structure having adhesive layer surrounded dam structure
CN111193492B (zh) * 2018-11-14 2023-08-15 天津大学 封装结构、半导体器件、电子设备
CN113692644B (zh) * 2019-04-22 2024-10-25 京瓷株式会社 电子部件收纳用封装件、电子装置以及电子模块
US20200411407A1 (en) * 2019-06-26 2020-12-31 Intel Corporation Integrated circuit packages with solder thermal interface material
KR102430750B1 (ko) * 2019-08-22 2022-08-08 스템코 주식회사 회로 기판 및 그 제조 방법
CN115312549A (zh) * 2021-05-05 2022-11-08 胜丽国际股份有限公司 传感器封装结构
US11948893B2 (en) 2021-12-21 2024-04-02 Qorvo Us, Inc. Electronic component with lid to manage radiation feedback

Family Cites Families (17)

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Publication number Priority date Publication date Assignee Title
JPS58106947A (ja) 1981-12-21 1983-06-25 Fujitsu Ltd 光センサ
JPS58177946A (ja) 1982-04-13 1983-10-18 Mitsui Toatsu Chem Inc ３，３′−ジアミノベンゾフエノンの製造方法
JPS58106947U (ja) * 1982-01-14 1983-07-21 株式会社日立製作所 半導体の実装構造
JPS58177946U (ja) * 1982-05-21 1983-11-28 富士通株式会社 Ｉｃ収容「きよう」体
JPH0216758A (ja) * 1988-07-05 1990-01-19 Nec Corp 半導体装置用キャップ
JPH03114247A (ja) * 1989-09-28 1991-05-15 Nec Yamagata Ltd パッケージ型半導体装置
JP2906756B2 (ja) * 1991-08-06 1999-06-21 イビデン株式会社 電子部品搭載用基板
CA2089435C (en) * 1992-02-14 1997-12-09 Kenzi Kobayashi Semiconductor device
JPH0746709A (ja) 1993-08-04 1995-02-14 Fuji Heavy Ind Ltd パラレルハイブリッド車のバッテリ充放電制御装置
JPH09232551A (ja) * 1996-02-26 1997-09-05 Toshiba Corp 光電変換装置
JP3859340B2 (ja) * 1998-01-06 2006-12-20 三菱電機株式会社 半導体装置
US6983537B2 (en) * 2000-07-25 2006-01-10 Mediana Electronic Co., Ltd. Method of making a plastic package with an air cavity
JP3533159B2 (ja) * 2000-08-31 2004-05-31 Ｎｅｃ化合物デバイス株式会社 半導体装置及びその製造方法
US7064048B2 (en) * 2003-10-17 2006-06-20 United Microelectronics Corp. Method of forming a semi-insulating region
DE102004021365A1 (de) * 2004-03-16 2005-10-06 Robert Bosch Gmbh Gehäuse für eine elektronische Schaltung und Verfahren zum Abdichten des Gehäuses
JP4511278B2 (ja) * 2004-08-11 2010-07-28 三洋電機株式会社 セラミックパッケージ
TWI299552B (en) * 2006-03-24 2008-08-01 Advanced Semiconductor Eng Package structure

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Publication number Publication date
JP2011114192A (ja) 2011-06-09
US8592959B2 (en) 2013-11-26
US20110127655A1 (en) 2011-06-02

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