JPS58106947U - 半導体の実装構造 - Google Patents

半導体の実装構造

Info

Publication number
JPS58106947U
JPS58106947U JP1982002773U JP277382U JPS58106947U JP S58106947 U JPS58106947 U JP S58106947U JP 1982002773 U JP1982002773 U JP 1982002773U JP 277382 U JP277382 U JP 277382U JP S58106947 U JPS58106947 U JP S58106947U
Authority
JP
Japan
Prior art keywords
mounting structure
semiconductor mounting
brazing metal
semiconductor
dam
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1982002773U
Other languages
English (en)
Inventor
一行 田中
薗田　英明
健之 鈴木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP1982002773U priority Critical patent/JPS58106947U/ja
Publication of JPS58106947U publication Critical patent/JPS58106947U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap

Landscapes

  • Solid State Image Pick-Up Elements (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図は従来の半導体の実装構造の一面図、第□２図は
本考案を低一点ガラス射場のセラミツクチ゛　″、ツブ
キャリアに適用したときのセラミツ、クチツブ　　＼、
キャリアの断面図、第３図は本考案を用いたキヤ　、　
　　１、ツブとベースめガラス接合部の部分断面図であ
る。

Claims (1)

    【実用新案登録請求の範囲】
  1. 、　−″　シリコンチップブを取り付けたさ−ス部公ト
    キャップをろう材により接合する半導体のパツケー？構
    造において、′前記接金ろう材の流動による接合、　、
    部の変動を防牢するために、ダムを設けたことを特徴と
    する半導体の実装構造。
JP1982002773U 1982-01-14 1982-01-14 半導体の実装構造 Pending JPS58106947U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1982002773U JPS58106947U (ja) 1982-01-14 1982-01-14 半導体の実装構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1982002773U JPS58106947U (ja) 1982-01-14 1982-01-14 半導体の実装構造

Publications (1)

Publication Number Publication Date
JPS58106947U true JPS58106947U (ja) 1983-07-21

Family

ID=30015731

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1982002773U Pending JPS58106947U (ja) 1982-01-14 1982-01-14 半導体の実装構造

Country Status (1)

Country Link
JP (1) JPS58106947U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011114192A (ja) * 2009-11-27 2011-06-09 Shinko Electric Ind Co Ltd 半導体装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011114192A (ja) * 2009-11-27 2011-06-09 Shinko Electric Ind Co Ltd 半導体装置

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