JPS59145047U - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS59145047U
JPS59145047U JP1983038962U JP3896283U JPS59145047U JP S59145047 U JPS59145047 U JP S59145047U JP 1983038962 U JP1983038962 U JP 1983038962U JP 3896283 U JP3896283 U JP 3896283U JP S59145047 U JPS59145047 U JP S59145047U
Authority
JP
Japan
Prior art keywords
chip
semiconductor equipment
abstract
semiconductor device
bonding wire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1983038962U
Other languages
English (en)
Inventor
市原　孝弘
Original Assignee
九州日本電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 九州日本電気株式会社 filed Critical 九州日本電気株式会社
Priority to JP1983038962U priority Critical patent/JPS59145047U/ja
Publication of JPS59145047U publication Critical patent/JPS59145047U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32135—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/32145—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48464—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area also being a ball bond, i.e. ball-to-ball

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図ａ、　　ｂは従来の半導体装置の斜視図および断
面図、第２図は本考案の一実施例の断面図である。 １・・・ベースリボンアイランド、２・・・リード、３
・・・ＩＣチップ、４．７・・・ボンデ−イングワイヤ
、５・・・第１のＩＣチップ、６・・・第２のＩＣチッ
プ。　　　　。

Claims (1)

    【実用新案登録請求の範囲】
  1. 第１のＩＣチップと、この第１のＩＣチップの上に重ね
    て固定され、さらに前記第１のＩＣチップと共通な電極
    同志がホンディングワイヤにより接続された第２のＩＣ
    チップとを備えたことを特徴とする半導体装置。
JP1983038962U 1983-03-17 1983-03-17 半導体装置 Pending JPS59145047U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1983038962U JPS59145047U (ja) 1983-03-17 1983-03-17 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1983038962U JPS59145047U (ja) 1983-03-17 1983-03-17 半導体装置

Publications (1)

Publication Number Publication Date
JPS59145047U true JPS59145047U (ja) 1984-09-28

Family

ID=30169623

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1983038962U Pending JPS59145047U (ja) 1983-03-17 1983-03-17 半導体装置

Country Status (1)

Country Link
JP (1) JPS59145047U (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03116860A (ja) * 1989-09-29 1991-05-17 Hitachi Ltd 半導体装置
JPH0575017A (ja) * 1991-01-02 1993-03-26 Honeywell Inc 直接式マイクロ回路の減結合装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03116860A (ja) * 1989-09-29 1991-05-17 Hitachi Ltd 半導体装置
JPH0575017A (ja) * 1991-01-02 1993-03-26 Honeywell Inc 直接式マイクロ回路の減結合装置

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