JPS58111958U - - Google Patents

Info

Publication number
JPS58111958U
JPS58111958U JP729882U JP729882U JPS58111958U JP S58111958 U JPS58111958 U JP S58111958U JP 729882 U JP729882 U JP 729882U JP 729882 U JP729882 U JP 729882U JP S58111958 U JPS58111958 U JP S58111958U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP729882U
Other versions
JPH0410699Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP729882U priority Critical patent/JPH0410699Y2/ja
Publication of JPS58111958U publication Critical patent/JPS58111958U/ja
Application granted granted Critical
Publication of JPH0410699Y2 publication Critical patent/JPH0410699Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48135Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/4823Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a pin of the item
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
JP729882U 1982-01-21 1982-01-21 Granted JPH0410699Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP729882U JPH0410699Y2 (ja) 1982-01-21 1982-01-21

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP729882U JPH0410699Y2 (ja) 1982-01-21 1982-01-21

Publications (2)

Publication Number Publication Date
JPS58111958U true JPS58111958U (ja) 1983-07-30
JPH0410699Y2 JPH0410699Y2 (ja) 1992-03-17

Family

ID=30020054

Family Applications (1)

Application Number Title Priority Date Filing Date
JP729882U Granted JPH0410699Y2 (ja) 1982-01-21 1982-01-21

Country Status (1)

Country Link
JP (1) JPH0410699Y2 (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10163519A (ja) * 1996-10-01 1998-06-19 Toshiba Corp 半導体装置及び半導体装置製造方法
JP2001230453A (ja) * 1999-12-08 2001-08-24 Nichia Chem Ind Ltd Ledランプ及びその製造方法
JP2002094130A (ja) * 1999-01-05 2002-03-29 Nichia Chem Ind Ltd 発光ダイオード及びその製造方法、並びにそれを用いた表示装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51115775A (en) * 1975-04-04 1976-10-12 Nec Corp Semiconductor apparatus
JPS574183A (en) * 1980-06-10 1982-01-09 Toshiba Corp Metallic thin strip for installing semiconductor light-emitting element

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51115775A (en) * 1975-04-04 1976-10-12 Nec Corp Semiconductor apparatus
JPS574183A (en) * 1980-06-10 1982-01-09 Toshiba Corp Metallic thin strip for installing semiconductor light-emitting element

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10163519A (ja) * 1996-10-01 1998-06-19 Toshiba Corp 半導体装置及び半導体装置製造方法
JP2002094130A (ja) * 1999-01-05 2002-03-29 Nichia Chem Ind Ltd 発光ダイオード及びその製造方法、並びにそれを用いた表示装置
JP2001230453A (ja) * 1999-12-08 2001-08-24 Nichia Chem Ind Ltd Ledランプ及びその製造方法

Also Published As

Publication number Publication date
JPH0410699Y2 (ja) 1992-03-17

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