JPS60931U - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS60931U
JPS60931U JP1983092180U JP9218083U JPS60931U JP S60931 U JPS60931 U JP S60931U JP 1983092180 U JP1983092180 U JP 1983092180U JP 9218083 U JP9218083 U JP 9218083U JP S60931 U JPS60931 U JP S60931U
Authority
JP
Japan
Prior art keywords
conductive plate
main surface
recess
convex portion
semiconductor chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1983092180U
Other languages
English (en)
Inventor
小室　禎佑
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP1983092180U priority Critical patent/JPS60931U/ja
Publication of JPS60931U publication Critical patent/JPS60931U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Wire Bonding (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図は従来のサーデイプパッケージを示す断面図、第
２図は基板部の電極を取り出した従来のサーディツプパ
ッケージを示す断面図、第３図は本考案の一実施例を示
す断面図である。 １・・・・・・セラミック基台、２・・・・・・半導体
チップ、３・・・・・・リード、８・・・・・・合金板
、９・・・・・・ワイヤ。

Claims (1)

    【実用新案登録請求の範囲】
  1. 凹部を有するセラミック基台と、前記凹部の底面に配置
    された導電板と、この導電板の周縁部に一体に設けられ
    た凸部と、前記導電板上に一主面が電気的に接続される
    ようにマウントされた半導体チップとを備え、前記凸部
    の上面と前記半導体チップの他主面の高さがほぼ等しく
    、かつ前記他主面及び凸部の上面からワイヤボンディン
    グにより電極が取り出されることを特徴とする半導体装
    置。
JP1983092180U 1983-06-17 1983-06-17 半導体装置 Pending JPS60931U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1983092180U JPS60931U (ja) 1983-06-17 1983-06-17 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1983092180U JPS60931U (ja) 1983-06-17 1983-06-17 半導体装置

Publications (1)

Publication Number Publication Date
JPS60931U true JPS60931U (ja) 1985-01-07

Family

ID=30222325

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1983092180U Pending JPS60931U (ja) 1983-06-17 1983-06-17 半導体装置

Country Status (1)

Country Link
JP (1) JPS60931U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02297362A (ja) * 1989-05-11 1990-12-07 Asahi Chem Ind Co Ltd 発熱性保温袋

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02297362A (ja) * 1989-05-11 1990-12-07 Asahi Chem Ind Co Ltd 発熱性保温袋

Similar Documents

Publication Publication Date Title
JPS60931U (ja) 半導体装置
JPS59115653U (ja) 絶縁物封止半導体装置
JPS59177949U (ja) 半導体装置
JPS58166041U (ja) 半導体装置
JPS58111958U (ja) 半導体装置のリ−ドフレ−ム
JPS592146U (ja) 電子部品パツケ−ジ
JPS5989551U (ja) 半導体集積回路装置
JPS59125833U (ja) 半導体装置
JPS5933254U (ja) 半導体装置
JPS58109254U (ja) フエ−スダウン接続形チツプ用チツプキヤリヤ−
JPS63187330U (ja)
JPS6142847U (ja) 半導体装置用パツケ−ジ
JPS60106375U (ja) 外部リ−ド端子の取付構造
JPS59132641U (ja) 半導体装置用基板
JPS5996852U (ja) 半導体装置用パツケ−ジ
JPS6094836U (ja) 半導体装置
JPS6142839U (ja) 集積回路パツケ−ジ
JPS6037240U (ja) 混成集積回路
JPS60125754U (ja) 半導体装置
JPS58153449U (ja) 絶縁形半導体装置
JPS58118769U (ja) 印刷配線板
JPS5822741U (ja) 半導体パツケ−ジ
JPH03227041A (ja) 樹脂封止型半導体装置
JPS5837152U (ja) 半導体装置
JPS6037241U (ja) 電子機器