JPS59132641U - 半導体装置用基板 - Google Patents

半導体装置用基板

Info

Publication number
JPS59132641U
JPS59132641U JP1983026646U JP2664683U JPS59132641U JP S59132641 U JPS59132641 U JP S59132641U JP 1983026646 U JP1983026646 U JP 1983026646U JP 2664683 U JP2664683 U JP 2664683U JP S59132641 U JPS59132641 U JP S59132641U
Authority
JP
Japan
Prior art keywords
substrate
semiconductor device
semiconductor devices
semiconductor
covered
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1983026646U
Other languages
English (en)
Inventor
西野　誠一
萩本　英二
Original Assignee
日本電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気株式会社 filed Critical 日本電気株式会社
Priority to JP1983026646U priority Critical patent/JPS59132641U/ja
Publication of JPS59132641U publication Critical patent/JPS59132641U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Packaging Frangible Articles (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図は従来の半導体装置用基板の断面図である。第２
図及び第３図は本考案実施例の半導体装置用基板の断面
図である。第４図は本考案の半導体装置用基板を用いて
実施された半導体装置の断面図である。 なお、図において、１・・・ガラス布基材、２・・・エ
ポキシ樹脂、３・・・導体金属、４・・・ソルダーレジ
スト樹脂、５・・・金属層、６・・・素子、７・・・ボ
ンディングワイヤー、８・・・封止樹脂、９・・・キャ
ップ、である。

Claims (2)

    【実用新案登録請求の範囲】
  1. （１）導電パターンを有する基板上に半導体素子を搭載
    し樹脂モールド部材によって封止して成る半導体装置に
    使用する半導体装置用基板において、半導体素子を搭載
    する収納凹部の内面を金属でおおうことを特徴とする半
    導体装置用基板。
  2. （２）　　前記半導体装置用基板の収納凹部金属部の開
    口上端部を絶縁体でおおうことを特徴とする特許請求の
    範囲第（１）項記載の半導体装置用基板。
JP1983026646U 1983-02-25 1983-02-25 半導体装置用基板 Pending JPS59132641U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1983026646U JPS59132641U (ja) 1983-02-25 1983-02-25 半導体装置用基板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1983026646U JPS59132641U (ja) 1983-02-25 1983-02-25 半導体装置用基板

Publications (1)

Publication Number Publication Date
JPS59132641U true JPS59132641U (ja) 1984-09-05

Family

ID=30157555

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1983026646U Pending JPS59132641U (ja) 1983-02-25 1983-02-25 半導体装置用基板

Country Status (1)

Country Link
JP (1) JPS59132641U (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60111489A (ja) * 1983-11-21 1985-06-17 イビデン株式会社 電子部品塔載用基板およびその製造方法
JPH01125555U (ja) * 1988-02-18 1989-08-28

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5967686A (ja) * 1982-10-12 1984-04-17 イビデン株式会社 プリント配線基板とその製造方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5967686A (ja) * 1982-10-12 1984-04-17 イビデン株式会社 プリント配線基板とその製造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60111489A (ja) * 1983-11-21 1985-06-17 イビデン株式会社 電子部品塔載用基板およびその製造方法
JPH01125555U (ja) * 1988-02-18 1989-08-28

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