JPS5827934U - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS5827934U
JPS5827934U JP1981120544U JP12054481U JPS5827934U JP S5827934 U JPS5827934 U JP S5827934U JP 1981120544 U JP1981120544 U JP 1981120544U JP 12054481 U JP12054481 U JP 12054481U JP S5827934 U JPS5827934 U JP S5827934U
Authority
JP
Japan
Prior art keywords
semiconductor equipment
semiconductor element
integrated circuit
semiconductor
recorded
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1981120544U
Other languages
English (en)
Inventor
松島　政数
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP1981120544U priority Critical patent/JPS5827934U/ja
Publication of JPS5827934U publication Critical patent/JPS5827934U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/681—Shapes or dispositions thereof comprising holes not having chips therein, e.g. for outgassing, underfilling or bond wire passage
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07351—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting
    • H10W72/07353—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting changes in shapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/331—Shapes of die-attach connectors
    • H10W72/334—Cross-sectional shape, i.e. in side view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Die Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図ａ、　　ｂは従来の集積回路装置を示す平面およ
び断面図、第２図ａ、　　ｂは本考案の一実施例による
平面および断面図である。第３図ａ、　　ｂは本考案の
他の実施例による平面および断面図である。 図中、１・・・・・・集積回路素子搭載部、２・・・・
・・導体ペース或は非職導体ペースト、３・・・・・・
集積回路素子、４・・・・・・外部導出リード、５・・
・・・・モールド樹脂、６・・・・・・回路配線、７・
・・・・・ボンディング電極′、８・・・・・・本考案
による凹部、９・・・・・・ワイヤ、１０・・・・・・
集積回路素子の外辺、１１・・・・・・モールド樹脂エ
リアを示す。

Claims (1)

    【実用新案登録請求の範囲】
  1. 半導体素子搭載部に、半導体素子の面積より小さい凹部
    を設けることを特徴とする半導体装置。
JP1981120544U 1981-08-13 1981-08-13 半導体装置 Pending JPS5827934U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1981120544U JPS5827934U (ja) 1981-08-13 1981-08-13 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1981120544U JPS5827934U (ja) 1981-08-13 1981-08-13 半導体装置

Publications (1)

Publication Number Publication Date
JPS5827934U true JPS5827934U (ja) 1983-02-23

Family

ID=29914544

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1981120544U Pending JPS5827934U (ja) 1981-08-13 1981-08-13 半導体装置

Country Status (1)

Country Link
JP (1) JPS5827934U (ja)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6366941A (ja) * 1986-09-08 1988-03-25 Mitsubishi Electric Corp 半導体装置
JPS63147434U (ja) * 1987-03-16 1988-09-28
JPS63147430U (ja) * 1987-03-17 1988-09-28
JPS6457566A (en) * 1987-08-26 1989-03-03 Matsushita Electric Industrial Co Ltd Thermobattery
JPH0343354A (ja) * 1990-06-12 1991-02-25 Mitsubishi Plastics Ind Ltd 取手付プラスチックボトル
JPH0343353A (ja) * 1990-06-12 1991-02-25 Mitsubishi Plastics Ind Ltd プラスチックボトル
JPH0343355A (ja) * 1990-06-12 1991-02-25 Mitsubishi Plastics Ind Ltd 取手付プラスチックブローボトル

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6366941A (ja) * 1986-09-08 1988-03-25 Mitsubishi Electric Corp 半導体装置
JPS63147434U (ja) * 1987-03-16 1988-09-28
JPS63147430U (ja) * 1987-03-17 1988-09-28
JPS6457566A (en) * 1987-08-26 1989-03-03 Matsushita Electric Industrial Co Ltd Thermobattery
JPH0343354A (ja) * 1990-06-12 1991-02-25 Mitsubishi Plastics Ind Ltd 取手付プラスチックボトル
JPH0343353A (ja) * 1990-06-12 1991-02-25 Mitsubishi Plastics Ind Ltd プラスチックボトル
JPH0343355A (ja) * 1990-06-12 1991-02-25 Mitsubishi Plastics Ind Ltd 取手付プラスチックブローボトル

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