JPS5881937U - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS5881937U
JPS5881937U JP17731381U JP17731381U JPS5881937U JP S5881937 U JPS5881937 U JP S5881937U JP 17731381 U JP17731381 U JP 17731381U JP 17731381 U JP17731381 U JP 17731381U JP S5881937 U JPS5881937 U JP S5881937U
Authority
JP
Japan
Prior art keywords
heat sink
semiconductor device
resin
molded
semiconductor equipment
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP17731381U
Other languages
English (en)
Inventor
「あま」田　秀雄
Original Assignee
日本電気ホームエレクトロニクス株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気ホームエレクトロニクス株式会社 filed Critical 日本電気ホームエレクトロニクス株式会社
Priority to JP17731381U priority Critical patent/JPS5881937U/ja
Publication of JPS5881937U publication Critical patent/JPS5881937U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Die Bonding (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図乃至第４図は従来の樹脂封止型半導体装置の各製
造工程におけるリードフレーム部分平面図、第５図は第
４図のリードフレームを分割して得た半導体装置の斜視
図、第６図及び第７図は他の従来例を説明するための各
製造工程におけるリードフレ、−ム部分平面図、第８図
゛及び第９図は本考案の半導体装置の一実施例を説明す
るための各製造工程におけるリードフレーム部分平面図
、第１０図は第９図のリードフレームを分割して得た半
導体装置の斜視図である。 １・・・・・・放熱板、２・・・・・・リニド、６・・
・・・・半導体ペレット、７・・・・・・金属細線、８
・・・・・・外装樹脂材、１１・・・・・・接着テープ
。

Claims (1)

    【実用新案登録請求の範囲】
  1. 放熱板上にマウントした半導体ペレットとリード先端部
    とを金属細線で電気的接続して、放熱板りリード先端部
    を樹脂でモールドした樹脂封止型半導体装置に於て、放
    熱板のベレットマウント側表面に、モールド成形される
    外装樹脂材の両側面に両端が達する接着テープを固着し
    たことを特徴とする半導体装置。
JP17731381U 1981-11-27 1981-11-27 半導体装置 Pending JPS5881937U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17731381U JPS5881937U (ja) 1981-11-27 1981-11-27 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17731381U JPS5881937U (ja) 1981-11-27 1981-11-27 半導体装置

Publications (1)

Publication Number Publication Date
JPS5881937U true JPS5881937U (ja) 1983-06-03

Family

ID=29971080

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17731381U Pending JPS5881937U (ja) 1981-11-27 1981-11-27 半導体装置

Country Status (1)

Country Link
JP (1) JPS5881937U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0278357U (ja) * 1988-12-06 1990-06-15

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0278357U (ja) * 1988-12-06 1990-06-15

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