JPS6045441U - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS6045441U
JPS6045441U JP13621683U JP13621683U JPS6045441U JP S6045441 U JPS6045441 U JP S6045441U JP 13621683 U JP13621683 U JP 13621683U JP 13621683 U JP13621683 U JP 13621683U JP S6045441 U JPS6045441 U JP S6045441U
Authority
JP
Japan
Prior art keywords
semiconductor equipment
main surface
semiconductor device
insulator
semiconductor element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13621683U
Other languages
English (en)
Inventor
勉 鈴木
Original Assignee
日本電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気株式会社 filed Critical 日本電気株式会社
Priority to JP13621683U priority Critical patent/JPS6045441U/ja
Publication of JPS6045441U publication Critical patent/JPS6045441U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Wire Bonding (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図は従来の半導体装置の製造方法を示す断面図、第
２図は従来の半導体装置を示す平面図、第３図は従来の
半導体装置で使用されるリードフレームを示す平面図、
第４図は本考案の実施例の半導体装置で使用されるリー
ドフレームを示す平面図、第５図は第４図の側面図、第
６図は本考案の実施例の半導体装置を示す平面図である
。同図において、 １・・・・・・半導体素子、２・・・・・・金属細線、
３，８・・・・・・リード、４・・・・・・樹脂金型、
５・・・・・・樹脂ケース、６・・・・・・樹脂かぶり
、７・・・・・・溝。

Claims (1)

    【実用新案登録請求の範囲】
  1. 半導体素子と、前記半導体素子が固定され絶縁体でおお
    われたー主面と前記絶縁体から露出させるための他主面
    とを有するリードとを備えた半導体装置において、前記
    他主面には溝が形成されていることを特徴とする半導体
    装置。
JP13621683U 1983-09-02 1983-09-02 半導体装置 Pending JPS6045441U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13621683U JPS6045441U (ja) 1983-09-02 1983-09-02 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13621683U JPS6045441U (ja) 1983-09-02 1983-09-02 半導体装置

Publications (1)

Publication Number Publication Date
JPS6045441U true JPS6045441U (ja) 1985-03-30

Family

ID=30306348

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13621683U Pending JPS6045441U (ja) 1983-09-02 1983-09-02 半導体装置

Country Status (1)

Country Link
JP (1) JPS6045441U (ja)

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