JPS5858346U - 半導体装置 - Google Patents
半導体装置Info
- Publication number
- JPS5858346U JPS5858346U JP1981153727U JP15372781U JPS5858346U JP S5858346 U JPS5858346 U JP S5858346U JP 1981153727 U JP1981153727 U JP 1981153727U JP 15372781 U JP15372781 U JP 15372781U JP S5858346 U JPS5858346 U JP S5858346U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor element
- semiconductor equipment
- semiconductor
- sides
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Wire Bonding (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
め要約のデータは記録されません。
Description
第１図及び第２図は従来及び本案の一実施例を示す横断
面図である。１ 図Φ、１は基板部、２は半導体素子、２ａ。 ２ｂは辺、３はリード、３□〜３６はリード片、４は金
属細線、５は！脂材、５ａは樹脂モールド面である。
面図である。１ 図Φ、１は基板部、２は半導体素子、２ａ。 ２ｂは辺、３はリード、３□〜３６はリード片、４は金
属細線、５は！脂材、５ａは樹脂モールド面である。
Claims (1)
- 基癖部に半導体素子を固定するち共に、ニ端が半導体素
子の辺の近傍に位置するように配設されたリードと半導
体素子の電極、と番金属細線にて接続し、かつ半導体素
子を含む主要部分を樹脂材にてモールド被覆したものに
おいて、上記半導体素子をほぼ象形に形成すると共に、
この半導体素子を基板部に、半導体素子の隣接する２つ
の辺がリードの導出側における樹脂モールド面に対して
９０″より小さい角度を有するように固定したことを特
徴とする半導体装置。 □
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1981153727U JPS5858346U (ja) | 1981-10-15 | 1981-10-15 | 半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1981153727U JPS5858346U (ja) | 1981-10-15 | 1981-10-15 | 半導体装置 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5858346U true JPS5858346U (ja) | 1983-04-20 |
Family
ID=29946335
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1981153727U Pending JPS5858346U (ja) | 1981-10-15 | 1981-10-15 | 半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5858346U (ja) |
-
1981
- 1981-10-15 JP JP1981153727U patent/JPS5858346U/ja active Pending
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