JPS5942044U - 絶縁型半導体装置 - Google Patents

絶縁型半導体装置

Info

Publication number
JPS5942044U
JPS5942044U JP13776482U JP13776482U JPS5942044U JP S5942044 U JPS5942044 U JP S5942044U JP 13776482 U JP13776482 U JP 13776482U JP 13776482 U JP13776482 U JP 13776482U JP S5942044 U JPS5942044 U JP S5942044U
Authority
JP
Japan
Prior art keywords
semiconductor device
isolated semiconductor
pellets
heat dissipation
leads
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13776482U
Other languages
English (en)
Inventor
筧　二朗
Original Assignee
日本電気ホームエレクトロニクス株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気ホームエレクトロニクス株式会社 filed Critical 日本電気ホームエレクトロニクス株式会社
Priority to JP13776482U priority Critical patent/JPS5942044U/ja
Publication of JPS5942044U publication Critical patent/JPS5942044U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Die Bonding (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図は半導体装置の放熱基板の基板連及びリードフレ
ームを示す平面図、第２図は従来の絶縁型半導体装置を
示す断面図、第３図は第２図の平面図、第４図は本考案
の実施例による絶縁型半導体装置を示す断面図、第５図
及び第６図は第１の方法による半導体装置の製造方法を
示す説明図、第７図は第２の方法による半導体装置の製
造方法を示す説明図、第８図は第３の方法による半導体
装置の製造方法を示す説明図である。第９図は第４の方
法による半導体装置の製造方法を示す説明図である。 １・・・放熱基板、４．　４ａ、　　４ｂ、　　４Ｃ−
・・リード、８・・・ペレット、９・・・モールド樹脂
。 第４図 第５図

Claims (1)

  1. 【実用新案登録請求の範囲】 ペレットを固設したリードを放熱基板上に樹脂を介して
    離隔配置すると共に、ペレットを含む主要部分を外装絶
    縁材にて被覆したことを特徴とする絶縁型半導体装置。 　　　　　　　　−
JP13776482U 1982-09-10 1982-09-10 絶縁型半導体装置 Pending JPS5942044U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13776482U JPS5942044U (ja) 1982-09-10 1982-09-10 絶縁型半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13776482U JPS5942044U (ja) 1982-09-10 1982-09-10 絶縁型半導体装置

Publications (1)

Publication Number Publication Date
JPS5942044U true JPS5942044U (ja) 1984-03-17

Family

ID=30309325

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13776482U Pending JPS5942044U (ja) 1982-09-10 1982-09-10 絶縁型半導体装置

Country Status (1)

Country Link
JP (1) JPS5942044U (ja)

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