JPS5956741U - 改良されたペレツト支持体を有する半導体装置 - Google Patents

改良されたペレツト支持体を有する半導体装置

Info

Publication number
JPS5956741U
JPS5956741U JP15285582U JP15285582U JPS5956741U JP S5956741 U JPS5956741 U JP S5956741U JP 15285582 U JP15285582 U JP 15285582U JP 15285582 U JP15285582 U JP 15285582U JP S5956741 U JPS5956741 U JP S5956741U
Authority
JP
Japan
Prior art keywords
semiconductor device
pellet support
improved pellet
support
pellet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15285582U
Other languages
English (en)
Inventor
谷浦　隆
Original Assignee
日本電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気株式会社 filed Critical 日本電気株式会社
Priority to JP15285582U priority Critical patent/JPS5956741U/ja
Publication of JPS5956741U publication Critical patent/JPS5956741U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Wire Bonding (AREA)
  • Die Bonding (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図および第２図は夫々本考案の実施例による半導体
ペレットの実装構造を示す各断面図である。 １・・・・・・半導体ペレット、２・・・・・・Ａｇペ
ースト、３．３′・・・ペレットマウント部、４・・・
・・・外部引き出しリード、５・・・・・・封止樹脂、
６・・・・・・ポリイミド　　　　。 テープ、７・・・ボンディング線。

Claims (1)

    【実用新案登録請求の範囲】
  1. ペレット支持体のペレット搭載面の少くとも周縁部に絶
    縁膜を設け、絶縁膜のない部分においてペレットをペレ
    ット搭載面に固着したことを特徴とする半導体装置。
JP15285582U 1982-10-08 1982-10-08 改良されたペレツト支持体を有する半導体装置 Pending JPS5956741U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15285582U JPS5956741U (ja) 1982-10-08 1982-10-08 改良されたペレツト支持体を有する半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15285582U JPS5956741U (ja) 1982-10-08 1982-10-08 改良されたペレツト支持体を有する半導体装置

Publications (1)

Publication Number Publication Date
JPS5956741U true JPS5956741U (ja) 1984-04-13

Family

ID=30338343

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15285582U Pending JPS5956741U (ja) 1982-10-08 1982-10-08 改良されたペレツト支持体を有する半導体装置

Country Status (1)

Country Link
JP (1) JPS5956741U (ja)

Similar Documents

Publication Publication Date Title
JPS596839U (ja) 半導体装置
JPS5956741U (ja) 改良されたペレツト支持体を有する半導体装置
JPS602848U (ja) 半導体装置
JPS6068652U (ja) 半導体装置
JPS6025159U (ja) リ−ドフレ−ム
JPS58118751U (ja) 半導体装置
JPS5881937U (ja) 半導体装置
JPS6076040U (ja) 半導体装置
JPS5996843U (ja) 半導体装置
JPS6085850U (ja) 半導体装置
JPS5844844U (ja) 半導体装置
JPS5942044U (ja) 絶縁型半導体装置
JPS5945998U (ja) 半導体装置のテ−ピング構体
JPS59189242U (ja) 樹脂封止半導体装置
JPS59107199U (ja) テ−ピング電子部品
JPS5991747U (ja) 半導体装置
JPS58193635U (ja) 半導体装置
JPS5895062U (ja) 半導体装置
JPS6061729U (ja) 半導体装置
JPS6068654U (ja) 半導体装置
JPS6076045U (ja) 樹脂封止半導体装置
JPS5996851U (ja) 半導体装置
JPS59117162U (ja) 樹脂封止型半導体装置
JPS58124960U (ja) 混成集積回路の封止構造
JPS59119040U (ja) 樹脂封止形半導体装置