JPS5844844U - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS5844844U
JPS5844844U JP1981139980U JP13998081U JPS5844844U JP S5844844 U JPS5844844 U JP S5844844U JP 1981139980 U JP1981139980 U JP 1981139980U JP 13998081 U JP13998081 U JP 13998081U JP S5844844 U JPS5844844 U JP S5844844U
Authority
JP
Japan
Prior art keywords
semiconductor equipment
metal foil
semiconductor element
electrode
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1981139980U
Other languages
English (en)
Inventor
高月　邦男
Original Assignee
日本電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気株式会社 filed Critical 日本電気株式会社
Priority to JP1981139980U priority Critical patent/JPS5844844U/ja
Publication of JPS5844844U publication Critical patent/JPS5844844U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図は従来の半導体装置の断面図である。第２図は本
考案の一実施例を示す断面図である。 １・・・・・・金属箔、２・・・・・・ボンディング線
、３・・・・・・金属箔ボンディング電極、４・・・・
・・ボンディング線電極、５・・・・・・ペレット、６
・・・・・・金属箔ボンディング領域、７・・・・・・
ボンディング領域、８・・・・・・ケース、９・・・・
・・絶縁膜で覆われた金テープ。

Claims (1)

    【実用新案登録請求の範囲】
  1. 金属箔が半導体素子上の電極に接続された半導体装置に
    おいて、上記金属箔の上記半導体素子への接続部以外の
    一部または全面が絶縁膜で覆われていることを特徴とす
    る半導体装置。
JP1981139980U 1981-09-21 1981-09-21 半導体装置 Pending JPS5844844U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1981139980U JPS5844844U (ja) 1981-09-21 1981-09-21 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1981139980U JPS5844844U (ja) 1981-09-21 1981-09-21 半導体装置

Publications (1)

Publication Number Publication Date
JPS5844844U true JPS5844844U (ja) 1983-03-25

Family

ID=29933155

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1981139980U Pending JPS5844844U (ja) 1981-09-21 1981-09-21 半導体装置

Country Status (1)

Country Link
JP (1) JPS5844844U (ja)

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