JPS5844844U - 半導体装置 - Google Patents
半導体装置Info
- Publication number
- JPS5844844U JPS5844844U JP1981139980U JP13998081U JPS5844844U JP S5844844 U JPS5844844 U JP S5844844U JP 1981139980 U JP1981139980 U JP 1981139980U JP 13998081 U JP13998081 U JP 13998081U JP S5844844 U JPS5844844 U JP S5844844U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor equipment
- metal foil
- semiconductor element
- electrode
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
- H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
め要約のデータは記録されません。
Description
第1図は従来の半導体装置の断面図である。第2図は本
考案の一実施例を示す断面図である。 1・・・・・・金属箔、2・・・・・・ボンディング線
、3・・・・・・金属箔ボンディング電極、4・・・・
・・ボンディング線電極、5・・・・・・ペレット、6
・・・・・・金属箔ボンディング領域、7・・・・・・
ボンディング領域、8・・・・・・ケース、9・・・・
・・絶縁膜で覆われた金テープ。
考案の一実施例を示す断面図である。 1・・・・・・金属箔、2・・・・・・ボンディング線
、3・・・・・・金属箔ボンディング電極、4・・・・
・・ボンディング線電極、5・・・・・・ペレット、6
・・・・・・金属箔ボンディング領域、7・・・・・・
ボンディング領域、8・・・・・・ケース、9・・・・
・・絶縁膜で覆われた金テープ。
Claims (1)
- 金属箔が半導体素子上の電極に接続された半導体装置に
おいて、上記金属箔の上記半導体素子への接続部以外の
一部または全面が絶縁膜で覆われていることを特徴とす
る半導体装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1981139980U JPS5844844U (ja) | 1981-09-21 | 1981-09-21 | 半導体装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1981139980U JPS5844844U (ja) | 1981-09-21 | 1981-09-21 | 半導体装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5844844U true JPS5844844U (ja) | 1983-03-25 |
Family
ID=29933155
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1981139980U Pending JPS5844844U (ja) | 1981-09-21 | 1981-09-21 | 半導体装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5844844U (ja) |
-
1981
- 1981-09-21 JP JP1981139980U patent/JPS5844844U/ja active Pending
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