JPS6076045U - 樹脂封止半導体装置 - Google Patents
樹脂封止半導体装置Info
- Publication number
- JPS6076045U JPS6076045U JP16694283U JP16694283U JPS6076045U JP S6076045 U JPS6076045 U JP S6076045U JP 16694283 U JP16694283 U JP 16694283U JP 16694283 U JP16694283 U JP 16694283U JP S6076045 U JPS6076045 U JP S6076045U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- resin
- encapsulated semiconductor
- pellet
- mounting substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
め要約のデータは記録されません。
Description
第1図aは従来の樹脂封止半導体装置の封止樹脂を透視
して示す平面図、同図すは同図aのA−A断面図、第2
図aは本考案の一実施例の封止樹脂を透視して示す平面
図、同図すは断面図、第3 “図は第2図に示す半導
体ペレット搭載基板と搭載ペレットを示す部分斜視図、
第4図は本考案の実施例に係る半導体素子搭載基板と搭
載ペレットを示す斜視図である。 1.11.21・・・・・・半導体素子搭載基板、2゜
3・・・・・・リード端子、4・・・・・・半導体ペレ
ット、5・・・・・・接続ワイヤ、6・・・・・・封止
樹脂、12,22・・・・・・ペレット搭載基板の曲げ
縁辺部。
して示す平面図、同図すは同図aのA−A断面図、第2
図aは本考案の一実施例の封止樹脂を透視して示す平面
図、同図すは断面図、第3 “図は第2図に示す半導
体ペレット搭載基板と搭載ペレットを示す部分斜視図、
第4図は本考案の実施例に係る半導体素子搭載基板と搭
載ペレットを示す斜視図である。 1.11.21・・・・・・半導体素子搭載基板、2゜
3・・・・・・リード端子、4・・・・・・半導体ペレ
ット、5・・・・・・接続ワイヤ、6・・・・・・封止
樹脂、12,22・・・・・・ペレット搭載基板の曲げ
縁辺部。
Claims (1)
- 半導体ペレット搭載基板の上に半導体ペレットを搭載し
、前記搭載基板の回路基板への取付面を外部に露出した
まま樹脂封止した半導体装置において、前記搭載基板の
縁辺部を前記ペレットの搭載面側に曲げ前記封止樹脂中
に封じ込んだことを特徴とする樹脂封止半導体装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16694283U JPS6076045U (ja) | 1983-10-28 | 1983-10-28 | 樹脂封止半導体装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16694283U JPS6076045U (ja) | 1983-10-28 | 1983-10-28 | 樹脂封止半導体装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6076045U true JPS6076045U (ja) | 1985-05-28 |
Family
ID=30365357
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP16694283U Pending JPS6076045U (ja) | 1983-10-28 | 1983-10-28 | 樹脂封止半導体装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6076045U (ja) |
-
1983
- 1983-10-28 JP JP16694283U patent/JPS6076045U/ja active Pending
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