JPS6073249U - 樹脂封止半導体装置 - Google Patents

樹脂封止半導体装置

Info

Publication number
JPS6073249U
JPS6073249U JP16623483U JP16623483U JPS6073249U JP S6073249 U JPS6073249 U JP S6073249U JP 16623483 U JP16623483 U JP 16623483U JP 16623483 U JP16623483 U JP 16623483U JP S6073249 U JPS6073249 U JP S6073249U
Authority
JP
Japan
Prior art keywords
resin
semiconductor device
encapsulated semiconductor
sectional area
external lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP16623483U
Other languages
English (en)
Inventor
豊 脇
Original Assignee
日本電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気株式会社 filed Critical 日本電気株式会社
Priority to JP16623483U priority Critical patent/JPS6073249U/ja
Publication of JPS6073249U publication Critical patent/JPS6073249U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図は本考案の一実施例を示した透視図である。 １．２，３・・・・・・外部リード、４・・・・・・チ
ップ、５・・・・・・ボンディングワイヤ、６・・・・
・・樹脂。

Claims (1)

    【実用新案登録請求の範囲】
  1. 樹脂封止半導体装置において、外部導出用リードの一部
    の断面積が小さく、且つ前記外部導出用リードの断面積
    が小さくなった部分は樹脂で封止されることなく露出し
    ていることを特徴とする樹脂封止半導体装置。
JP16623483U 1983-10-27 1983-10-27 樹脂封止半導体装置 Pending JPS6073249U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16623483U JPS6073249U (ja) 1983-10-27 1983-10-27 樹脂封止半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16623483U JPS6073249U (ja) 1983-10-27 1983-10-27 樹脂封止半導体装置

Publications (1)

Publication Number Publication Date
JPS6073249U true JPS6073249U (ja) 1985-05-23

Family

ID=30363982

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16623483U Pending JPS6073249U (ja) 1983-10-27 1983-10-27 樹脂封止半導体装置

Country Status (1)

Country Link
JP (1) JPS6073249U (ja)

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