JPS59176151U - 樹脂封止型半導体装置 - Google Patents
樹脂封止型半導体装置Info
- Publication number
- JPS59176151U JPS59176151U JP7057283U JP7057283U JPS59176151U JP S59176151 U JPS59176151 U JP S59176151U JP 7057283 U JP7057283 U JP 7057283U JP 7057283 U JP7057283 U JP 7057283U JP S59176151 U JPS59176151 U JP S59176151U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- semiconductor device
- encapsulated semiconductor
- inner lead
- sealed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Wire Bonding (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
め要約のデータは記録されません。
Description
第１図は従来の樹脂封止型半導体装置を示す断面図、第
２図は本考案の一実施例を示す断面図である。 １２・・・・・・半導体チップ、１３・・・・・・リー
ド、１４・・・・・・ワイヤ、１５・・・・・・樹脂体
、１６・・・・・・屈曲部。
２図は本考案の一実施例を示す断面図である。 １２・・・・・・半導体チップ、１３・・・・・・リー
ド、１４・・・・・・ワイヤ、１５・・・・・・樹脂体
、１６・・・・・・屈曲部。
Claims (1)
- 半導体チップ、インナーリード及びこの半導体チップと
インナーリードとを接続するワイヤが樹脂封止され、前
記インナーリードが外部リードに接続された樹脂封止型
半導体装置において、前記・インナーリードが屈曲した
形状を有していることを特徴とする樹脂封止型半導体装
置。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7057283U JPS59176151U (ja) | 1983-05-13 | 1983-05-13 | 樹脂封止型半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7057283U JPS59176151U (ja) | 1983-05-13 | 1983-05-13 | 樹脂封止型半導体装置 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS59176151U true JPS59176151U (ja) | 1984-11-24 |
Family
ID=30200725
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7057283U Pending JPS59176151U (ja) | 1983-05-13 | 1983-05-13 | 樹脂封止型半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59176151U (ja) |
-
1983
- 1983-05-13 JP JP7057283U patent/JPS59176151U/ja active Pending
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