JPS5963441U - 樹脂封止集積回路 - Google Patents
樹脂封止集積回路Info
- Publication number
- JPS5963441U JPS5963441U JP1982157944U JP15794482U JPS5963441U JP S5963441 U JPS5963441 U JP S5963441U JP 1982157944 U JP1982157944 U JP 1982157944U JP 15794482 U JP15794482 U JP 15794482U JP S5963441 U JPS5963441 U JP S5963441U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- integrated circuit
- encapsulated integrated
- abstract
- encapsulated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
め要約のデータは記録されません。
Description
第１図は従来のＤＩＰタイプの樹脂封止回路の断面図、
第２図は本考案の実施例断面図、である。 なお図において、１・・・樹脂、２・・・集積回路チッ
プ、３・・・外部リード、４・・・ボンディングワイヤ
、である。
第２図は本考案の実施例断面図、である。 なお図において、１・・・樹脂、２・・・集積回路チッ
プ、３・・・外部リード、４・・・ボンディングワイヤ
、である。
Claims (1)
- 樹脂封止デュアルインラインパッケージ形の集積回路に
おいて、チップを取り囲む外部リードを樹脂内部にて凹
状に折り曲げ、パッケージの側面より取り出されること
を特徴とする樹脂封止集積回路。 “−
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1982157944U JPS5963441U (ja) | 1982-10-19 | 1982-10-19 | 樹脂封止集積回路 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1982157944U JPS5963441U (ja) | 1982-10-19 | 1982-10-19 | 樹脂封止集積回路 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5963441U true JPS5963441U (ja) | 1984-04-26 |
Family
ID=30348077
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1982157944U Pending JPS5963441U (ja) | 1982-10-19 | 1982-10-19 | 樹脂封止集積回路 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5963441U (ja) |
-
1982
- 1982-10-19 JP JP1982157944U patent/JPS5963441U/ja active Pending
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