JPS59117166U - 樹脂封止型半導体装置 - Google Patents

樹脂封止型半導体装置

Info

Publication number
JPS59117166U
JPS59117166U JP1050483U JP1050483U JPS59117166U JP S59117166 U JPS59117166 U JP S59117166U JP 1050483 U JP1050483 U JP 1050483U JP 1050483 U JP1050483 U JP 1050483U JP S59117166 U JPS59117166 U JP S59117166U
Authority
JP
Japan
Prior art keywords
resin
semiconductor device
lead wire
encapsulated semiconductor
sealed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1050483U
Other languages
English (en)
Inventor
中村　忠昭
Original Assignee
新電元工業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 新電元工業株式会社 filed Critical 新電元工業株式会社
Priority to JP1050483U priority Critical patent/JPS59117166U/ja
Publication of JPS59117166U publication Critical patent/JPS59117166U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図は従来構造図、第２図、第３図は本考案の実施例
構造を示す断面図である。図において、１．１′はリー
ド線、ａはそのハンダ加工部分、ｂは素材表面部分、Ｃ
は表面加工部分、２はケース、３．３′は接続子、４は
封止樹脂、５は半導体素子（チップ）である。

Claims (1)

    【実用新案登録請求の範囲】
  1. 半導体素子に直接もしくは接続子を介してリード線が接
    続され、前記半導体素子及びリード線の一部を樹脂封止
    してなる樹脂封止型半導体装置において、前記リード線
    の樹脂封止される部分はほぼリード線素子表面が露出さ
    れ、又樹脂からの導出部分はリード線素材表面にハンダ
    加工されていなる樹脂封止型半導体装置。
JP1050483U 1983-01-27 1983-01-27 樹脂封止型半導体装置 Pending JPS59117166U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1050483U JPS59117166U (ja) 1983-01-27 1983-01-27 樹脂封止型半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1050483U JPS59117166U (ja) 1983-01-27 1983-01-27 樹脂封止型半導体装置

Publications (1)

Publication Number Publication Date
JPS59117166U true JPS59117166U (ja) 1984-08-07

Family

ID=30141938

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1050483U Pending JPS59117166U (ja) 1983-01-27 1983-01-27 樹脂封止型半導体装置

Country Status (1)

Country Link
JP (1) JPS59117166U (ja)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5143078A (ja) * 1974-10-09 1976-04-13 Nippon Electric Co Handotaisochi
JPS57128947A (en) * 1981-02-04 1982-08-10 Yamagata Nippon Denki Kk Semiconductor device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5143078A (ja) * 1974-10-09 1976-04-13 Nippon Electric Co Handotaisochi
JPS57128947A (en) * 1981-02-04 1982-08-10 Yamagata Nippon Denki Kk Semiconductor device

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